| |
| Aifantis, E.C. |
| Aristotle University of Exploring, Greece |
| Exploring the micro-nano mechanics transition:
Theory and applications |
| |
| Albaut, G.N. |
| The Novosibirsk State University of Architecture and Civil
Engineering (NGASU), Novosibirsk, Russia |
| Study of nonlinear fracture problems in metal elements by
photoelastic coating method |
| |
| Albrecht, H.-J. |
| Siemens AG, Berlin, Germany |
| Technical reliability of miniaturized lead-free solder
interconnects |
| |
| Alsem, D.H.1, Boyce, B.L.2, Stach, E.A.3,
Ritchie, R.O1,4 |
| 1 Lawrence Berkeley National Laboratory, Berkeley
2 Sandia National Laboratories, Albuquerque
3 Purdue University, West Lafayette
4 University of California, Berkeley, USA |
| High-cycle fatigue of micron-scale Silicon structural
films for MEMS applications |
| |
| Altmann, F., Graff, A., Simon, M. |
| Fraunhofer IWMH, Halle/S., Germany |
| Advanced focused ion beam techniques for process control
of sub 100nm technologies |
| |
| Alush, H., Katz, Y. |
| Negba Institute, Beer Sheva, Israel |
| Fatigue crack initiation stage: Reflection on small volume
segment applications |
| |
| Aresu, S., Kanert, W., Pufall, R., Goroll,
M. |
| Infineon Technologies AG, Neubiberg, Germany |
| Latent effect of Backend Of Line (BEOL) plasma cleaning
process on silicon gate oxide reliability |
| |
| Auersperg, J.1,2, Shirangi, M.H.3,1,
Michel, B.1 |
| 1 Fraunhofer IZM, Micro
Materials Center, Berlin
2 AMIC Angewandte
Micro-Messtechnik GmbH, Berlin
3 Robert Bosch GmbH,
Reutlingen, Germany |
| DOE and robust design of electronics devices
in terms of fracture, delamination and thermo-mechanical fatigue |
| |
| Auerswald, E., Walter, H., Wittler, O., Gollhardt, A.,
Michel, B. |
| Fraunhofer IZM, Micro Materials Center, Berlin, Germany |
| Estimation of crack propagation through mismatched interfaces due to thermally induced stress |
| |
| Badri Ghavifekr, H. |
| Sahand University of Technology, Iran |
| Experimental characterization of thin Copper foils |
| |
| Bagdahn, J.1, Allen, R.2, Marshall,
J.2, Read, D.3, Baylies, W.A.4, Turner, K.5 |
| 1 Fraunhofer IWMH,
Halle/S., Germany
2 National Institute of
Standards and Technology NIST, Gaithersburg
3 National Institute of
Standards and Technology NIST, Boulder
4 BayTech Group, Weston
5 University of
Wisconsin-Madison, Madison, USA |
| Measurement of fracture toughness of wafer-bonded silicon
using the new SEMI standard for micro-Chevron-samples |
| |
| Bahr, D.F., Kennedy, M. S., Yeager, J. D. |
| Washington State University, Pullman, USA |
| Adhesion of noble metals for electrodes in MEMS |
| |
| Bailey, C. |
| University of Greenwich, U.K. |
| Multi-physics analysis as a key enabler for MicroNanoReliability |
| |
| Bajpai, R. |
| Rani Durgavati University, Jabalpur, India |
| Mechanical characterization of bio-compatible materials |
| |
| Banks-Sills, L., Eliaz, N., Krylov, S., Fourman, V.,
Ashkenazi, D., Inberg, A., Eliasi, R., Fiodorov, J. |
| Tel Aviv University, Israel |
| Determination of mechanical properties of
micro-sized specimens |
| |
| Barabanenkov, M.Yu., Barabanenkov, Yu.N. |
| Russian Academy of Science, Chernogolovka, Russia |
| Distant- and interference-spatial spectroscopy of
evanescent waves |
| |
| Barbosa, N., Read, D., Keller, R., Geiss, R. |
| National Institute of Standards and Technology NIST, Boulder, USA |
| An electrical approach to measuring reliability and
mechanical properties of interconnects |
| |
| Bauer, M.1,2, Vieth, S.1,2, Uhlmann, M.2, Landeck, S.1 |
| 1 Fraunhofer IZM, Teltow,
2 BTU Cottbus, Cottbus, Germany
|
| Promising filler for electric-packaging materials: ?-eucryptite |
| |
| Bechmann, F. |
| BMW Bayerische Motoren Werke AG, Munich, Germany |
| Microstructural materials modelling of particle reinforced
light metals |
| |
| Benfdila, A. |
| The University M. Mammeri, Tizi-Ouzou, Algeria |
| Recent advances in nanoMOSFET technology |
| |
| Bennemann, S.1, Altmann, F.1,
Graff, A.1, Schischka, J.1, Petzold, M.1,
Theuss, H.2, Dangelmaier, J.2, Pressel, K.2 |
| 1 Fraunhofer IWMH, Halle/S.
2 Infineon Technologies AG, Regensburg, Germany |
| High resolution investigation of intermetallic formation
and nano-reliability of SnAg2.5Cu0.7 solder comparing a wafer level package and a board-interconnect application |
| |
| Berka, L. |
| Czech Technical University in Prague, Czech Republic |
| On a model and a theory of granulation
processes |
| |
| Bertholet, Y.1,2, Olbrechts, B.1,3, Raskin,
J.-P.1,3, Pardoen, T.1,2 |
| 1 Université catholique de Louvain, CeRMiN
2 Université catholique de Louvain, IMAP
3 Université catholique de Louvain, EMIC, Belgium |
| Molecular bonding aided by dissipative interlayers |
| |
| Biesheuvel, M.1, van Soestbergen, M.1, Rongen,
R.2, Ernst, L.J.3,
Zhang, G.Q.2,3 |
| 1 Netherlands Institute of Metals Research NIMR, Delft
2 NXP Semiconductors, Nijmegen
3 Delft University of Technology, The Netherlands |
| A multi-physics failure model for aluminum bondpad
corrosion due to ions, humidity and applied voltage |
| |
| Bochow-Ness, O., Fujino, M., Middendorf, A.,
Reichl, H. |
| Technical University of Berlin, Germany |
| Condition indicators for reliablity monitoring of
microsystems |
| |
| Böffel, C., Müller, J., Müller, R., Bauer, M. |
| Fraunhofer IZM, Teltow, Germany |
| The Calcium test: A versatile tool for the investigation
of barrier properties of polymers and reliability tests of encapsulation
processes |
| |
| Böhme, B., Wolter, K.-J. |
| Dresden University of Technology, Germany |
| Characterization of organic substrate materials for high
temperature automotive applications |
| |
| Brämer, B. |
| Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany |
| Wafer bow caused by intrinsic stress in ALD films |
| |
| Brocke, H. |
| Fraunhofer Institut für Holzforschung, Wilhelm-Klauditz-Institut,Braunschweig,
Germany |
| A finite element based comparison of the reliability of Cu
interconnects with CF polymer and SiLKTM as low k dielectrics |
| |
| Brunschwiler, T., Rothuizen, H., Kloter, U., Linderman, R., Wälchli,
R., Michel, B. |
| IBM Research GmbH, Zurich Research Laboratory, Rüschlikon, Switzerland |
| Interlayer heat transfer for vertically integrated
packages |
| |
| Caers, J.F.J.M.1, Zhao, X.J.1, de Vries, J.W.C.1,
Wong, E.H.2 |
| 1Philips Applied Technologies, Eindhoven, The Netherlands
2Institute of Microelectronics (IME), Singapore, Singapore |
| Highly accelerated reliability tests for conductive
adhesive interconnects |
| |
| Cambruzzi, A., Dual, J. |
| ETH Swiss Federal Institute of Technology Zürich, Switzerland |
| Near threshold fatigue crack growth investigation on
notched micro-resonator |
| |
| Capková, P. |
| Technical University of Ostrava, Czech Republic |
| Molecular modeling combined with experiment in
analysis and characterization of organo-inorganic hybrid nanostructures |
| |
| Carpinteri, A., Pugno, N. |
| Politecnico di Torino, Italy |
| Strength of hierarchical materials |
| |
| Chen, J., Lai, Y.-S. |
| Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung, Taiwan |
| First-principles calculations of elastic properties of
Cu-Sn crystalline phases |
| |
| Corradi, U., Weippert, C., Villain, J. |
| University of Applied Sciences Augsburg, Germany |
| EBSD measurements in small lead-free solder joints |
| |
| Coulombier, M.1,2, Gravier, S.1,2, Pardoen, T.1,2,
Fabregue, D.3, Andre, N.1,2,
Houri, S.1,2, Raskin, J.-P.1,2 |
| 1 Université catholique de Louvain
2 Université catholique de Louvain, CeRMiN
3 INSA-Institute National of Applied Sciences of Lyon, France |
| New concept of multipurpose on-chip nanomechanical
laboratory |
| |
| Cugnoni, J.1, Botsis, J.1, Janczak-Rusch, J.2 |
| 1 LMAF/EPFL, Lausanne
2 EMPA, Corrosion and Materials Integrity, Dübendorf,
Switzerland |
| Constraining & size effects on the tensile and shear
elasto-plastic behavior of lead free solder joints |
| |
| Dauskardt, R. |
| Stanford University, Stanford, USA |
| Fracture and reliability in Cu/low-k interconnect structures:
Role of process variables and packaging |
| |
| de Vreugd, J., Jansen, K.M.B., Bohm, C. |
| Delft University of Technology, The Netherlands |
| Modeling the effect of physical aging on
viscoelastic properties of a molding compound |
| |
| Dermitzaki, E.1, Bauer, J.1, Walter,
H.2, Wunderle, B.1, Michel, B.1, Reichl, H.3 |
| 1 Fraunhofer IZM, Micro Materials Center, Berlin
2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin
3 Technical University of Berlin, Germany |
| Molecular dynamics simulation and mechanical characterisation
of epoxy resins examined at different temperatures |
| |
| Deromelaere, G., Felten, F., Hiller, P., Knoblauch, V. |
| Robert Bosch GmbH, Stuttgart, Germany |
| Reliability assessment of brittle materials – a new
approach to improve prediction quality |
| |
| Dowhan, L.1, Wymyslowski, A.1, Dudek, R.2 |
| 1 Wroclaw University of Technology, Poland
2 Fraunhofer IZM, Micro Materials Center, Chemnitz , Germany |
| Multi-objective decision support system in numerical
reliability optimization of modern electronic packaging |
| |
| Dresbach, C.1, Schischka, J.1,
Knoll, H.1, Seifert, T.2, Müller, T.3,
Petzold, M.1 |
| 1 Fraunhofer IWMH, Halle/S.
2 Fraunhofer IWM, Freiburg
3 W.C. Heraeus GmbH, Hanau, Germany |
| Local mechanical deformation properties of gold bonding
wires and free air balls |
| |
| Dreßler, M.1, Liebing, G.1, Becker, K.-F.2,
Wunderle, B.2, Reichl, H.3 |
| 1 Robert Bosch GmbH, Waiblingen
2 Fraunhofer IZM,
Berlin
3 Technical University
of Berlin, Germany |
| Application of interfacial fracture mechanics approach for
obtaining design rules for flip chip interconnections |
| |
| Drumea, A., Vasile, A. |
| Politehnica University Bucharest, Romania |
| Efficient and reliable communications in industrial
control and mechatronic systems |
| |
| Drumea, A., Vasile, A., Vulpe, V. |
| Politehnica University Bucharest, Romania |
| Safety and reliability aspects in design and construction
of a infusion pump medical system |
| |
| Dudek, R., Faust, W., Döring, R., Michel, B. |
| Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany |
| In-situ microscopic studies on microstructural degradation
and FE analyses for miniaturized SAC solder joints under thermal test- and
field cycling |
| |
| Ebert, M., Bagdahn, J. |
| Fraunhofer IWMH, Halle/S., Germany |
| Numerical reliability assessment of brittle MEMS
structures based on experiments, size effect theory and probabilistic
sampling |
| |
| Eisenberg, W., Renner, K., Boram, R. |
| Arnold-Sommerfeld-Gesellschaft, Leipzig, Germany |
| Simulation of big complex systems with nano cellular automata swarms
and their reliability |
| |
| Eremeev, V., Indeitsev, D., Ivanova, E., Morozov, N., Semenov, B. |
| RAS, St. Petersburg, Russia |
| Mechanics and nanomechanics |
| Falat, T., Friedel, K. |
| Wroclaw University of Technology, Poland |
| TSV constraints related to temperature excursion, pressure
during moulding and materials used |
| |
| Farley, D.1, Zhou, Y.1, Dasgupta, A.1,
Caers, J.F.J.M.2, de Vries, J.W.C.2 |
| 1 The University of Maryland, CALCE, College Park , USA
2 Philips Applied Technologies, Eindhoven, The Netherlands |
| Reliability of RF SiP assemblies under mechanical loads |
| |
| Faust, W., Dudek, R., Poller, T., Michel, B. |
| Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany |
| Microstructure of damaged solder |
| |
| Fecht, H. |
| University of Ulm / Forschungszentrum Karlsruhe, Germany |
| Properties and applications of nanocrystalline CVD-grown
diamond, MicroDevice fabrication and microreliability |
| |
| Feng, W., Frémont, H., Verdier, F., Plano, B. |
| University Bordeaux I, IMS Laboratory, ENSEIRB, France |
| Simple analytical model for thermally-induced warpage of
PoP |
| |
| Ferraris, E.1, Pagano, C.2, Zerbini, S.3,
Fassi, I.2, Reynaerts, D.1 |
| 1 Katholieke Universiteit Leuven, Belgium
2 National Research Council (CNR-ITIA), Milano
3 STMicroelectronics, Cornaredo, Italy |
| Development of a multi body based 1 DoF rotary MEMS |
| |
| Fiedler, S., Zwanzig, M., Schmidt, R., Scheel, W. |
| Fraunhofer IZM, Berlin, Germany |
| Development and evaluation of microelectronic packaging
concepts based on submicron wires |
| |
| Flaemig, J., Hammacher, J., Fuelle, A., Saupe, J., Zahn, W., Grimm, J |
| University of Applied Sciences Zwickau, Germany |
| Reliability, tribology and mechanical properties of
SU-8-layers for mechanical applications |
| |
| Foucher, B. |
| EADS France, Suresnes, France |
| The reliability issues of electronics in
aeronautics |
| |
| Gaspar, J.C., Paul, O. |
| University of Freiburg, IMTEK, Germany |
| Reliability of LPCVD Silicon Nitride as a structural
material for MEMS applications |
| |
| Geißler, U.1, Schneider-Ramelow, M.2, Reichl, H.1 |
| 1 Technical University of Berlin
2 Fraunhofer IZM, Berlin, Germany |
| Micro-nanostructural investigations of AlSi1 bondcontacts |
| |
| Georgakos, G., Huber, P., Ruckerbauer, F. |
| Infineon Technologies AG, Neubiberg, Germany |
| Cosmic ray induced single-, multi-bit and latch-up failure
mechanisms at sub 90nm embedded SRAMs for system-in-chip applications |
| |
| Gerberich, W.W., Mook W.M., Beaber, A.R. |
| University of Minnesota, Minneapolis, USA |
| Nanoscale strength and reliability probe |
| Gerdes, H., Gatzen, H.H. |
| Leibniz University Hanover, Germany |
| Focused ion beam core hole drilling for stress detection
in thin films |
| |
| Gesang, T., Rodewald, R. |
| Fraunhofer IFAM, Bremen, Germany |
| Optimisation of micro stress in adhesive bonds in electro
optics and micro optics |
| |
| Geßner, T. |
| Chemnitz University of
Technology / Fraunhofer IZM, Chemnitz, Germany |
| Smart systems integration and reliability |
| |
| Getsov, L.1, Semenov, A.1,
Staroselsky, A.2 |
| 1 St.-Petersburg State Polytechnical University, Russia
2 Pratt and Whitney, East Hartford, USA |
| A new TMF failure criterion for single crystal superalloys |
| |
| Ghisi, A.1, Fachin, F.1, Mariani, S.1,
Corigliano, A.1, Zerbini, S.2 |
| 1 Politecnico di Milano
2 STMicroelectronics,
Cornaredo, Italy |
| Multi-scale analysis of polysilicon MEMS
subject to drop impacts |
| |
| Gieser, H. |
| Fraunhofer IZM, München, Germany |
| Electrostatic challenges and countermeasures for devices with MicroNanoDimensions |
| |
| Gitis, N., Hermann, I., Khosla, V. |
| CETR, Campbell, USA |
| Non-destructive nano-mechanical reliability and
defectivity characterization of thin films |
| |
| Glickman, E.E. |
| Tel Aviv University, Israel |
| Capillary force driven , surface diffusion controlled
degradation of metal nano-electrodes: Upfront reliability assessment |
| |
| Goldstein, R.V., Shushpannikov, P.S., Ustinov, K.B. |
| Institute for Problems in Mechanics of RAS, Moscow |
| Modeling of formation of systems SiO2 precipitate - dislocation loops in Silicon wafers |
| |
| Gollhardt, A., Michel, B. |
| Fraunhofer IZM, Micro Materials Center, Berlin, Germany |
| Focused Ion Beam (FIB) as an analytical tool in micro- and nanotechnology |
| |
| Goroll, M., Pufall, R., Aresu, S., Kanert, W. |
| Infineon Technologies AG, Neubiberg, Germany |
| Reliability of bipolar transistors – new aspects for
lifetime determination in automotive applications |
| |
| Hanke, Krüger |
| Fraunhofer IZFP, Dresden, Germany |
| Methods of micro and nano CT for the characterization of
microcomponents |
| |
| Hauck, T., Schmadlak, I. |
| Freescale Halbleiter Deutschland GmbH, Munich, Germany |
| Procedure to asses interface cracks in CMOS BEOL stack up
designs with Finite Element simulation and energy based fracture mechanics
approach |
| |
| Hecht, S., Hoffmann, M. |
| Ilmenau University of Technology, Germany |
| Reliability of “Black Silicon” for MEMS packaging |
| |
| Heimann, M.1, Meißner, F.2, Endler, I.2,
Schönecker, A.2, Wolter, K.-J.1 |
| 1 Dresden University of Technology
2 Fraunhofer IKTS, Dresden, Germany |
| Nano-scaled functional layer for current and heat
transportation in electronics packaging |
| |
| Heino, P. |
| Tampere University of Technology, Finland |
| Simulations of nanoscale thermal conduction |
| |
| Hertl, M., Weidmann, D., Lecomte, J.-C. |
| INSIDIX, Seyssins, France |
| Reliability improvement by advanced failure
assessment strategy |
| |
| Heuer, H.1, Meyendorf, N.1, Oppermann, M.2,
Wolter, K.-J.2 |
| 1 Fraunhofer IKTS, Dresden
2 Dresden University of Technology, Dresden, Germany |
| The Center for Non-destructive Nano Evaluation (nanoEVA),
a new research facility in Dresden |
| |
| Hirsch, S., Majcherek, S., Leneke, T., Schmidt, B. |
| Otto-von-Guericke-Universität Magdeburg, Germany |
| A Silicon test chip for thermomechanical analysis of MEMS
packagings |
| |
| Hocheng, H., Hung, J.-N. |
| National Tsing Hua University, Hsinchu, Taiwan |
| Bending fatigue test of Polysilicon microcantilever beams |
| |
| Huang, Z., Conway, P. |
| Loughborough University, UK |
| Modelling of interfacial intermetallic compounds in the
applications of very fine lead-free solder interconnections |
| |
| |
| Ikehara, T.1, Tsuchiya, T.2 |
| 1 National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba
2 Kyoto University, Japan |
| Parallel fatigue test of micromachined single crystal
silicon using lateral resonating device |
| |
| Ito, H., Suzuki, K., Miura, H. |
| Tohoku University, Sendai, Japan |
| Stress-induced anisotropic diffusion of component atoms in
Ni-base superalloy during creep damage |
| |
| Jacob, P. |
| EMPA, Materials Science & Technology, Dübendorf,
Switzerland |
| Polysilicon extensions and etching residues as a
reliability risk |
| |
| Jansen, K.M.B., Patel, M., Ernst, L.J., Bohm, C. |
| Delft University of Technology, The Netherlands |
| Transient bulk modulus of a novolac epoxy resin |
| |
| Kahle, O.1,2, Uhlig, C.2, Bauer, M.1,2 |
| 1 Brandenburg Technical University Cottbus
2 Fraunhofer IZM, Teltow, Germany |
| Thermophysical characterisation of sub-µm polymer layers
by
Nano-TMA/TGA/DVS |
| |
| Kämpfe, A. |
| Witzenmann GmbH, Pforzheim, Germany |
| Micro-size metal bellows as an example for miniaturisation
and reliability of mechanical components |
| |
| Kämpfe, B.1, Luczak, F.2, Zimny, F.3,
Petrick, H.3, Böhme, H.4 |
| 1 Fraunhofer IZM, Micro Materials Center, Berlin
2 Technical University
of Berlin
3 Petrick GmbH, Bad
Blankenburg
4 FPM Holding GmbH,
Freiberg, Germany |
| Possibilities and application fields of
energy-dispersive X-ray diffraction for the investigation of microsystems |
| |
| Kalaitzidis, P.A., Zacharopoulos, D.A., Gdoutos, E.E. |
| Democritus University of Thrace, Xanthi, Greece |
| Theoretical and experimental study of failure
of foam-core sandwich beam under three-point bending |
| |
| Kanert, W., Pufall, R. |
| Infineon Technologies AG, Neubiberg, Germany |
| Physics of failure and qualification methods for
semiconductor components in harsh environments |
| |
| Kaulfersch, E.1, Rzepka, S.2, Ganeshan, V.2, Müller, A.2 , Michel, B.1 |
| 1 Fraunhofer IZM, Micro Materials Center Berlin and Chemnitz,
2 Qimonda Dresden GmbH & Co OHG, Dresden, Germany |
| Fast shear testing and FEM simulations for determination of dynamic mechanical behavior of SnAgCu BGA solder joints |
| |
| Keller, J.1, Gollhardt, A.2, Vogel, D.2,
Michel, B.2 |
| 1 AMIC GmbH, Berlin
2 Fraunhofer IZM, Micro
Materials Center, Berlin, Germany |
| Nanodeformation measurements for
reliability studies of nanosystems |
| |
| Khatibi, G.1, Zimprich, P.1, Wroczewski, W.1,
Groeger, V.1, Weiss, B.1,
Licht, T.2 |
| 1 University of Vienna, Austria
2 Infineon Technologies AG, Warstein, Germany |
| Quality assessment of interconnects by an accelerated
shear fatigue testing method |
| |
| Khromov, A., Bukhanko, A., Kocherov, E., Fedorchenko, D. |
| Samara State Aerospace University named after S.P.
Korolyov, Russia |
| Deformation states and fracture characteristics of plastic
materials |
| |
| Kim, J.Y., Choi, H.J., Lee, S.J., Kim, K.S., Lee, H.J. |
| Korea Institute of Machinery & Materials, Yuseong-gu Daejeon, Korea |
| Vertical bellows shape micro contact probe with variable
stiffness |
| |
| Klein, M.1, Oppermann, H.1, Hutter, M.1,
Fritzsch, T.1, Engelmann, G.1, Dietrich, L.1,
Wolf, J.1, Brämer, B.2, Dudek, R.2, Reichl,
H.1 |
| 1 Fraunhofer IZM, Berlin
2 Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany |
| Reliability investigation of large GaAs pixel detectors
flip chip bonded on Si readout chips |
| |
| Knoll, H.1, Berthold, L.1, Klengel, R.1,
Petzold, M.1, Rudolf, F.2, Müller, T.3 |
| 1 Fraunhofer IWMH, Halle/S.
2 Dresden University of Technology
3 W.C. Heraeus GmbH, Hanau, Germany |
| Quality and reliability investigations of Au bonding wires
coated with Al nanofilms |
| |
| Koglin, J. |
| FRT Fries Research & Technology GmbH, Bergisch Gladbach, Germany |
| Quality assurance and production
control of MEMS and wafers with multi-sensor metrology systems |
| |
| Kohl, R., Trageser, H., Schuch, B. |
| Conti Temic microelectronic GmbH, Nuremberg, Germany |
| Reliability aspects of automotive electronic control units
viewed from a TIER1 supplier perspective |
| |
| Köhler, B., Bendjus, B. |
| Fraunhofer IZFP, Dresden, Dresden, Germany |
| Test samples for micro- and nano- non-destructive evaluation |
| |
| Kornev, V. M. |
| Lavrentyev
Institute of Hydrodynamics, Novosibirsk, Russia |
| Two-scale model of crack propagation in high stress
fatigue |
| |
| Korobeynikov, S.N.1, Babichev, A.V.2 |
| 1 Lavrentyev Institute of Hydrodynamics, Novosibirsk
2 Institute of Geology and Mineralogy, Novosibirsk, Russia |
| Stability criteria for processes of nanostructures
deformation |
| |
| Kosobutskyy, P.S.1, Kosobutskyy, Ya.P.1,
Kushnir, O.P2. |
| 1 Lviv Polytechnic National University, Lviv
2 Lviv State Agrarian University, Dubljany, Ukraine |
| About a principle of the interferometric sensor creation |
| |
| Kozhushko, V., Hess, P. |
| University of Heidelberg, Germany |
| Nanoscopic mechanism of mode I and mode II fracture of Silicon |
| |
| Kozuki, K.1, Omiya, M.2, Kishimoto, K.1 |
| 1 Tokyo Institute of Technology
2 Keio University, Yokohama, Japan |
| Delamination behavior of hard film on soft substrate
during nano- and micro-indentation |
| |
| Krause, M., Graff, A. , Altmann, F. |
| Fraunhofer IWMH, Halle/S., Germany |
| Determination of residual stress in Silicon using electron
backscatter diffraction |
| |
| Kreyßig, K.4, Krahn, L.1, Auersperg, J.2, Zerna, T.3, Oppermann, M.3, Seiler, B.4, Keller, J.5, Ritzendorf, S.6, Scholz, G.6 , Mathiak, G.7, Schmidt, T.7, Magh, M.8 |
| 1 Fraunhofer IZM Paderborn,
2 Fraunhofer IZM Berlin/Chemnitz, Micro Materials Center,
3 TU Dresden, Zentrum für mikrotechnische Produktion,
4Chemnitzer Werkstoffmechanik GmbH, 5 AMIC Berlin,
6 Creos Lernideen Bielefeld,7 ZAVT GmbH Lippstadt,
8 Magh & Boppert Objektorientierte Softwareentwicklung Paderborn |
| BIZAM - Next generation consulting system for thermo-mechanical analyses in microelectronics and MEMS technologies |
| |
| Kübel, C.1, Lee, T.-C.2, Su, D.2,
Luo, J.-S.3, Russell, J.3 |
| 1 Fraunhofer IFAM, Bremen, Germany
2 Taiwan Semiconductor Manufacturing Company, Ltd.,
3 Inotera Memories, Physical Failure Analysis Department, Taiwan |
| Application of electron tomography for semiconductor
device analysis |
| |
| Kusnezoff, M.1, Trofimenko, N.1, Mosch, S.1,
Beckert, W.1, Graff, A.2, Altmann, F.2 |
| 1 Fraunhofer IKTS, Dresden
2 Fraunhofer IWMH, Halle/S., Germany |
| Stability of uLSM/8YSZ-interface in the
composite cathode at high current densities |
| |
| Lang, U., Dual, J. |
| ETH Swiss Federal Institute of Technology Zürich, Switzerland |
| Method for observing crack propagation in thin polymer
films |
| |
| Lavu,
S.1,3, Muratet, S.2, Fourniols, J.Y.2,
Abraham, E.1, Desmulliez, M.1, De Wolf, I.3 |
| 1 Hariot-Watt University, Edinburgh, UK
2 LAAS-CNRS 7, Toulouse, France
3 IMEC, Leuven, Belgium |
| Failure modes and mechanisms in MEMS thermal actuators |
| |
| Lee, J., Cho, C.S., Morris, J.E. |
| Portland State University, USA |
| Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed circuit boards |
| |
| Lempidaki, D.E., Kubler, R.F., Busso, E.P. O'Dowd, N.P., Nikbin, K. |
| Imperial College, London, UK |
| Development of a photogrammetric technique to determine crack tip strain fields at elevated temperatures |
| |
| Li, Q.1,2,3, Goosen, H.2, van Keulen, F.2,
van Beek, J.3, Zhang, G.Q.2,3 |
| 1 Netherlands Institute of Metals Research NIMR, Delft
2 Delft University of Technology
3 NXP Semiconductor, Eindhoven, The Netherlands |
| Assessment of testing methodologies for thin-film vacuum
MEMS packages |
| |
| Liu, J. |
| Chalmers University of
Technology, Gothenburg, Sweden, and Shanghai University, SMIT Center, China |
| Development of materials and processes for nanoelectronics packaging and interconnection |
| |
| Loboda, O.S., Krivtsov, A.M. |
| Institute of Problems of Mechanical Engineering of RAS,
St. Petersburg, Russia |
| Determination of elastic and strength properties of
nanostructures with complex crystal lattice using moment interaction at
microscale. Scale effects in elastic properties |
| |
| Luczak, F., Kämpfe, B., Urban |
| TU Berlin, Fraunhofer IZM, Micro Materials Center, Berlin, Germany, FHTW Berlin |
| Evaluation of diffraction patterns in high energy X-ray
analysis |
| |
| Maire, O.1, Chaillot, A.1, Munier, C.1,
Lombaert-Valot, I.1, Bousquet, S.2, Chastanet, C.2,
Plouseau, D.3, Munier, E.3, Maron, D.4,
Raynal, P.4, Villard, S.5, Dumonteil, R.5 |
| 1EADS CRC, Suresnes,
2AIRBUS France, Toulouse,
3EADS DCS, Elancourt,
4ACTIA, Toulouse,
5TECHCI, Saint-Génix sur Guiers, France |
| Reliability of components with Pb soldered in a lead-free
process (Green electronics for aeronautical and military communication
systems - GEAMCOS project) |
| |
| Matkowski, P.1, Urbanski, K.1, Falat, T.1,
Felba, J.1, Zaluk, Z.1, Dasgupta, A.2,
Pecht, M.G.2 |
| 1 Wroclaw University of Technology, Poland
2 The University of Maryland, CALCE, College Park, USA |
| Combined temperature cycle and vibration reliability test
of lead-free interconnections - event detection |
| |
| May, D.1, Schacht, R.2,1, Wunderle, B.1, Kreyssig, K.3,
Michel, B.1, Reichl, H.4,1 |
| 1 Fraunhofer IZM, Berlin
2 University of Applied Sciences Lausitz, Senftenberg,
3 AMIC GmbH, Berlin
4 Technical University Berlin, Germany |
| Advanced IR-thermography techniques for non-destructive
testing of microelectronic components |
| |
| Mazza, E.1, Schifferle, A.2 |
| 1 ETH Swiss Federal Institute of Technology Zürich
2 CSEM SA, Neuchatel,
Switzerland |
| A novel device for the mechanical characterization of
micro-beams |
| |
| McDonough, C., Geer, R. |
| University at Albany, SUNY, Albany, USA |
| High resolution strain analysis with NanoRaman
spectroscopy |
| |
| Meier, K.1, Wiese, S.1, Scholz, D.2,
Rzepka, S.2, Nocke, K.2, Luhmann, C.2, Röllig, M.1, Wolter, K.-J.1 |
| 1 Dresden University of Technology
2 Qimonda Dresden GmbH & Co. OHG, Dresden, Germany |
| Investigations on the dynamic elastic-plastic
behaviour of solder joints using a novel high strain rate experimental setup |
| |
| Mertin, W.1, Katzer, K.-D.1, Lochthofen,
A.1, Bacher, G.1, Jaeger, K.2,
Streubel, K.2, Furitsch, M.2, Brüderl, G.2, Hahn,
B.2, Strauss, U.2, Härle, V.2 |
| 1 University of
Duisburg-Essen, Duisburg, Essen
2 OSRAM Opto
Semiconductors, Regensburg, Germany |
| Nanoanalysis of optoelectronic emitters with
electrical scanning force microscopy |
| |
| Michel, B.1, Bombach, C.2, Winkler, T.2, Keller, J.3, Kaulfersch, E.4, Seiler, B.4 |
| 1 Fraunhofer IZM Berlin,
2 Berliner Nanotest und Design GmbH,
3 AMIC GmbHBerlin,
4 Chemnitzer Werkstoffmechanik GmbH |
| Analysis of Potential Failure Mechanisms in SOP Microsystems |
| |
| Middendorf, A.1, Griese, H.2, Nissen,
N.F.2, Reichl, H.1 |
| 1 Technical University of Berlin
2 Fraunhofer IZM, Berlin, Germany |
| The sustainability perspective of reliability for
microelectronics |
| |
| Middendorf, A.1, Keller, J.2 |
| 1 Technical University
of Berlin
2 AMIC GmbH, Berlin, Germany |
| Reliability aspect integration in the early stages of
design processes for mechatronic systems |
| |
| Mitic', S. |
| University of Niš, Serbia |
| Reliability of vibro-impact systems |
| |
| Miura, H., Suziki, K. |
| Tohoku University, Sendai, Japan |
| Effect of oxygen deficiency and carbon interstitials on
local band gap of Hafnium oxide thin films for nano-scale transistors |
| |
| Mohtaram, N.K.1, Goharpey, F.2 |
| 1 Iran Polymer and Petrochemical Institute, Tehran
2 Amirkabir University of Technology (Tehran Polytechnic), Tehran,
Iran |
| Study the effect of Montmorillonite on the crystallization
of Nylon-6/Clay nanocomposites synthesized by in-situ polymerization |
| |
| Moody, N.R.1, Kennedy, M. S.2,
Talin, A.A.1, Bahr, D.F.2, Reedy, E.D., Jr.3 |
| 1 Sandia National
Laboratories, Livermore,
2 Washington State
University, Pullman
3 Sandia National
Laboratories, Albuquerque, USA |
| Patterning interfaces for reliability of nanoscale thin
film devices |
| |
| |
| Morris, J. |
| Portland State University, USA |
| Nanopackaging: nanotechnologies and electronics packaging |
| |
| Müller, M., Wiese, S., Röllig, M., Wolter, K.-J. |
| Dresden University of Technology, Germany |
| Influence of size, cooling rate and
composition on the grain orientation of lead-free solder joints |
| |
| Müller, W. |
| Technical University of Berlin, Germany |
| Changes in the microstructure of materials and
its impact on reliability - experiments and modeling |
| |
| Müller, W. |
| Technical University of Berlin, Germany |
| How to extract continuum materials properties
for lead-free solders from tensile tests and nanoindentation experiments |
| |
| Murafa, N.1, Berka, L.2 |
| 1 Institute of Inorganic Chemistry, Prague
2 Czech Technical University in Prague, Czech Republic |
| Brittle properties of DLC layers deposited on the Si plate |
| |
| Ndip, I., Guttowski, S., Reichl, H. |
| Fraunhofer IZM, Berlin, Germany |
| M3-approach for reliable electrical design of
advanced packages and boards |
| |
| Nelle, P.1, Schneegans, M.1, Stecher, M.2,
Lilleodden, E.2 |
| 1 Infineon Technologies AG, Neubiberg
2 The GKSS Research Center, Geesthacht, Germany |
| Needle imprints and nanoindentation on pads over active
area |
| |
| Nieland, S., Bähr, M., Böttger, A. |
| SolarZentrum Erfurt, CiS Institut für Mikrosensorik GmbH, Erfurt,
Germany |
| Advantages of microelectronic packaging for reliable lead
free soldering of thin solar cells |
| |
| Niklas, J.R.1, Dornich, K.2 |
| 1 TU Bergakademie Freiberg
2 Freiberg Instruments GmbH, Freiberg, Germany |
| Contact-less topography and testing of electrical wafer
parameters |
| |
| Noack, E.1, Seiler, B.1, Sommer, J.-P.1,2,
Dost, M.1, Michel, B.2 |
| 1 Chemnitzer Werkstoffmechanik GmbH, Chemnitz,
2 Fraunhofer IZM, Micro Materials Center, Micro Materials
Center Berlin and Chemnitz, Germany |
| Deformation measurement for reliability assessment of
components with hidden dies |
| |
| Nowack, M.1, Reuter, D.1, Rennau, M.1,
Bertz, A.1, Geßner, T.1,2 |
| 1 Chemnitz University
of Technology
2 Fraunhofer IZM, Berlin, Germany |
| Wafer-level active testing of capacitive inertial sensors |
| |
| Nuffer, J., Platz, R., Friedmann, A., Atzrodt, H., Mayer, D. |
| Fraunhofer LBF, Darmstadt, Germany |
| Reliability investigation of a mechatronic interface for
active vibration reduction |
| |
| Obreja, V.V.V.N.1, Svasta, P.M.2 |
| 1 National R&D Institute for Microtechnology
(IMT – Bucuresti)
2 Politehnica University Bucharest, Romania |
| The semiconductor - dielectric interface from PN junction
periphery and its influence on reliability of power devices at high
temperature |
| |
| Ocana, I.1, Molina-Aldareguia, J.M.1, Gonzalez,
D.1, Elizalde, M.R.1,
Sanchez, J.M. 1, Martinez-Esnaola, J.M.1 ,
Gil-Sevillano, J.1, Pantuso, D.2,
Sun, B.2, Xu, G.2, He, J.2, Maiz, J.2 |
| 1 CEIT, San Sebastian, Spain
2 Intel Corporation, Hillsboro, USA |
| Adhesion studies in integrated circuit interconnect structures |
| |
| Okolo, B., Rögner, J., Kerscher, E., Beck, T., Schulze, V., Wanner,
A.,
Löhe, D. |
| University of Karlsruhe, Germany |
| Size effects in Aluminium bronze cast specimens |
| |
| Omiya, M.1, Kishimoto, K.2 |
| 1 Keio University, Yokohama
2 Tokyo Institute of Technology, Japan |
| UV-ray irradiation effects on channeling crack formation
of ceramic thin film on polymer substrate |
| |
| Osten, W. |
| University of Stuttgart, Germany |
| Resolution enhanced approaches in optical
metrology |
| |
| Pecht, M.G. |
| CALCE, University of Maryland, College Park, USA |
| New Methods to Predict Reliability of Electronics |
| Perelmuter, M. |
| Institute of Problems in Mechanics, Moscow, Russia |
| Physical-mechanical modelling of nanocomposites strength and facture |
| |
| Petzold, M.1, Klengel, R.1,
Knoll, H.1, Schischka, J.1, Altmann, F.1,
Müller, T.2, Chung, E.K3. |
| 1 Fraunhofer IWMH, Halle/S.
2 W.C. Heraeus GmbH, Hanau, Germany
3 Heraeus Oriental HiTec Co., Korea |
| Nanoreliability of Au wire bonding interconnects |
| |
| Pryputniewicz, R.J., Pryputniewicz, E.J. |
| Worcester Polytechnic Institute, USA |
| Operational reliability of a photonic MEMS system |
| |
| Pufall, R., Kanert, W., Goroll, M., Aresu, S. |
| Infineon Technologies AG, Neubiberg, Germany |
| Lifetime prediction - The need for a new qualification
approach for automotive due to the lack of acceleration factors |
| |
| Pugno, N. |
| Politecnico di Torino, Italy |
| Macroscopic invisible cables |
| |
| Radraraju, N.P., Morris, J.E. |
| Portland State University, USA |
| Reliability testing of nano-particle system packaging |
| |
| Radojevic,
V.1, Lamovec, J.2, Jovic, V.2, Trifunovic',
D.1, Aleksic, R.1 |
| 1 University of Belgrade
2 IChTM-Department of Microelectronic Technologies
and
Single Crystals, Belgrade, Serbia |
| Analysis of the micromechanical properties of
electrodeposited Ni coatings on different substrates |
| |
| Ranatowski, E. |
| University of Technology and Life Science, Bydgoszcz, Poland |
| Some remarks on the constraint effect at interface of the
thin layer in mismatched welded joints |
| |
| Ranatowski, E. |
| University of Technology and Life Science, Bydgoszcz, Poland |
| Thermal modelling of laser welding |
| |
| Ranganathan, N.1, Vasques, B.1, Joly, D.1,
Bouchou, A.1, Leroy, R.1,
Beake, B.2 |
| 1 University of Tours, LMR, CEROC, France
2 Micro Materials, Wrexham, UK |
| A study of the nanoimpact resistance of hard coatings |
| |
| Rangu, M.1, Svasta, P.M.2 |
| 1 Politehnica University of Timisoara
2 Politehnica University of Bucharest, Romania |
| Computer aided design techniques for fine tuning the
printed circuit traces impedances |
| |
| Röllig, M., Wiese, S., Meier, K., Müller, M., Wolter, K.-J. |
| Dresden University of Technology, Germany |
| Experimental method for creep measurements on real package
solder joints on the example of SnAg3.5 alloy |
| |
| Roth, H., Röder, M. |
| Phoenix X-ray Systems, Stuttgart, Germany |
| nanoCT: Visualising of internal 3D-Structures with submicrometer
resolution |
| |
| Rouet, V.1, Delye, A.1, Vichare, N.2,
Pecht, M.G.2, Foucher, B.1 |
| 1 EADS France, Suresnes, France
2 The University of Maryland, CALCE EPSC, College Park , USA |
| Embedded remaining life prognostics and
diagnostics of electronics |
| |
| Rümmler, N.1, Schnitzer, R.1, Michel,
B.2 |
| 1 Amitronics GmbH, Seefeld
2 Fraunhofer IZM, Micro
Materials Center, Berlin, Germany |
| Experimental vibration and deformation
analyses for increase micro-structure reliability |
| |
| Rzepka, S. |
| Qimonda Dresden GmbH & Co. OHG, Dresden, Germany |
| The effect of visco-elasticity on the results of lifetime
prediction of BGA modules under thermal cycle loads by FEM analysis |
| |
| Sabaté, N.1, Vogel, D.2, Gollhardt,
A.2, Keller, J.2, Marcos, J.1, Gràcia, I.1,
Cané, C.1, Michel, B.2 |
| 1 Autonomous University
of Barcelona, Spain
2 Fraunhofer IZM, Micro Materials Center, Berlin, Germany |
| Confined residual stress measurements on thin films
deposited onto thick substrates with a FIB equipment |
| |
| Saka, M.1, Kohara, T.1, Hasegawa, T.1,
Yamashita, M.2 |
| 1 Tohoku University, Sendai
2 Fuji Electric Advanced Technology Co. Ltd., Tokyo, Japan |
| A simple method for testing electromigration resistance of
solders |
| |
| Schacht, R.1, Meli, E.2, May, D.3, Wittler, O.3, Wunderle, B.3, Michel, B.3, Reichel, H.2,3 |
| 1 University of Applied Sciences Lausitz, Senftenberg, Germany,
2 Technical University Berlin, Germany,
3 Fraunhofer IZM Berlin, Germany |
| Effective thermal material models for multi layer PCBs with thermal vias |
| |
| Schimpf, C.1, Feldmann, K.1, Matzner, C.1, Steinke, A.2 |
| 1 University of Erlangen-Nuremberg, Erlangen
2 CiS Institut für Mikrosensorik GmbH, Erfurt, Germany |
| Failure of electronic devices due to condensation |
| |
| Schindler, S.1, Dresbach, C.2, Wolter, K.-J.1,
Petzold, M.2 |
| 1 Dresden University of Technology
2 Fraunhofer IWMH, Halle/S., Germany |
| The influence of bond process parameters on
the microstructure of bonding wires |
| |
| Schindler-Saefkow, F.1, Jagle, M.2, Wunderle, B.3, Böttner, H.2, Nurnus, J.4 |
| 1 Nanotest und Design GmbH Berlin,
2 Fraunhofer IPM, Freiburg,
3 Fraunhofer IZM Berlin, Micro Materials Center, Berlin,
4 Micropelt GmbH, Freiburg, Germany |
| Thermal-electric simulation of micropeltier elements for hot spot cooling |
| |
| Schischka, J., Altmann, F., Krause, M., Knoll, H., Petzold, M. |
| Fraunhofer IWMH, Halle/S., Germany |
| EBSD grain microstructure investigation of electronic
materials down to the nanoscale |
| |
| Schneider, D., Schultrich, B. |
| Fraunhofer IWS, Dresden, Germany |
| Testing thin films and surfaces by the laser-acoustic test
method LA wave |
| |
| Schnitzer, R.1, Rümmler, N.1, Dost,
M.2, Michel, B.3, Hauck, T.4 |
| 1 Amitronics GmbH, Seefeld
2 Chemnitzer Werkstoffmechanik GmbH, Chemnitz
3 Fraunhofer IZM, Micro Materials Center,
Berlin
4 Freescale Halbleiter
Deutschland GmbH, Munich, Germany |
| Experimental vibration analyses by laser
vibrometer under vacuum conditions |
| |
| Schulze, K., Schulz, S.E., Geßner, T. |
| Chemnitz University of Technology, Germany |
| Thermal behavior of interconnect systems: A comparison of
low-k, air gap and SiO2 integration |
| |
| Schwaiger, R. |
| University of Karlsruhe / Forschungszentrum Karlsruhe, Germany |
| Mechanical properties in small dimensions |
| |
| Sedmak, S., Kiric, M., Sedmak, A. |
| University of Belgrade, Serbia |
| The reliability criteria and
failure modes in fracture mechanics |
| |
| Seiler,
B.1, Noack, E.1, Sommer, J.-P.2, Dost, M. 1, Michel, B.2 |
| 1 Chemnitzer Werkstoffmechanik GmbH (CWM), Chemnitz
2 Fraunhofer IZM, Micro Materials Center, Berlin and
Chemnitz, Germany |
| Design support for advanced radar sensors |
| |
| Shamshirsaz, M.1, Gheisarieha, M.2, Maroufi, M.1 |
| 1 Amirkabir University of Technology (Tehran Polytechnic), Tehran
2 Sharif University of Technology, Tehran, Iran |
| Influence of material stiffness and geometrical variations
on the electro-thermally driven microactuator performance |
| |
| Shaporin, A., Doetzel, W., Mehner, J. |
| Chemnitz University of Technology, Germany |
| Test-structures for MEMS reliability analysis |
| |
| Shodja, H.M.1, Keshavarzzadeh, V.1, Yavari, A.2 |
| 1 Sharif University of Technology, Tehran, Iran
2 Georgia Institute of Technology, Atlanta, USA |
| Simulation of crystalline defects in the atomic scale using
a lattice theory |
| |
| Shodja, H.M., Kamalzare, M. |
| Sharif University of Technology, Tehran, Iran |
| The elastic fields of two interacting nano-voids in fcc
materials via the many body atomic scale FEM |
| |
| Simonov, I. V., Sirotin, A.A. |
| Institute for Problems in Mechanics of the RAS, Moscow, Russia |
| Microfibers testing by electromagnetic radiation method |
| |
| Sklyar, R. |
| Lviv, Ukraine |
| The microfluidic sensors based on the CNT or
organic FETs |
| |
| Smorodin, T.1, Wilde, J.2, Stecher, M.1 |
| 1 Infineon Technologies AG, Munich
2 University of Freiburg, IMTEK, Germany |
| Crack propagation in the interlayer dielectric of a power
technology metallization under fast temperature-cycle stress |
| |
| Sommer, J.-P.1, Michel, B.1, Petzold, M.2, Schönecker, A.3, Kusnezoff, M.3, Wunderle,
B.1 |
| 1 Fraunhofer IZM, Micro Materials Center,
Berlin
2 Fraunhofer IWMH, Halle/S.
3 Fraunhofer IKTS, Dresden, Germany |
| Nano-reliability within the framework of
Fraunhofer market-oriented nano-scale activities |
| |
| Song, X., Zhang, S.Y., Korsunsky, A.M. |
| University of Oxford, UK |
| Analysis of energy dissipation at the micro-level during
fatigue of crystals and polycrystals |
| |
| Souchon, F., Charvet, P.L. |
| CEA-LETI-MINATEC, Grenoble, France |
| Failure analyses study on MEMS switches due to
dielectric charging |
| |
| Souchon, F., Charvet, P.L., Maeder-Pachurka, C., Audoin,
M. |
| CEA-LETI-MINATEC, Grenoble, France |
| Identification of dielectric charging on MEMS switches |
| |
| Stojanovic, D.1, Radojevic, V.1, Tang, C.Y.2, Chen, D.Z.2, Uskokovic, P.S.2, Aleksic, R.1 |
| 1 University of Belgrade, Belgrade, Serbia,
2 Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China |
| Nanomechanical properties of silane coated silica-poly(methylmethacrylate) nanocomposites |
| |
| Striegler, A., Bendjus, B., Köhler, B. |
| Fraunhofer IZFP, Dresden, Germany |
| The potential of the Atomic Force Acoustic Microscopy for
visualisation of subsurface voids |
| |
| Suhir, E. |
| University of California, Santa Cruz, USA |
| Dynamic response of micro- and opto-electronic systems to
shocks and vibrations |
| |
| Suñé, J.1, Wu, E.2, Tous, S.1 |
| 1 Autonomous University of Barcelona
2 IBM Microelectronics Division, Essex Junction, Spain |
| Physics-based percolation model for the breakdown of
ultra-thin (down to 1 nm) gate oxides for advanced CMOS |
| |
| Tabanyukhova, M.V. |
| The Novosibirsk State University of Architecture and Civil
Engineering (NGASU), Novosibirsk, Russia |
| Photoelastic analysis of fracture mechanic problems in
elements with angular notches |
| |
| Takao, H.1,3, Hayama, K.2, Tanaka, N.1,
Ohyama, H.2, Ishida, M.1,3 |
| 1 Toyohashi University of Technology
2 Kumamoto National College of Technology
3 Japan Science and Technology Agency, JST-Crest, Japan |
| Radiation resistance of ‘MOSFET-like MEMS microvalve’ for
highly reliable microfluidic integrated circuits |
| |
| Tilgner, R. |
| Infineon Technologies AG, Munich, Germany |
| Physics of Failure (PoF) for interconnect structures - an
essay |
| |
| Töpper, M.1,2, Hoferling, K.2, Defo Kamga, F.1, Reichl, H.1 |
1 Fraunhofer IZM / TU-Berlin, Berlin, Germany
2 University of Utah, Salt Lake City, USA
|
| Copper migration in thin film polymers |
| |
| Turbini, L.1, Caputo, A.2 |
| 1 RIM Research In Motion, Waterloo, Ontario
2 University of Toronto, Ontario, Canada |
| Design limitations related to Conductive Anodic Filament
(CAF) formation in a micro-world |
| |
| Urbanski, K., Wymyslowski, A., Matkowski, P., Falat, T. |
| Wroclaw University of Technology, Poland |
| Application of an Ethernet microcontroller in a fast data
acquisition system for long-term reliability tests of microelectronic
interconnections |
| |
| Uruska, D., Friedel, K |
| Wroclaw University of Technology, Poland |
| Stress induced on the MEMS active surface and deformation
of MEMS due to moulding of MEMS/ASIC system |
| |
| van der Sluis, O.1,2, van Silfhout, R.B.R.1,
Engelen, R.A.B.1, van Driel, W.D.2,3, Zhang, G.Q.2,3 |
| 1 Philips Applied Technologies, Eindhoven
2 Delft University of Technology
3 NXP Semiconductors, Nijmegen, The Netherlands |
| Energy-based damage sensitivity analysis of complex 3D
structures with an application to IC bond pads |
| |
| van Driel, W.D.1,2, Yang, D.G.1,
Theunis, F.1, Zhang, G.Q.2 |
| 1 NXP Semiconductors, Nijmegen,
2 Delft University of
Technology, The Netherlands |
| Challenges for MEMS packaging: Capping |
| |
| Vecchione, N., Balint, D.S., Wasmer, K.*, Nikbin, K.M. |
| Imperial College, London, U.K.,
*EMPA, Thun, Switzerland |
| Characterisation of EB-PVD Zirconia by Nanoindentation |
| |
| Vermeulen, A.C., Fransen, M. |
| PANalytica, Almelo, The Netherlands |
| A new method for determining the residual stresses in
coatings |
| |
| Villain, J., Corradi, U., Weippert, C., Meeh, M. |
| University of Applied Sciences Augsburg, Germany |
| Nano hardness of differently oriented Tin
crystals in small solder joints |
| |
| Vogel, D.1, Gollhardt, A. 1, Sabate, N. 2, Michel, B. 1 |
| 1 Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany,
2 Centre Nacional de Microelectrònica (CNM-CSIC), Bellaterra, Spain |
| Data evaluation issues for stress release measurements on MEMS layers |
| |
| Vormoor, M. |
| BMW Bayerische Motoren Werke AG, Munich, Germany |
| Increase of safety – better visibility by self-cleaning
glasses |
| |
| Walter, H.1,4, Seiler, B.2, Bombach,
C.3, Michel, B.4 |
| 1 AMIC Angewandte
Micro-Messtechnik GmbH, Berlin
2 Chemnitzer
Werkstoffmechanik GmbH, Chemnitz
3 Berliner Nanotest und
Design GmbH, Berlin
4 Fraunhofer IZM, Micro
Materials Center, Berlin, Germany |
| Determination of Poisson’s ratio of electronic packaging
materials dependent on temperature by means of UNIDAC-method |
| |
| Wang, T.H., Lee, C.-C., Lai, Y.-S. |
| Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung, Taiwan |
| Evaluation of thermal characteristics and thermomechanical
reliability of board-level stacked-die packages subjected to coupled power
and thermal cycling test conditions |
| |
| Wang, Y.-Q., Lou, W.-Z., Fan, N.-J., Hao, J.-W. |
| Beijing Institute of Technology, Beijing, China |
| Study on fault diagnostic strategy of intelligence
magnetic detection microsystem |
| |
| Wiemer, M.1, Frömel, J.1, Bagdahn,
J.2, Knechtel, R.3 |
| 1 Fraunhofer IZM, Chemnitz
2 Fraunhofer IWMH, Halle/S.
3 X-Fab Semiconductor
Foundries AG, Germany |
| Waferbond technology and quality assessment |
| |
| Wiese, S., Röllig, M., Müller, M., Wolter, K.-J. |
| Dresden University of
Technology, Germany |
| The effect of size and composition on the
creep of lead-free solders |
| |
| Wilde, J., Fischer, S. |
| University of Freiburg, IMTEK, Germany |
| Modelling of polymer-based nano-composite materials for
the reliability prediction of microsystems |
| |
| Winkler, T. |
| Berliner Nanotest und Design GmbH |
| EUCEMAN – The European center for micro- and
nanoreliability |
| |
| Wittler, O.1, Schindler-Saefkow, F.1,
Schreier-Alt, T.2, Michel, B.1 |
| 1 Fraunhofer IZM, Micro
Materials Center, Berlin
2 Fraunhofer IZM, Munich,
Germany |
| Assessment of package induced stresses for
sensor applications |
| |
| Wittler, O., Auerswald, E., Dermitzaki, E., Gollhardt, A., May, D.,
Schmitz, St., Wunderle, B., Michel, B. |
| Fraunhofer IZM, Micro Materials Center, Berlin, Germany |
| A test system for ensuring material reliability in micro- and nanoelectronics developed at Fraunhofer Micro Materials Center, IZM Berlin |
| |
| |
| Wolf, M.J., Reichl, H. |
| Fraunhofer IZM, Berlin, Germany |
| Systemintegration - requirements and technology |
| |
| Wolf, J.1, Raudzis, C.1, Mueller-Fiedler, R.1,
Seidel, H.2 |
| 1 Robert Bosch GmbH, Stuttgart
2 Saarland University, Saarbrücken, Germany |
| Novel resonant sensors for measuring the
influence of package-induced stress on inertial sensors |
| |
| Wondrak, W., Senske, W. |
| DaimlerChrysler AG, Böblingen, Germany |
| Future reliability concepts for automotive electronics |
| |
| Wunderle, B., Michel, B. |
| Fraunhofer IZM, Micro Materials Center, Berlin |
| Progressing from micro- to nanoreliability in system
integration |
| |
| Yang, P.-F.1,2, Jian, S.-R.3, Lai, Y.-S.1,
Chen, R.-S.2 |
| 1 Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung
2 National Cheng Kung University, Tainan
3 National Chiao Tung University, Hsinchu, Taiwan |
| Characterizations of ZnO thin films deposited onto
langasite substrates by r.f. magnetron sputtering |
| |
| Yasuoka, M., Doi, B.S., Ando, I. |
| Nachi-Fujokoshi Corporation, Toyama, Japan |
| Ultralong fatigue estimation of cemented carbide WC-Co |
| |
| Yu, S.-W., Yu, L., Feng, X.-Q. |
| Tsinghua University, Beijing, China |
| Effects of fatigue and damage on the hysteresis loops of
ferroelectric ceramics |
| |
| Yu, X.-L., Lou, W.H., Ma, B.Z., Wang, Y.-Q. |
| Beijing Institute of Technology, China |
| Based on microsystems distributed BIT
diagnostic network for robot |
| |
| Yuan, C.1, Dawotola, A.W.1, van der Sluis, O.1,
Zhang, G.Q.1, Ernst, L.J.1,
van Driel, W.D.2, van Silfhout, R.B.R.3, Thijsse, B.J.1 |
| 1 Delft University of Technology
2 NXP Semiconductors, Nijmegen
3 Philips Applied Technologies, Eindhoven, The Netherlands |
| Molecular dynamics simulation on Silicon based materials
and their interface |
| |
| Zacharopoulos, D.A., Pategakis, S., Plistakas, N. |
| Democritus University of Thrace, Xanthi, Greece |
| Approach on the problem of crack path stability at
different test specimens |
| |
| Zhang, G.Q.1,2, van Driel, W.D.1,2,
Yuan, C.2 |
| 1 NXP Semiconductors, Nijmegen
2 Delft University of
Technology, The Netherlands |
| The impact of materials on nanoelectronics |
| |
| Zhuravliov, V.I., Alexeev, V.F. |
| Belarusian State University of Informatics
and Radioelectronics, Minsk, Belarus |
| Critical temperature estimation of heating of
semiconductor devices at HEMP actions |
| |
| Zimprich, P., Saeed, U., Betzwar-Kotas, A., Khatibi, G., Weiss, B.,
Ipser, H. |
| University of Vienna, Austria |
| Miniaturized lead-free solder joints and their response to
dimensional constraints |
| |
| Zschech, E., Meyer, M.A., Vairagar, A.V., Zienert, I., Langer, E., Hecker, M., Geisler, H., Engelmann, H.J. |
| AMD Saxony LCC & Co. KG, Dresden, Germany |
| Metal interconnect micro- and nanostructure and electromigration-induced damage mechanisms |
| |
| Zschenderlein, U.1, Kämpfe, B.2,
Schultrich, B.3, Fritsche, G.1 |
| 1 Chemnitz University
of Technology
2 Fraunhofer IZM, Micro Materials Center, Berlin
3 Fraunhofer IWS,
Dresden, Germany |
| Application of energy dispersive X-ray diffraction for the
efficient investigation of internal stresses in thin films |
| |
| Zschenderlein, U.1, Frühauf, J.1,
Straube, H.1, Gärtner, E.2, Kämpfe, B.3,
Luczak, F.3, Zimny, F.4, Petrick, H.4,
Böhme, H.5 |
| 1 Chemnitz University
of Technology
2 SiMETRICS GmbH,
Limbach-Oberfrohna
3 Fraunhofer IZM, Micro
Materials Center, Berlin
4 Petrick GmbH, Bad
Blankenburg
5 FMP Holding GmbH, Freiberg, Germany |
| X-ray optics manufactured by microtechnology for ED XRD
systems |
| |
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