| | | Aifantis, E.C. | | Aristotle University of Exploring, Greece | | Exploring the micro-nano mechanics transition: Theory and applications | | | | Albaut, G.N. | | The Novosibirsk State University of Architecture and Civil Engineering (NGASU), Novosibirsk, Russia | | Study of nonlinear fracture problems in metal elements by photoelastic coating method | | | | Albrecht, H.-J. | | Siemens AG, Berlin, Germany | | Technical reliability of miniaturized lead-free solder interconnects | | | | Alsem, D.H.1, Boyce, B.L.2, Stach, E.A.3, Ritchie, R.O1,4 | | 1 Lawrence Berkeley National Laboratory, Berkeley 2 Sandia National Laboratories, Albuquerque 3 Purdue University, West Lafayette 4 University of California, Berkeley, USA | | High-cycle fatigue of micron-scale Silicon structural films for MEMS applications | | | | Altmann, F., Graff, A., Simon, M. | | Fraunhofer IWMH, Halle/S., Germany | | Advanced focused ion beam techniques for process control of sub 100nm technologies | | | | Alush, H., Katz, Y. | | Negba Institute, Beer Sheva, Israel | | Fatigue crack initiation stage: Reflection on small volume segment applications | | | | Aresu, S., Kanert, W., Pufall, R., Goroll, M. | | Infineon Technologies AG, Neubiberg, Germany | | Latent effect of Backend Of Line (BEOL) plasma cleaning process on silicon gate oxide reliability | | | | Auersperg, J.1,2, Shirangi, M.H.3,1, Michel, B.1 | | 1 Fraunhofer IZM, Micro Materials Center, Berlin 2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin 3 Robert Bosch GmbH, Reutlingen, Germany | | DOE and robust design of electronics devices in terms of fracture, delamination and thermo-mechanical fatigue | | | | Auerswald, E., Walter, H., Wittler, O., Gollhardt, A., Michel, B. | | Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | Estimation of crack propagation through mismatched interfaces due to thermally induced stress | | | | Badri Ghavifekr, H. | | Sahand University of Technology, Iran | | Experimental characterization of thin Copper foils | | | | Bagdahn, J.1, Allen, R.2, Marshall, J.2, Read, D.3, Baylies, W.A.4, Turner, K.5 | | 1 Fraunhofer IWMH, Halle/S., Germany 2 National Institute of Standards and Technology NIST, Gaithersburg 3 National Institute of Standards and Technology NIST, Boulder 4 BayTech Group, Weston 5 University of Wisconsin-Madison, Madison, USA | | Measurement of fracture toughness of wafer-bonded silicon using the new SEMI standard for micro-Chevron-samples | | | | Bahr, D.F., Kennedy, M. S., Yeager, J. D. | | Washington State University, Pullman, USA | | Adhesion of noble metals for electrodes in MEMS | | | | Bailey, C. | | University of Greenwich, U.K. | | Multi-physics analysis as a key enabler for MicroNanoReliability | | | | Bajpai, R. | | Rani Durgavati University, Jabalpur, India | | Mechanical characterization of bio-compatible materials | | | | Banks-Sills, L., Eliaz, N., Krylov, S., Fourman, V., Ashkenazi, D., Inberg, A., Eliasi, R., Fiodorov, J. | | Tel Aviv University, Israel | | Determination of mechanical properties of micro-sized specimens | | | | Barabanenkov, M.Yu., Barabanenkov, Yu.N. | | Russian Academy of Science, Chernogolovka, Russia | | Distant- and interference-spatial spectroscopy of evanescent waves | | | | Barbosa, N., Read, D., Keller, R., Geiss, R. | | National Institute of Standards and Technology NIST, Boulder, USA | | An electrical approach to measuring reliability and mechanical properties of interconnects | | | | Bauer, M.1,2, Vieth, S.1,2, Uhlmann, M.2, Landeck, S.1 | | 1 Fraunhofer IZM, Teltow, 2 BTU Cottbus, Cottbus, Germany | | Promising filler for electric-packaging materials: ?-eucryptite | | | | Bechmann, F. | | BMW Bayerische Motoren Werke AG, Munich, Germany | | Microstructural materials modelling of particle reinforced light metals | | | | Benfdila, A. | | The University M. Mammeri, Tizi-Ouzou, Algeria | | Recent advances in nanoMOSFET technology | | | | Bennemann, S.1, Altmann, F.1, Graff, A.1, Schischka, J.1, Petzold, M.1, Theuss, H.2, Dangelmaier, J.2, Pressel, K.2 | | 1 Fraunhofer IWMH, Halle/S. 2 Infineon Technologies AG, Regensburg, Germany | | High resolution investigation of intermetallic formation and nano-reliability of SnAg2.5Cu0.7 solder comparing a wafer level package and a board-interconnect application | | | | Berka, L. | | Czech Technical University in Prague, Czech Republic | | On a model and a theory of granulation processes | | | | Bertholet, Y.1,2, Olbrechts, B.1,3, Raskin, J.-P.1,3, Pardoen, T.1,2 | | 1 Université catholique de Louvain, CeRMiN 2 Université catholique de Louvain, IMAP 3 Université catholique de Louvain, EMIC, Belgium | | Molecular bonding aided by dissipative interlayers | | | | Biesheuvel, M.1, van Soestbergen, M.1, Rongen, R.2, Ernst, L.J.3, Zhang, G.Q.2,3 | | 1 Netherlands Institute of Metals Research NIMR, Delft 2 NXP Semiconductors, Nijmegen 3 Delft University of Technology, The Netherlands | | A multi-physics failure model for aluminum bondpad corrosion due to ions, humidity and applied voltage | | | | Bochow-Ness, O., Fujino, M., Middendorf, A., Reichl, H. | | Technical University of Berlin, Germany | | Condition indicators for reliablity monitoring of microsystems | | | | Böffel, C., Müller, J., Müller, R., Bauer, M. | | Fraunhofer IZM, Teltow, Germany | | The Calcium test: A versatile tool for the investigation of barrier properties of polymers and reliability tests of encapsulation processes | | | | Böhme, B., Wolter, K.-J. | | Dresden University of Technology, Germany | | Characterization of organic substrate materials for high temperature automotive applications | | | | Brämer, B. | | Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany | | Wafer bow caused by intrinsic stress in ALD films | | | | Brocke, H. | | Fraunhofer Institut für Holzforschung, Wilhelm-Klauditz-Institut,Braunschweig, Germany | | A finite element based comparison of the reliability of Cu interconnects with CF polymer and SiLKTM as low k dielectrics | | | | Brunschwiler, T., Rothuizen, H., Kloter, U., Linderman, R., Wälchli, R., Michel, B. | | IBM Research GmbH, Zurich Research Laboratory, Rüschlikon, Switzerland | | Interlayer heat transfer for vertically integrated packages | | | | Caers, J.F.J.M.1, Zhao, X.J.1, de Vries, J.W.C.1, Wong, E.H.2 | | 1Philips Applied Technologies, Eindhoven, The Netherlands 2Institute of Microelectronics (IME), Singapore, Singapore | | Highly accelerated reliability tests for conductive adhesive interconnects | | | | Cambruzzi, A., Dual, J. | | ETH Swiss Federal Institute of Technology Zürich, Switzerland | | Near threshold fatigue crack growth investigation on notched micro-resonator | | | | Capková, P. | | Technical University of Ostrava, Czech Republic | | Molecular modeling combined with experiment in analysis and characterization of organo-inorganic hybrid nanostructures | | | | Carpinteri, A., Pugno, N. | | Politecnico di Torino, Italy | | Strength of hierarchical materials | | | | Chen, J., Lai, Y.-S. | | Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung, Taiwan | | First-principles calculations of elastic properties of Cu-Sn crystalline phases | | | | Corradi, U., Weippert, C., Villain, J. | | University of Applied Sciences Augsburg, Germany | | EBSD measurements in small lead-free solder joints | | | | Coulombier, M.1,2, Gravier, S.1,2, Pardoen, T.1,2, Fabregue, D.3, Andre, N.1,2, Houri, S.1,2, Raskin, J.-P.1,2 | | 1 Université catholique de Louvain 2 Université catholique de Louvain, CeRMiN 3 INSA-Institute National of Applied Sciences of Lyon, France | | New concept of multipurpose on-chip nanomechanical laboratory | | | | Cugnoni, J.1, Botsis, J.1, Janczak-Rusch, J.2 | | 1 LMAF/EPFL, Lausanne 2 EMPA, Corrosion and Materials Integrity, Dübendorf, Switzerland | | Constraining & size effects on the tensile and shear elasto-plastic behavior of lead free solder joints | | | | Dauskardt, R. | | Stanford University, Stanford, USA | | Fracture and reliability in Cu/low-k interconnect structures: Role of process variables and packaging | | | | de Vreugd, J., Jansen, K.M.B., Bohm, C. | | Delft University of Technology, The Netherlands | | Modeling the effect of physical aging on viscoelastic properties of a molding compound | | | | Dermitzaki, E.1, Bauer, J.1, Walter, H.2, Wunderle, B.1, Michel, B.1, Reichl, H.3 | | 1 Fraunhofer IZM, Micro Materials Center, Berlin 2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin 3 Technical University of Berlin, Germany | | Molecular dynamics simulation and mechanical characterisation of epoxy resins examined at different temperatures | | | | Deromelaere, G., Felten, F., Hiller, P., Knoblauch, V. | | Robert Bosch GmbH, Stuttgart, Germany | | Reliability assessment of brittle materials – a new approach to improve prediction quality | | | | Dowhan, L.1, Wymyslowski, A.1, Dudek, R.2 | | 1 Wroclaw University of Technology, Poland 2 Fraunhofer IZM, Micro Materials Center, Chemnitz , Germany | | Multi-objective decision support system in numerical reliability optimization of modern electronic packaging | | | | Dresbach, C.1, Schischka, J.1, Knoll, H.1, Seifert, T.2, Müller, T.3, Petzold, M.1 | | 1 Fraunhofer IWMH, Halle/S. 2 Fraunhofer IWM, Freiburg 3 W.C. Heraeus GmbH, Hanau, Germany | | Local mechanical deformation properties of gold bonding wires and free air balls | | | | Dreßler, M.1, Liebing, G.1, Becker, K.-F.2, Wunderle, B.2, Reichl, H.3 | | 1 Robert Bosch GmbH, Waiblingen 2 Fraunhofer IZM, Berlin 3 Technical University of Berlin, Germany | | Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections | | | | Drumea, A., Vasile, A. | | Politehnica University Bucharest, Romania | | Efficient and reliable communications in industrial control and mechatronic systems | | | | Drumea, A., Vasile, A., Vulpe, V. | | Politehnica University Bucharest, Romania | | Safety and reliability aspects in design and construction of a infusion pump medical system | | | | Dudek, R., Faust, W., Döring, R., Michel, B. | | Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany | | In-situ microscopic studies on microstructural degradation and FE analyses for miniaturized SAC solder joints under thermal test- and field cycling | | | | Ebert, M., Bagdahn, J. | | Fraunhofer IWMH, Halle/S., Germany | | Numerical reliability assessment of brittle MEMS structures based on experiments, size effect theory and probabilistic sampling | | | | Eisenberg, W., Renner, K., Boram, R. | | Arnold-Sommerfeld-Gesellschaft, Leipzig, Germany | | Simulation of big complex systems with nano cellular automata swarms and their reliability | | | | Eremeev, V., Indeitsev, D., Ivanova, E., Morozov, N., Semenov, B. | | RAS, St. Petersburg, Russia | | Mechanics and nanomechanics | | Falat, T., Friedel, K. | | Wroclaw University of Technology, Poland | | TSV constraints related to temperature excursion, pressure during moulding and materials used | | | | Farley, D.1, Zhou, Y.1, Dasgupta, A.1, Caers, J.F.J.M.2, de Vries, J.W.C.2 | | 1 The University of Maryland, CALCE, College Park , USA 2 Philips Applied Technologies, Eindhoven, The Netherlands | | Reliability of RF SiP assemblies under mechanical loads | | | | Faust, W., Dudek, R., Poller, T., Michel, B. | | Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany | | Microstructure of damaged solder | | | | Fecht, H. | | University of Ulm / Forschungszentrum Karlsruhe, Germany | | Properties and applications of nanocrystalline CVD-grown diamond, MicroDevice fabrication and microreliability | | | | Feng, W., Frémont, H., Verdier, F., Plano, B. | | University Bordeaux I, IMS Laboratory, ENSEIRB, France | | Simple analytical model for thermally-induced warpage of PoP | | | | Ferraris, E.1, Pagano, C.2, Zerbini, S.3, Fassi, I.2, Reynaerts, D.1 | | 1 Katholieke Universiteit Leuven, Belgium 2 National Research Council (CNR-ITIA), Milano 3 STMicroelectronics, Cornaredo, Italy | | Development of a multi body based 1 DoF rotary MEMS | | | | Fiedler, S., Zwanzig, M., Schmidt, R., Scheel, W. | | Fraunhofer IZM, Berlin, Germany | | Development and evaluation of microelectronic packaging concepts based on submicron wires | | | | Flaemig, J., Hammacher, J., Fuelle, A., Saupe, J., Zahn, W., Grimm, J | | University of Applied Sciences Zwickau, Germany | | Reliability, tribology and mechanical properties of SU-8-layers for mechanical applications | | | | Foucher, B. | | EADS France, Suresnes, France | | The reliability issues of electronics in aeronautics | | | | Gaspar, J.C., Paul, O. | | University of Freiburg, IMTEK, Germany | | Reliability of LPCVD Silicon Nitride as a structural material for MEMS applications | | | | Geißler, U.1, Schneider-Ramelow, M.2, Reichl, H.1 | | 1 Technical University of Berlin 2 Fraunhofer IZM, Berlin, Germany | | Micro-nanostructural investigations of AlSi1 bondcontacts | | | | Georgakos, G., Huber, P., Ruckerbauer, F. | | Infineon Technologies AG, Neubiberg, Germany | | Cosmic ray induced single-, multi-bit and latch-up failure mechanisms at sub 90nm embedded SRAMs for system-in-chip applications | | | | Gerberich, W.W., Mook W.M., Beaber, A.R. | | University of Minnesota, Minneapolis, USA | | Nanoscale strength and reliability probe | | Gerdes, H., Gatzen, H.H. | | Leibniz University Hanover, Germany | | Focused ion beam core hole drilling for stress detection in thin films | | | | Gesang, T., Rodewald, R. | | Fraunhofer IFAM, Bremen, Germany | | Optimisation of micro stress in adhesive bonds in electro optics and micro optics | | | | Geßner, T. | | Chemnitz University of Technology / Fraunhofer IZM, Chemnitz, Germany | | Smart systems integration and reliability | | | | Getsov, L.1, Semenov, A.1, Staroselsky, A.2 | | 1 St.-Petersburg State Polytechnical University, Russia 2 Pratt and Whitney, East Hartford, USA | | A new TMF failure criterion for single crystal superalloys | | | | Ghisi, A.1, Fachin, F.1, Mariani, S.1, Corigliano, A.1, Zerbini, S.2 | | 1 Politecnico di Milano 2 STMicroelectronics, Cornaredo, Italy | | Multi-scale analysis of polysilicon MEMS subject to drop impacts | | | | Gieser, H. | | Fraunhofer IZM, München, Germany | | Electrostatic challenges and countermeasures for devices with MicroNanoDimensions | | | | Gitis, N., Hermann, I., Khosla, V. | | CETR, Campbell, USA | | Non-destructive nano-mechanical reliability and defectivity characterization of thin films | | | | Glickman, E.E. | | Tel Aviv University, Israel | | Capillary force driven , surface diffusion controlled degradation of metal nano-electrodes: Upfront reliability assessment | | | | Goldstein, R.V., Shushpannikov, P.S., Ustinov, K.B. | | Institute for Problems in Mechanics of RAS, Moscow | | Modeling of formation of systems SiO2 precipitate - dislocation loops in Silicon wafers | | | | Gollhardt, A., Michel, B. | | Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | Focused Ion Beam (FIB) as an analytical tool in micro- and nanotechnology | | | | Goroll, M., Pufall, R., Aresu, S., Kanert, W. | | Infineon Technologies AG, Neubiberg, Germany | | Reliability of bipolar transistors – new aspects for lifetime determination in automotive applications | | | | Hanke, Krüger | | Fraunhofer IZFP, Dresden, Germany | | Methods of micro and nano CT for the characterization of microcomponents | | | | Hauck, T., Schmadlak, I. | | Freescale Halbleiter Deutschland GmbH, Munich, Germany | | Procedure to asses interface cracks in CMOS BEOL stack up designs with Finite Element simulation and energy based fracture mechanics approach | | | | Hecht, S., Hoffmann, M. | | Ilmenau University of Technology, Germany | | Reliability of “Black Silicon” for MEMS packaging | | | | Heimann, M.1, Meißner, F.2, Endler, I.2, Schönecker, A.2, Wolter, K.-J.1 | | 1 Dresden University of Technology 2 Fraunhofer IKTS, Dresden, Germany | | Nano-scaled functional layer for current and heat transportation in electronics packaging | | | | Heino, P. | | Tampere University of Technology, Finland | | Simulations of nanoscale thermal conduction | | | | Hertl, M., Weidmann, D., Lecomte, J.-C. | | INSIDIX, Seyssins, France | | Reliability improvement by advanced failure assessment strategy | | | | Heuer, H.1, Meyendorf, N.1, Oppermann, M.2, Wolter, K.-J.2 | | 1 Fraunhofer IKTS, Dresden 2 Dresden University of Technology, Dresden, Germany | | The Center for Non-destructive Nano Evaluation (nanoEVA), a new research facility in Dresden | | | | Hirsch, S., Majcherek, S., Leneke, T., Schmidt, B. | | Otto-von-Guericke-Universität Magdeburg, Germany | | A Silicon test chip for thermomechanical analysis of MEMS packagings | | | | Hocheng, H., Hung, J.-N. | | National Tsing Hua University, Hsinchu, Taiwan | | Bending fatigue test of Polysilicon microcantilever beams | | | | Huang, Z., Conway, P. | | Loughborough University, UK | | Modelling of interfacial intermetallic compounds in the applications of very fine lead-free solder interconnections | | | | | | Ikehara, T.1, Tsuchiya, T.2 | | 1 National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba 2 Kyoto University, Japan | | Parallel fatigue test of micromachined single crystal silicon using lateral resonating device | | | | Ito, H., Suzuki, K., Miura, H. | | Tohoku University, Sendai, Japan | | Stress-induced anisotropic diffusion of component atoms in Ni-base superalloy during creep damage | | | | Jacob, P. | | EMPA, Materials Science & Technology, Dübendorf, Switzerland | | Polysilicon extensions and etching residues as a reliability risk | | | | Jansen, K.M.B., Patel, M., Ernst, L.J., Bohm, C. | | Delft University of Technology, The Netherlands | | Transient bulk modulus of a novolac epoxy resin | | | | Kahle, O.1,2, Uhlig, C.2, Bauer, M.1,2 | | 1 Brandenburg Technical University Cottbus 2 Fraunhofer IZM, Teltow, Germany | | Thermophysical characterisation of sub-µm polymer layers by Nano-TMA/TGA/DVS | | | | Kämpfe, A. | | Witzenmann GmbH, Pforzheim, Germany | | Micro-size metal bellows as an example for miniaturisation and reliability of mechanical components | | | | Kämpfe, B.1, Luczak, F.2, Zimny, F.3, Petrick, H.3, Böhme, H.4 | | 1 Fraunhofer IZM, Micro Materials Center, Berlin 2 Technical University of Berlin 3 Petrick GmbH, Bad Blankenburg 4 FPM Holding GmbH, Freiberg, Germany | | Possibilities and application fields of energy-dispersive X-ray diffraction for the investigation of microsystems | | | | Kalaitzidis, P.A., Zacharopoulos, D.A., Gdoutos, E.E. | | Democritus University of Thrace, Xanthi, Greece | | Theoretical and experimental study of failure of foam-core sandwich beam under three-point bending | | | | Kanert, W., Pufall, R. | | Infineon Technologies AG, Neubiberg, Germany | | Physics of failure and qualification methods for semiconductor components in harsh environments | | | | Kaulfersch, E.1, Rzepka, S.2, Ganeshan, V.2, Müller, A.2 , Michel, B.1 | | 1 Fraunhofer IZM, Micro Materials Center Berlin and Chemnitz, 2 Qimonda Dresden GmbH & Co OHG, Dresden, Germany | | Fast shear testing and FEM simulations for determination of dynamic mechanical behavior of SnAgCu BGA solder joints | | | | Keller, J.1, Gollhardt, A.2, Vogel, D.2, Michel, B.2 | | 1 AMIC GmbH, Berlin 2 Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | Nanodeformation measurements for reliability studies of nanosystems | | | | Khatibi, G.1, Zimprich, P.1, Wroczewski, W.1, Groeger, V.1, Weiss, B.1, Licht, T.2 | | 1 University of Vienna, Austria 2 Infineon Technologies AG, Warstein, Germany | | Quality assessment of interconnects by an accelerated shear fatigue testing method | | | | Khromov, A., Bukhanko, A., Kocherov, E., Fedorchenko, D. | | Samara State Aerospace University named after S.P. Korolyov, Russia | | Deformation states and fracture characteristics of plastic materials | | | | Kim, J.Y., Choi, H.J., Lee, S.J., Kim, K.S., Lee, H.J. | | Korea Institute of Machinery & Materials, Yuseong-gu Daejeon, Korea | | Vertical bellows shape micro contact probe with variable stiffness | | | | Klein, M.1, Oppermann, H.1, Hutter, M.1, Fritzsch, T.1, Engelmann, G.1, Dietrich, L.1, Wolf, J.1, Brämer, B.2, Dudek, R.2, Reichl, H.1 | | 1 Fraunhofer IZM, Berlin 2 Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany | | Reliability investigation of large GaAs pixel detectors flip chip bonded on Si readout chips | | | | Knoll, H.1, Berthold, L.1, Klengel, R.1, Petzold, M.1, Rudolf, F.2, Müller, T.3 | | 1 Fraunhofer IWMH, Halle/S. 2 Dresden University of Technology 3 W.C. Heraeus GmbH, Hanau, Germany | | Quality and reliability investigations of Au bonding wires coated with Al nanofilms | | | | Koglin, J. | | FRT Fries Research & Technology GmbH, Bergisch Gladbach, Germany | | Quality assurance and production control of MEMS and wafers with multi-sensor metrology systems | | | | Kohl, R., Trageser, H., Schuch, B. | | Conti Temic microelectronic GmbH, Nuremberg, Germany | | Reliability aspects of automotive electronic control units viewed from a TIER1 supplier perspective | | | | Köhler, B., Bendjus, B. | | Fraunhofer IZFP, Dresden, Dresden, Germany | | Test samples for micro- and nano- non-destructive evaluation | | | | Kornev, V. M. | | Lavrentyev Institute of Hydrodynamics, Novosibirsk, Russia | | Two-scale model of crack propagation in high stress fatigue | | | | Korobeynikov, S.N.1, Babichev, A.V.2 | | 1 Lavrentyev Institute of Hydrodynamics, Novosibirsk 2 Institute of Geology and Mineralogy, Novosibirsk, Russia | | Stability criteria for processes of nanostructures deformation | | | | Kosobutskyy, P.S.1, Kosobutskyy, Ya.P.1, Kushnir, O.P2. | | 1 Lviv Polytechnic National University, Lviv 2 Lviv State Agrarian University, Dubljany, Ukraine | | About a principle of the interferometric sensor creation | | | | Kozhushko, V., Hess, P. | | University of Heidelberg, Germany | | Nanoscopic mechanism of mode I and mode II fracture of Silicon | | | | Kozuki, K.1, Omiya, M.2, Kishimoto, K.1 | | 1 Tokyo Institute of Technology 2 Keio University, Yokohama, Japan | | Delamination behavior of hard film on soft substrate during nano- and micro-indentation | | | | Krause, M., Graff, A. , Altmann, F. | | Fraunhofer IWMH, Halle/S., Germany | | Determination of residual stress in Silicon using electron backscatter diffraction | | | | Kreyßig, K.4, Krahn, L.1, Auersperg, J.2, Zerna, T.3, Oppermann, M.3, Seiler, B.4, Keller, J.5, Ritzendorf, S.6, Scholz, G.6 , Mathiak, G.7, Schmidt, T.7, Magh, M.8 | | 1 Fraunhofer IZM Paderborn, 2 Fraunhofer IZM Berlin/Chemnitz, Micro Materials Center, 3 TU Dresden, Zentrum für mikrotechnische Produktion, 4Chemnitzer Werkstoffmechanik GmbH, 5 AMIC Berlin, 6 Creos Lernideen Bielefeld,7 ZAVT GmbH Lippstadt, 8 Magh & Boppert Objektorientierte Softwareentwicklung Paderborn | | BIZAM - Next generation consulting system for thermo-mechanical analyses in microelectronics and MEMS technologies | | | | Kübel, C.1, Lee, T.-C.2, Su, D.2, Luo, J.-S.3, Russell, J.3 | | 1 Fraunhofer IFAM, Bremen, Germany 2 Taiwan Semiconductor Manufacturing Company, Ltd., 3 Inotera Memories, Physical Failure Analysis Department, Taiwan | | Application of electron tomography for semiconductor device analysis | | | | Kusnezoff, M.1, Trofimenko, N.1, Mosch, S.1, Beckert, W.1, Graff, A.2, Altmann, F.2 | | 1 Fraunhofer IKTS, Dresden 2 Fraunhofer IWMH, Halle/S., Germany | | Stability of uLSM/8YSZ-interface in the composite cathode at high current densities | | | | Lang, U., Dual, J. | | ETH Swiss Federal Institute of Technology Zürich, Switzerland | | Method for observing crack propagation in thin polymer films | | | | Lavu, S.1,3, Muratet, S.2, Fourniols, J.Y.2, Abraham, E.1, Desmulliez, M.1, De Wolf, I.3 | | 1 Hariot-Watt University, Edinburgh, UK 2 LAAS-CNRS 7, Toulouse, France 3 IMEC, Leuven, Belgium | | Failure modes and mechanisms in MEMS thermal actuators | | | | Lee, J., Cho, C.S., Morris, J.E. | | Portland State University, USA | | Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed circuit boards | | | | Lempidaki, D.E., Kubler, R.F., Busso, E.P. O'Dowd, N.P., Nikbin, K. | | Imperial College, London, UK | | Development of a photogrammetric technique to determine crack tip strain fields at elevated temperatures | | | | Li, Q.1,2,3, Goosen, H.2, van Keulen, F.2, van Beek, J.3, Zhang, G.Q.2,3 | | 1 Netherlands Institute of Metals Research NIMR, Delft 2 Delft University of Technology 3 NXP Semiconductor, Eindhoven, The Netherlands | | Assessment of testing methodologies for thin-film vacuum MEMS packages | | | | Liu, J. | | Chalmers University of Technology, Gothenburg, Sweden, and Shanghai University, SMIT Center, China | | Development of materials and processes for nanoelectronics packaging and interconnection | | | | Loboda, O.S., Krivtsov, A.M. | | Institute of Problems of Mechanical Engineering of RAS, St. Petersburg, Russia | | Determination of elastic and strength properties of nanostructures with complex crystal lattice using moment interaction at microscale. Scale effects in elastic properties | | | | Luczak, F., Kämpfe, B., Urban | | TU Berlin, Fraunhofer IZM, Micro Materials Center, Berlin, Germany, FHTW Berlin | | Evaluation of diffraction patterns in high energy X-ray analysis | | | | Maire, O.1, Chaillot, A.1, Munier, C.1, Lombaert-Valot, I.1, Bousquet, S.2, Chastanet, C.2, Plouseau, D.3, Munier, E.3, Maron, D.4, Raynal, P.4, Villard, S.5, Dumonteil, R.5 | | 1EADS CRC, Suresnes, 2AIRBUS France, Toulouse, 3EADS DCS, Elancourt, 4ACTIA, Toulouse, 5TECHCI, Saint-Génix sur Guiers, France | | Reliability of components with Pb soldered in a lead-free process (Green electronics for aeronautical and military communication systems - GEAMCOS project) | | | | Matkowski, P.1, Urbanski, K.1, Falat, T.1, Felba, J.1, Zaluk, Z.1, Dasgupta, A.2, Pecht, M.G.2 | | 1 Wroclaw University of Technology, Poland 2 The University of Maryland, CALCE, College Park, USA | | Combined temperature cycle and vibration reliability test of lead-free interconnections - event detection | | | | May, D.1, Schacht, R.2,1, Wunderle, B.1, Kreyssig, K.3, Michel, B.1, Reichl, H.4,1 | | 1 Fraunhofer IZM, Berlin 2 University of Applied Sciences Lausitz, Senftenberg, 3 AMIC GmbH, Berlin 4 Technical University Berlin, Germany | | Advanced IR-thermography techniques for non-destructive testing of microelectronic components | | | | Mazza, E.1, Schifferle, A.2 | | 1 ETH Swiss Federal Institute of Technology Zürich 2 CSEM SA, Neuchatel, Switzerland | | A novel device for the mechanical characterization of micro-beams | | | | McDonough, C., Geer, R. | | University at Albany, SUNY, Albany, USA | | High resolution strain analysis with NanoRaman spectroscopy | | | | Meier, K.1, Wiese, S.1, Scholz, D.2, Rzepka, S.2, Nocke, K.2, Luhmann, C.2, Röllig, M.1, Wolter, K.-J.1 | | 1 Dresden University of Technology 2 Qimonda Dresden GmbH & Co. OHG, Dresden, Germany | | Investigations on the dynamic elastic-plastic behaviour of solder joints using a novel high strain rate experimental setup | | | | Mertin, W.1, Katzer, K.-D.1, Lochthofen, A.1, Bacher, G.1, Jaeger, K.2, Streubel, K.2, Furitsch, M.2, Brüderl, G.2, Hahn, B.2, Strauss, U.2, Härle, V.2 | | 1 University of Duisburg-Essen, Duisburg, Essen 2 OSRAM Opto Semiconductors, Regensburg, Germany | | Nanoanalysis of optoelectronic emitters with electrical scanning force microscopy | | | | Michel, B.1, Bombach, C.2, Winkler, T.2, Keller, J.3, Kaulfersch, E.4, Seiler, B.4 | | 1 Fraunhofer IZM Berlin, 2 Berliner Nanotest und Design GmbH, 3 AMIC GmbHBerlin, 4 Chemnitzer Werkstoffmechanik GmbH | | Analysis of Potential Failure Mechanisms in SOP Microsystems | | | | Middendorf, A.1, Griese, H.2, Nissen, N.F.2, Reichl, H.1 | | 1 Technical University of Berlin 2 Fraunhofer IZM, Berlin, Germany | | The sustainability perspective of reliability for microelectronics | | | | Middendorf, A.1, Keller, J.2 | | 1 Technical University of Berlin 2 AMIC GmbH, Berlin, Germany | | Reliability aspect integration in the early stages of design processes for mechatronic systems | | | | Mitic', S. | | University of Niš, Serbia | | Reliability of vibro-impact systems | | | | Miura, H., Suziki, K. | | Tohoku University, Sendai, Japan | | Effect of oxygen deficiency and carbon interstitials on local band gap of Hafnium oxide thin films for nano-scale transistors | | | | Mohtaram, N.K.1, Goharpey, F.2 | | 1 Iran Polymer and Petrochemical Institute, Tehran 2 Amirkabir University of Technology (Tehran Polytechnic), Tehran, Iran | | Study the effect of Montmorillonite on the crystallization of Nylon-6/Clay nanocomposites synthesized by in-situ polymerization | | | | Moody, N.R.1, Kennedy, M. S.2, Talin, A.A.1, Bahr, D.F.2, Reedy, E.D., Jr.3 | | 1 Sandia National Laboratories, Livermore, 2 Washington State University, Pullman 3 Sandia National Laboratories, Albuquerque, USA | | Patterning interfaces for reliability of nanoscale thin film devices | | | | | | Morris, J. | | Portland State University, USA | | Nanopackaging: nanotechnologies and electronics packaging | | | | Müller, M., Wiese, S., Röllig, M., Wolter, K.-J. | | Dresden University of Technology, Germany | | Influence of size, cooling rate and composition on the grain orientation of lead-free solder joints | | | | Müller, W. | | Technical University of Berlin, Germany | | Changes in the microstructure of materials and its impact on reliability - experiments and modeling | | | | Müller, W. | | Technical University of Berlin, Germany | | How to extract continuum materials properties for lead-free solders from tensile tests and nanoindentation experiments | | | | Murafa, N.1, Berka, L.2 | | 1 Institute of Inorganic Chemistry, Prague 2 Czech Technical University in Prague, Czech Republic | | Brittle properties of DLC layers deposited on the Si plate | | | | Ndip, I., Guttowski, S., Reichl, H. | | Fraunhofer IZM, Berlin, Germany | | M3-approach for reliable electrical design of advanced packages and boards | | | | Nelle, P.1, Schneegans, M.1, Stecher, M.2, Lilleodden, E.2 | | 1 Infineon Technologies AG, Neubiberg 2 The GKSS Research Center, Geesthacht, Germany | | Needle imprints and nanoindentation on pads over active area | | | | Nieland, S., Bähr, M., Böttger, A. | | SolarZentrum Erfurt, CiS Institut für Mikrosensorik GmbH, Erfurt, Germany | | Advantages of microelectronic packaging for reliable lead free soldering of thin solar cells | | | | Niklas, J.R.1, Dornich, K.2 | | 1 TU Bergakademie Freiberg 2 Freiberg Instruments GmbH, Freiberg, Germany | | Contact-less topography and testing of electrical wafer parameters | | | | Noack, E.1, Seiler, B.1, Sommer, J.-P.1,2, Dost, M.1, Michel, B.2 | | 1 Chemnitzer Werkstoffmechanik GmbH, Chemnitz, 2 Fraunhofer IZM, Micro Materials Center, Micro Materials Center Berlin and Chemnitz, Germany | | Deformation measurement for reliability assessment of components with hidden dies | | | | Nowack, M.1, Reuter, D.1, Rennau, M.1, Bertz, A.1, Geßner, T.1,2 | | 1 Chemnitz University of Technology 2 Fraunhofer IZM, Berlin, Germany | | Wafer-level active testing of capacitive inertial sensors | | | | Nuffer, J., Platz, R., Friedmann, A., Atzrodt, H., Mayer, D. | | Fraunhofer LBF, Darmstadt, Germany | | Reliability investigation of a mechatronic interface for active vibration reduction | | | | Obreja, V.V.V.N.1, Svasta, P.M.2 | | 1 National R&D Institute for Microtechnology (IMT – Bucuresti) 2 Politehnica University Bucharest, Romania | | The semiconductor - dielectric interface from PN junction periphery and its influence on reliability of power devices at high temperature | | | | Ocana, I.1, Molina-Aldareguia, J.M.1, Gonzalez, D.1, Elizalde, M.R.1, Sanchez, J.M. 1, Martinez-Esnaola, J.M.1 , Gil-Sevillano, J.1, Pantuso, D.2, Sun, B.2, Xu, G.2, He, J.2, Maiz, J.2 | | 1 CEIT, San Sebastian, Spain 2 Intel Corporation, Hillsboro, USA | | Adhesion studies in integrated circuit interconnect structures | | | | Okolo, B., Rögner, J., Kerscher, E., Beck, T., Schulze, V., Wanner, A., Löhe, D. | | University of Karlsruhe, Germany | | Size effects in Aluminium bronze cast specimens | | | | Omiya, M.1, Kishimoto, K.2 | | 1 Keio University, Yokohama 2 Tokyo Institute of Technology, Japan | | UV-ray irradiation effects on channeling crack formation of ceramic thin film on polymer substrate | | | | Osten, W. | | University of Stuttgart, Germany | | Resolution enhanced approaches in optical metrology | | | | Pecht, M.G. | | CALCE, University of Maryland, College Park, USA | | New Methods to Predict Reliability of Electronics | | Perelmuter, M. | | Institute of Problems in Mechanics, Moscow, Russia | | Physical-mechanical modelling of nanocomposites strength and facture | | | | Petzold, M.1, Klengel, R.1, Knoll, H.1, Schischka, J.1, Altmann, F.1, Müller, T.2, Chung, E.K3. | | 1 Fraunhofer IWMH, Halle/S. 2 W.C. Heraeus GmbH, Hanau, Germany 3 Heraeus Oriental HiTec Co., Korea | | Nanoreliability of Au wire bonding interconnects | | | | Pryputniewicz, R.J., Pryputniewicz, E.J. | | Worcester Polytechnic Institute, USA | | Operational reliability of a photonic MEMS system | | | | Pufall, R., Kanert, W., Goroll, M., Aresu, S. | | Infineon Technologies AG, Neubiberg, Germany | | Lifetime prediction - The need for a new qualification approach for automotive due to the lack of acceleration factors | | | | Pugno, N. | | Politecnico di Torino, Italy | | Macroscopic invisible cables | | | | Radraraju, N.P., Morris, J.E. | | Portland State University, USA | | Reliability testing of nano-particle system packaging | | | | Radojevic, V.1, Lamovec, J.2, Jovic, V.2, Trifunovic', D.1, Aleksic, R.1 | | 1 University of Belgrade 2 IChTM-Department of Microelectronic Technologies and Single Crystals, Belgrade, Serbia | | Analysis of the micromechanical properties of electrodeposited Ni coatings on different substrates | | | | Ranatowski, E. | | University of Technology and Life Science, Bydgoszcz, Poland | | Some remarks on the constraint effect at interface of the thin layer in mismatched welded joints | | | | Ranatowski, E. | | University of Technology and Life Science, Bydgoszcz, Poland | | Thermal modelling of laser welding | | | | Ranganathan, N.1, Vasques, B.1, Joly, D.1, Bouchou, A.1, Leroy, R.1, Beake, B.2 | | 1 University of Tours, LMR, CEROC, France 2 Micro Materials, Wrexham, UK | | A study of the nanoimpact resistance of hard coatings | | | | Rangu, M.1, Svasta, P.M.2 | | 1 Politehnica University of Timisoara 2 Politehnica University of Bucharest, Romania | | Computer aided design techniques for fine tuning the printed circuit traces impedances | | | | Röllig, M., Wiese, S., Meier, K., Müller, M., Wolter, K.-J. | | Dresden University of Technology, Germany | | Experimental method for creep measurements on real package solder joints on the example of SnAg3.5 alloy | | | | Roth, H., Röder, M. | | Phoenix X-ray Systems, Stuttgart, Germany | | nanoCT: Visualising of internal 3D-Structures with submicrometer resolution | | | | Rouet, V.1, Delye, A.1, Vichare, N.2, Pecht, M.G.2, Foucher, B.1 | | 1 EADS France, Suresnes, France 2 The University of Maryland, CALCE EPSC, College Park , USA | | Embedded remaining life prognostics and diagnostics of electronics | | | | Rümmler, N.1, Schnitzer, R.1, Michel, B.2 | | 1 Amitronics GmbH, Seefeld 2 Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | Experimental vibration and deformation analyses for increase micro-structure reliability | | | | Rzepka, S. | | Qimonda Dresden GmbH & Co. OHG, Dresden, Germany | | The effect of visco-elasticity on the results of lifetime prediction of BGA modules under thermal cycle loads by FEM analysis | | | | Sabaté, N.1, Vogel, D.2, Gollhardt, A.2, Keller, J.2, Marcos, J.1, Gràcia, I.1, Cané, C.1, Michel, B.2 | | 1 Autonomous University of Barcelona, Spain 2 Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | Confined residual stress measurements on thin films deposited onto thick substrates with a FIB equipment | | | | Saka, M.1, Kohara, T.1, Hasegawa, T.1, Yamashita, M.2 | | 1 Tohoku University, Sendai 2 Fuji Electric Advanced Technology Co. Ltd., Tokyo, Japan | | A simple method for testing electromigration resistance of solders | | | | Schacht, R.1, Meli, E.2, May, D.3, Wittler, O.3, Wunderle, B.3, Michel, B.3, Reichel, H.2,3 | | 1 University of Applied Sciences Lausitz, Senftenberg, Germany, 2 Technical University Berlin, Germany, 3 Fraunhofer IZM Berlin, Germany | | Effective thermal material models for multi layer PCBs with thermal vias | | | | Schimpf, C.1, Feldmann, K.1, Matzner, C.1, Steinke, A.2 | | 1 University of Erlangen-Nuremberg, Erlangen 2 CiS Institut für Mikrosensorik GmbH, Erfurt, Germany | | Failure of electronic devices due to condensation | | | | Schindler, S.1, Dresbach, C.2, Wolter, K.-J.1, Petzold, M.2 | | 1 Dresden University of Technology 2 Fraunhofer IWMH, Halle/S., Germany | | The influence of bond process parameters on the microstructure of bonding wires | | | | Schindler-Saefkow, F.1, Jagle, M.2, Wunderle, B.3, Böttner, H.2, Nurnus, J.4 | | 1 Nanotest und Design GmbH Berlin, 2 Fraunhofer IPM, Freiburg, 3 Fraunhofer IZM Berlin, Micro Materials Center, Berlin, 4 Micropelt GmbH, Freiburg, Germany | | Thermal-electric simulation of micropeltier elements for hot spot cooling | | | | Schischka, J., Altmann, F., Krause, M., Knoll, H., Petzold, M. | | Fraunhofer IWMH, Halle/S., Germany | | EBSD grain microstructure investigation of electronic materials down to the nanoscale | | | | Schneider, D., Schultrich, B. | | Fraunhofer IWS, Dresden, Germany | | Testing thin films and surfaces by the laser-acoustic test method LA wave | | | | Schnitzer, R.1, Rümmler, N.1, Dost, M.2, Michel, B.3, Hauck, T.4 | | 1 Amitronics GmbH, Seefeld 2 Chemnitzer Werkstoffmechanik GmbH, Chemnitz 3 Fraunhofer IZM, Micro Materials Center, Berlin 4 Freescale Halbleiter Deutschland GmbH, Munich, Germany | | Experimental vibration analyses by laser vibrometer under vacuum conditions | | | | Schulze, K., Schulz, S.E., Geßner, T. | | Chemnitz University of Technology, Germany | | Thermal behavior of interconnect systems: A comparison of low-k, air gap and SiO2 integration | | | | Schwaiger, R. | | University of Karlsruhe / Forschungszentrum Karlsruhe, Germany | | Mechanical properties in small dimensions | | | | Sedmak, S., Kiric, M., Sedmak, A. | | University of Belgrade, Serbia | | The reliability criteria and failure modes in fracture mechanics | | | | Seiler, B.1, Noack, E.1, Sommer, J.-P.2, Dost, M. 1, Michel, B.2 | | 1 Chemnitzer Werkstoffmechanik GmbH (CWM), Chemnitz 2 Fraunhofer IZM, Micro Materials Center, Berlin and Chemnitz, Germany | | Design support for advanced radar sensors | | | | Shamshirsaz, M.1, Gheisarieha, M.2, Maroufi, M.1 | | 1 Amirkabir University of Technology (Tehran Polytechnic), Tehran 2 Sharif University of Technology, Tehran, Iran | | Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performance | | | | Shaporin, A., Doetzel, W., Mehner, J. | | Chemnitz University of Technology, Germany | | Test-structures for MEMS reliability analysis | | | | Shodja, H.M.1, Keshavarzzadeh, V.1, Yavari, A.2 | | 1 Sharif University of Technology, Tehran, Iran 2 Georgia Institute of Technology, Atlanta, USA | | Simulation of crystalline defects in the atomic scale using a lattice theory | | | | Shodja, H.M., Kamalzare, M. | | Sharif University of Technology, Tehran, Iran | | The elastic fields of two interacting nano-voids in fcc materials via the many body atomic scale FEM | | | | Simonov, I. V., Sirotin, A.A. | | Institute for Problems in Mechanics of the RAS, Moscow, Russia | | Microfibers testing by electromagnetic radiation method | | | | Sklyar, R. | | Lviv, Ukraine | | The microfluidic sensors based on the CNT or organic FETs | | | | Smorodin, T.1, Wilde, J.2, Stecher, M.1 | | 1 Infineon Technologies AG, Munich 2 University of Freiburg, IMTEK, Germany | | Crack propagation in the interlayer dielectric of a power technology metallization under fast temperature-cycle stress | | | | Sommer, J.-P.1, Michel, B.1, Petzold, M.2, Schönecker, A.3, Kusnezoff, M.3, Wunderle, B.1 | | 1 Fraunhofer IZM, Micro Materials Center, Berlin 2 Fraunhofer IWMH, Halle/S. 3 Fraunhofer IKTS, Dresden, Germany | | Nano-reliability within the framework of Fraunhofer market-oriented nano-scale activities | | | | Song, X., Zhang, S.Y., Korsunsky, A.M. | | University of Oxford, UK | | Analysis of energy dissipation at the micro-level during fatigue of crystals and polycrystals | | | | Souchon, F., Charvet, P.L. | | CEA-LETI-MINATEC, Grenoble, France | | Failure analyses study on MEMS switches due to dielectric charging | | | | Souchon, F., Charvet, P.L., Maeder-Pachurka, C., Audoin, M. | | CEA-LETI-MINATEC, Grenoble, France | | Identification of dielectric charging on MEMS switches | | | | Stojanovic, D.1, Radojevic, V.1, Tang, C.Y.2, Chen, D.Z.2, Uskokovic, P.S.2, Aleksic, R.1 | | 1 University of Belgrade, Belgrade, Serbia, 2 Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China | | Nanomechanical properties of silane coated silica-poly(methylmethacrylate) nanocomposites | | | | Striegler, A., Bendjus, B., Köhler, B. | | Fraunhofer IZFP, Dresden, Germany | | The potential of the Atomic Force Acoustic Microscopy for visualisation of subsurface voids | | | | Suhir, E. | | University of California, Santa Cruz, USA | | Dynamic response of micro- and opto-electronic systems to shocks and vibrations | | | | Suñé, J.1, Wu, E.2, Tous, S.1 | | 1 Autonomous University of Barcelona 2 IBM Microelectronics Division, Essex Junction, Spain | | Physics-based percolation model for the breakdown of ultra-thin (down to 1 nm) gate oxides for advanced CMOS | | | | Tabanyukhova, M.V. | | The Novosibirsk State University of Architecture and Civil Engineering (NGASU), Novosibirsk, Russia | | Photoelastic analysis of fracture mechanic problems in elements with angular notches | | | | Takao, H.1,3, Hayama, K.2, Tanaka, N.1, Ohyama, H.2, Ishida, M.1,3 | | 1 Toyohashi University of Technology 2 Kumamoto National College of Technology 3 Japan Science and Technology Agency, JST-Crest, Japan | | Radiation resistance of ‘MOSFET-like MEMS microvalve’ for highly reliable microfluidic integrated circuits | | | | Tilgner, R. | | Infineon Technologies AG, Munich, Germany | | Physics of Failure (PoF) for interconnect structures - an essay | | | | Töpper, M.1,2, Hoferling, K.2, Defo Kamga, F.1, Reichl, H.1 | 1 Fraunhofer IZM / TU-Berlin, Berlin, Germany
2 University of Utah, Salt Lake City, USA | | Copper migration in thin film polymers | | | | Turbini, L.1, Caputo, A.2 | | 1 RIM Research In Motion, Waterloo, Ontario 2 University of Toronto, Ontario, Canada | | Design limitations related to Conductive Anodic Filament (CAF) formation in a micro-world | | | | Urbanski, K., Wymyslowski, A., Matkowski, P., Falat, T. | | Wroclaw University of Technology, Poland | | Application of an Ethernet microcontroller in a fast data acquisition system for long-term reliability tests of microelectronic interconnections | | | | Uruska, D., Friedel, K | | Wroclaw University of Technology, Poland | | Stress induced on the MEMS active surface and deformation of MEMS due to moulding of MEMS/ASIC system | | | | van der Sluis, O.1,2, van Silfhout, R.B.R.1, Engelen, R.A.B.1, van Driel, W.D.2,3, Zhang, G.Q.2,3 | | 1 Philips Applied Technologies, Eindhoven 2 Delft University of Technology 3 NXP Semiconductors, Nijmegen, The Netherlands | | Energy-based damage sensitivity analysis of complex 3D structures with an application to IC bond pads | | | | van Driel, W.D.1,2, Yang, D.G.1, Theunis, F.1, Zhang, G.Q.2 | | 1 NXP Semiconductors, Nijmegen, 2 Delft University of Technology, The Netherlands | | Challenges for MEMS packaging: Capping | | | | Vecchione, N., Balint, D.S., Wasmer, K.*, Nikbin, K.M. | | Imperial College, London, U.K., *EMPA, Thun, Switzerland | | Characterisation of EB-PVD Zirconia by Nanoindentation | | | | Vermeulen, A.C., Fransen, M. | | PANalytica, Almelo, The Netherlands | | A new method for determining the residual stresses in coatings | | | | Villain, J., Corradi, U., Weippert, C., Meeh, M. | | University of Applied Sciences Augsburg, Germany | | Nano hardness of differently oriented Tin crystals in small solder joints | | | | Vogel, D.1, Gollhardt, A. 1, Sabate, N. 2, Michel, B. 1 | | 1 Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany, 2 Centre Nacional de Microelectrònica (CNM-CSIC), Bellaterra, Spain | | Data evaluation issues for stress release measurements on MEMS layers | | | | Vormoor, M. | | BMW Bayerische Motoren Werke AG, Munich, Germany | | Increase of safety – better visibility by self-cleaning glasses | | | | Walter, H.1,4, Seiler, B.2, Bombach, C.3, Michel, B.4 | | 1 AMIC Angewandte Micro-Messtechnik GmbH, Berlin 2 Chemnitzer Werkstoffmechanik GmbH, Chemnitz 3 Berliner Nanotest und Design GmbH, Berlin 4 Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | Determination of Poisson’s ratio of electronic packaging materials dependent on temperature by means of UNIDAC-method | | | | Wang, T.H., Lee, C.-C., Lai, Y.-S. | | Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung, Taiwan | | Evaluation of thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test conditions | | | | Wang, Y.-Q., Lou, W.-Z., Fan, N.-J., Hao, J.-W. | | Beijing Institute of Technology, Beijing, China | | Study on fault diagnostic strategy of intelligence magnetic detection microsystem | | | | Wiemer, M.1, Frömel, J.1, Bagdahn, J.2, Knechtel, R.3 | | 1 Fraunhofer IZM, Chemnitz 2 Fraunhofer IWMH, Halle/S. 3 X-Fab Semiconductor Foundries AG, Germany | | Waferbond technology and quality assessment | | | | Wiese, S., Röllig, M., Müller, M., Wolter, K.-J. | | Dresden University of Technology, Germany | | The effect of size and composition on the creep of lead-free solders | | | | Wilde, J., Fischer, S. | | University of Freiburg, IMTEK, Germany | | Modelling of polymer-based nano-composite materials for the reliability prediction of microsystems | | | | Winkler, T. | | Berliner Nanotest und Design GmbH | | EUCEMAN – The European center for micro- and nanoreliability | | | | Wittler, O.1, Schindler-Saefkow, F.1, Schreier-Alt, T.2, Michel, B.1 | | 1 Fraunhofer IZM, Micro Materials Center, Berlin 2 Fraunhofer IZM, Munich, Germany | | Assessment of package induced stresses for sensor applications | | | | Wittler, O., Auerswald, E., Dermitzaki, E., Gollhardt, A., May, D., Schmitz, St., Wunderle, B., Michel, B. | | Fraunhofer IZM, Micro Materials Center, Berlin, Germany | | A test system for ensuring material reliability in micro- and nanoelectronics developed at Fraunhofer Micro Materials Center, IZM Berlin | | | | | | Wolf, M.J., Reichl, H. | | Fraunhofer IZM, Berlin, Germany | | Systemintegration - requirements and technology | | | | Wolf, J.1, Raudzis, C.1, Mueller-Fiedler, R.1, Seidel, H.2 | | 1 Robert Bosch GmbH, Stuttgart 2 Saarland University, Saarbrücken, Germany | | Novel resonant sensors for measuring the influence of package-induced stress on inertial sensors | | | | Wondrak, W., Senske, W. | | DaimlerChrysler AG, Böblingen, Germany | | Future reliability concepts for automotive electronics | | | | Wunderle, B., Michel, B. | | Fraunhofer IZM, Micro Materials Center, Berlin | | Progressing from micro- to nanoreliability in system integration | | | | Yang, P.-F.1,2, Jian, S.-R.3, Lai, Y.-S.1, Chen, R.-S.2 | | 1 Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung 2 National Cheng Kung University, Tainan 3 National Chiao Tung University, Hsinchu, Taiwan | | Characterizations of ZnO thin films deposited onto langasite substrates by r.f. magnetron sputtering | | | | Yasuoka, M., Doi, B.S., Ando, I. | | Nachi-Fujokoshi Corporation, Toyama, Japan | | Ultralong fatigue estimation of cemented carbide WC-Co | | | | Yu, S.-W., Yu, L., Feng, X.-Q. | | Tsinghua University, Beijing, China | | Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramics | | | | Yu, X.-L., Lou, W.H., Ma, B.Z., Wang, Y.-Q. | | Beijing Institute of Technology, China | | Based on microsystems distributed BIT diagnostic network for robot | | | | Yuan, C.1, Dawotola, A.W.1, van der Sluis, O.1, Zhang, G.Q.1, Ernst, L.J.1, van Driel, W.D.2, van Silfhout, R.B.R.3, Thijsse, B.J.1 | | 1 Delft University of Technology 2 NXP Semiconductors, Nijmegen 3 Philips Applied Technologies, Eindhoven, The Netherlands | | Molecular dynamics simulation on Silicon based materials and their interface | | | | Zacharopoulos, D.A., Pategakis, S., Plistakas, N. | | Democritus University of Thrace, Xanthi, Greece | | Approach on the problem of crack path stability at different test specimens | | | | Zhang, G.Q.1,2, van Driel, W.D.1,2, Yuan, C.2 | | 1 NXP Semiconductors, Nijmegen 2 Delft University of Technology, The Netherlands | | The impact of materials on nanoelectronics | | | | Zhuravliov, V.I., Alexeev, V.F. | | Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus | | Critical temperature estimation of heating of semiconductor devices at HEMP actions | | | | Zimprich, P., Saeed, U., Betzwar-Kotas, A., Khatibi, G., Weiss, B., Ipser, H. | | University of Vienna, Austria | | Miniaturized lead-free solder joints and their response to dimensional constraints | | | | Zschech, E., Meyer, M.A., Vairagar, A.V., Zienert, I., Langer, E., Hecker, M., Geisler, H., Engelmann, H.J. | | AMD Saxony LCC & Co. KG, Dresden, Germany | | Metal interconnect micro- and nanostructure and electromigration-induced damage mechanisms | | | | Zschenderlein, U.1, Kämpfe, B.2, Schultrich, B.3, Fritsche, G.1 | | 1 Chemnitz University of Technology 2 Fraunhofer IZM, Micro Materials Center, Berlin 3 Fraunhofer IWS, Dresden, Germany | | Application of energy dispersive X-ray diffraction for the efficient investigation of internal stresses in thin films | | | | Zschenderlein, U.1, Frühauf, J.1, Straube, H.1, Gärtner, E.2, Kämpfe, B.3, Luczak, F.3, Zimny, F.4, Petrick, H.4, Böhme, H.5 | | 1 Chemnitz University of Technology 2 SiMETRICS GmbH, Limbach-Oberfrohna 3 Fraunhofer IZM, Micro Materials Center, Berlin 4 Petrick GmbH, Bad Blankenburg 5 FMP Holding GmbH, Freiberg, Germany | | X-ray optics manufactured by microtechnology for ED XRD systems | | |
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