Microreliability 2007

Tutorial title:	Reliability Issues in Electrically Conductive Adhesives
Organizer:	Professor James E. Morris, Portland State University
Instructor(s):	Professor James E. Morris, Portland State University
Importance of topic:	Electrically conductive adhesives provide viable alternatives to no-Pb solders in many applications for the RoHS world. An informed decision of which to use in a specific case requires a fundamental understanding of the materials and their failure modes.
Aim of course:	Electrically conductive adhesives (ECAs) provide environmentally friendly interconnect alternatives to solder, with applications from flip-chip to surface-mount, with ECA technologies exhibiting advantages and disadvantages in these applications. The course explores both isotropic and anisotropic conductive adhesives (ICAs and ACAs,) and anisotropic conductive films (ACFs) in a comprehensive coverage of the technologies in terms of basic scientific principles. Ultimately, however, the primary topic of the course is the understanding of failure mechanisms for improvement of reliability. The objective is for attendees to take away an understanding of the basic principles of operation of each technology, and knowledge of their more common failure modes, with the resulting ability to maximize reliability.
Who should attend:	The course will be beneficial to electrical, mechanical, and materials engineers alike, or anyone with an interest in electronic device design, fabrication, assembly, or application. The level will be accessible to students and graduates in any of these areas, or the physical sciences.
Outline:	Introduction to Electrically Conductive Adhesives Environmental pressures and solder Isotropic conductive adhesives Anisotropic conductive adhesives Non-conductive adhesives Materials: polymers and metals Adhesion Anisotropic Conductive Adhesives and Film Hard spheres and polymer beads; random distributions Electrical and mechanical modeling; failure modes Processing for reliability ACF technologies for reliability Isotropic Conductive Adhesives ICA Structure Percolation & electrical modeling Electrical properties and testing Mechanical properties Processing for reliability Reliability: Moisture and galvanic corrosion Reliability: Mechanical and thermo-mechanical Thermal properties and reliability
About the instructors	James E. Morris is a Professor of Electrical & Computer Engineering at Portland State University, Oregon, Professor Emeritus at the State University of New York at Binghamton, and an IEEE Fellow. His B.Sc. and M.Sc. (with 1st Class Honors in Physics) degrees are from the University of Auckland, New Zealand, and the Ph.D. in Electrical Engineering is from the University of Saskatchewan, Canada.. He has served as Department Chair at both Binghamton and Portland, and was the first Director of Binghamton’s Institute for Research in Electronics Packaging. Professor Morris was Treasurer of the IEEE Components, Packaging, and Manufacturing Technology Society from 1991 until 1997, Vice-President for Conferences from 1998 until 2003, is now an IEEE-CPMT Distinguished Lecturer, and won the 2005 CPMT David Feldman Outstanding Contribution Award. He is an Associate-Editor of the IEEE Transactions on Components and Packaging Technology, with responsibility for Adhesives, and has edited four books on electronics packaging, including one this year on nanopackaging. He was General Chair of the Adhesives in Electronics conference in 1998, of the 2001 International Symposium & Exhibition on Advanced Packaging Materials, and of Polytronic 2004. His research activities are currently focused on electrically conductive adhesives and the electrical conduction mechanisms in discontinuous thin metal films, with application to single-electron transistor nanoelectronics. He is also actively involved in the promotion of international educational exchanges, and in Internet education.

T6 - Reliability issues of electrically conductive adhesives