Overview Programme

MicroNanoReliability Congress

Berlin, Sept. 2-5, 2007

Advance programme July 24, 2007

Time schedule

Sunday, Sept. 2

14:00 - 17:30 10 tutorials parallel

Monday, Sept. 3

09:00 – 12:00 6 parallel sessions

13:00 – 18:00 Opening plenary session

Parallel: Poster exhibition and Exhibition

Tuesday, Sept. 4

08:30 – 12:15 5 parallel sessions

1 Special workshop

13:30 – 18:00 6 parallel sessions

Parallel: Poster exhibition and Exhibition

Wednesday, Sept. 5

08:30 – 12:00 6 parallel sessions

13:00 – 16:00 Plenary session

Parallel: Poster exhibition and Exhibition

Monday, Sept. 3, Opening Plenary Session

Chairmen: B. Michel (Fraunhofer IZM, MMCB, Berlin and Chemnitz, Germany )

G.Q. Zhang ( Delft University of Technology, The Netherlands )

K. Kishimoto (Tokyo Institute of Technology, Japan )

M. Pecht ( University of Maryland, CALCE, College Park, USA )


13:00	Michel, B.
		Fraunhofer IZM Berlin
	Congress opening

13:10	Buller, U.
		Vice President, Fraunhofer Society, Munich
	Opening address

13:30	Michel, B., Winkler, T.
		European Center for Micro- and Nnanoreliability EUCEMAN
	Presentation of EUCEMAN Reliability Awards

Chairmen: B. Michel (Fraunhofer IZM, MMCB, Berlin and Chemnitz, Germany )

L. Heinze (VDI/VDE-IT, Berlin, Germany )


13:35	Geßner, T.
		Chemnitz University of Technology / Fraunhofer IZM, Chemnitz, Germany
	Smart systems integration and reliability

14:05	Zhang, G.Q.^1,2, van Driel, W.D.^1,2, Yuan, C.²
		¹ NXP Semiconductors, Nijmegen ² Delft University of Technology, The Netherlands
	The impact of materials on nanoelectronics

14:30	Dauskardt, R.H.
		Stanford University, Stanford, USA
	Fracture and reliability in Cu/low-k interconnect structures: Role of process variables and packaging

14.55 – 15.20 Coffee break

Monday, Sept. 3, Plenary Session II

Chairmen: K. Kishimoto (Tokyo Institute of Technology, Japan )

M. Meyyappan (Center for Nanotechnology, NASA Ames Research Center, Moffett Field, USA )


15:20	Pecht, M.
		CALCE, University of Maryland, College Park, USA
	New methods to predict reliability of electronics

15:45	Foucher, B.
		EADS Innovation Works, Suresnes, France
	The reliability issues of electronics in aeronautics

16:10	Bailey, C.
		University of Greenwich, London, U.K.
	Multi-physics analysis as a key enabler for reliability of 3D micro-engineered products

16:35	Pryputniewicz, R.J., Pryputniewicz, E.J.
		Worcester Polytechnic Institute, USA
	Operational reliability of a photonic MEMS system

17.00 – 17.25 Coffee break

Monday, Sept. 3, Plenary Session III

Chairmen: R. Pufall (Infineon Technologies, Neubiberg, Germany )

R. Aschenbrenner (Fraunhofer IZM, Berlin, Germany)


17:25	McDounough, C., Geer, R.E.
		Nanotech Albany, USA
	High resolution strain analysis with nanoRaman spectroscopy

17:50	Yu, S.-W., Yu, L., Feng, X.-Q.
		Tsinghua University, Beijing, China
	Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramics

18:15	Wunderle, B., Michel, B.
		Fraunhofer IZM, Micro Materials Center, Berlin
	Progressing from micro- to nanoreliability in system integration

18.40 Closure

Wednesday, Sept. 5, Plenary Session IV

Chairmen: J. Liu ( Chalmers University of Technology, Gothenburg, Sweden , and Shanghai University, SMIT Center, China )

G. Bachmann (VDI-Technologiezentrum, Düsseldorf, Germany)


13:00	Moody, N.R.¹, Kennedy, M. S.², Talin, A.A.¹, Bahr, D.F.², Reedy, E.D., Jr.³
		¹ Sandia National Laboratories, Livermore, ² Washington State University, Pullman ³ Sandia National Laboratories, Albuquerque, USA
	Patterning interfaces for reliability of nanoscale thin film devices

13:25	Zschech, E., Meyer, M.A., Vairagar, A.V., Zienert, I., Langer, E., Hecker, M., Geisler, H., Engelmann, H.J.
		AMD Saxony LCC & Co. KG, Dresden, Germany
	Metal interconnect micro- and nanostructure and electromigration-induced damage mechanisms

13:50	Saka, M.¹, Kohara, T.¹, Hasegawa, T.¹, Yamashita, M.²
		¹ Tohoku University, Sendai ² Fuji Electric Advanced Technology Co. Ltd., Tokyo, Japan
	A simple method for testing electromigration resistance of solders

14.15 – 14.20 Short break

Wednesday, Sept. 5, Plenary Session V

Chairmen: S. Rzepka ( Qimonda Dresden, Germany )

K.-D. Lang (Fraunhofer IZM, Berlin, Germany)


14:20	Albrecht, H.-J.
		Siemens AG, Berlin, Germany
	Technical reliability of miniaturized lead-free solder interconnects

14:45	Liu, J.
		Chalmers University of Technology, Gothenburg, Sweden and Shanghai University, SMIT Center, China
	Development and characterization of nano-solders, nano-conductive adhesives, nano-thermal interface materials, and nano-carbon tube based interconnects and cooling devices

15:10	Wondrak, W., Senske, W.
		DaimlerChrysler AG, Böblingen, Germany
	Future reliability concepts for automotive electronics

15:35	Alsem, D.H.¹, Boyce, B.L.², Stach, E.A.³, Ritchie, R.O.^1,4
		¹ Lawrence Berkeley National Laboratory, Berkeley ² Sandia National Laboratory, Albuquerque ³ Purdue University, West Lafayette ⁴ University of California, Berkeley, USA
	High-cycle fatigue of micron-scale Silicon structural films for MEMS applications

16.00 Closure

Monday, Sept. 3, 9:00 - 10:25, Early Morning Session,
Micro- and Nanomaterials I Room A

Chairmen: W.W. Gerberich ( University of Minnesota, Minneapolis, USA )

H. Fecht ( University of Ulm / FZ Karlsruhe, Germany )


10:45	Fecht, H.
Key-note		University of Ulm / Forschungszentrum Karlsruhe, Germany
	Properties and applications of nanocrystalline CVD-grown diamond, MicroDevice fabrication and microreliability

11:10	Murafa, N.¹, Berka, L.²
		¹ Institute of Inorganic Chemistry, Prague ² Czech Technical University in Prague, Czech Republic
	Brittle properties of DLC layers deposited on the Si plate

11:30	Miura, H., Suziki, K.
		Tohoku University, Sendai, Japan
	Effect of oxygen deficiency and carbon interstitials on local band gap of Hafnium oxide thin films for nano-scale transistors

11:50	Schulze, K., Schulz, S.E., Geßner, T.
		Chemnitz University of Technology, Germany
	Thermal behavior of interconnect systems: A comparison of low-k, air gap and SiO₂ integration

10.25 – 10.45 Coffee break

Monday, Sept. 3, 9:00 - 10:25, Early Morning Session,
Reliability analysis and modelling I Room B

Chairmen: A. Dommann (CSEM Neuchatel, Switzerland)

L.J. Ernst ( Delft University of Technology, The Netherlands )


09:00	Rzepka, S.
Key-note		Qimonda Dresden GmbH & Co. OHG, Dresden, Germany
	The effect of visco-elasticity on the results of lifetime prediction of BGA modules under thermal cycle loads by FEM analysis

09:25	de Vreugd, J., Jansen, K.M.B., Bohm, C.
		Delft University of Technology, The Netherlands
	Modeling the effect of physical aging on viscoelastic properties of a molding compound

09:45	Feng, W., Frémont, H., Verdier, F., Plano, B.
		University Bordeaux I, IMS Laboratory, ENSEIRB, France
	Simple analytical model for thermally-induced warpage of PoP

10:05	Fałat, T., Friedel, K.
		Wrocław University of Technology, Poland
	TSV constraints related to temperature excursion, pressure during moulding and materials used

10.25 – 10.45 Coffee break

Monday, Sept. 3, 9:00 - 10:25, Early Morning Session,
Modelling I Room C

Chairmen: K.-J. Wolter ( Dresden University of Technology, Germany )

R.V.Goldstein (Institute for Problems in Mechanics, Moscow, Russia )


09:00	Goldstein, R.V., Shushpannikov, P.S., Utinov, K.B.
Key-note, invited		Institute for Problems in Mechanics of RAS, Moscow
	Modelling of formation of systems SiO₂ precipitate – dislocation loops in Silicon wafers

09:25	Song, X., Zhang, S.Y., Korsunsky, A.M.
		University of Oxford, UK
	Analysis of energy dissipation at the micro-level during fatigue of crystals and polycrystals

09:45	Shodja, H.M.¹, Keshavarzzadeh, V.¹, Yavari, A.²
		¹ Sharif University of Technology, Tehran, Iran ² Georgia Institute of Technology, Atlanta, USA
	Simulation of crystalline defects in the atomic scale using a lattice theory

10:05	Albaut, G.N.
		The Novosibirsk State University of Architecture and Civil Engineering (NGASU), Novosibirsk, Russia
	Study of nonlinear fracture problems in metal elements by photoelastic coating method

10.25 – 10.45 Coffee break

Monday, Sept. 3, 9:00 - 10:25, Early Morning Session,
Nanoanalysis Room D

Chairmen: B. Weiss (University Vienna, Austria )

K. Ishikawa ( Tokyo University, Japan )


09:00	Villain, J., Corradi, U., Weippert, C., Meeh, M.
Key-note		University of Applied Sciences Augsburg, Germany
	Nano hardness of differently oriented Tin crystals in small solder joints

09:25	Stojanovic, D.¹, Radojevic, V.¹, Tang, C.Y.², Chen, D.Z.², Uskokovic, P.S.², Aleksic, R.¹
		¹University of Belgrade, Belgrade, Serbia ² Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China
	Nanomechanical properties of silane coated silica-poly(methylmethacrylate) nanocomposites

09:45	Ranganathan, N.¹, Vasques, B.¹, Joly, D.¹, Bouchou, A.¹, Leroy, R.¹, Beake, B.²
		¹ University of Tours, LMR, CEROC, France ² Micro Materials, Wrexham, UK
	A study of the nanoimpact resistance of hard coatings

10:05	Mertin, W.¹, Katzer, K.-D.¹, Lochthofen, A.¹, Bacher, G.¹, Jaeger, K.², Streubel, K.², Furitsch, M.², Brüderl, G.², Hahn, B.², Strauss, U.², Härle, V.²
		¹ University of Duisburg-Essen, Duisburg, Essen ² OSRAM Opto Semiconductors, Regensburg, Germany
	Nanoanalysis of optoelectronic emitters with electrical scanning force microscopy

10.25 – 10.45 Coffee break

Monday, Sept. 3, 9:00 - 10:25, Early Morning Session,
Reliability concepts I Room E

Chairmen: E. Suhir ( University of California, Santa Cruz, USA )

P. Jacob (EMPA, Dübendorf, Switzerland)


09:00	Aifantis, E.C.
Key-note, invited		Aristotle University of Thessaloniki, Greece
	Exploring the micro-nano mechanics transition: Theory and applications

09:25	Wilde, J., Fischer, S.
		University of Freiburg, IMTEK, Germany
	Modelling of polymer-based nano-composite materials for the reliability prediction of microsystems

09:45	Korobeynikov, S.N.¹, Babichev, A.V.²
		¹ Lavrentyev Institute of Hydrodynamics, Novosibirsk ² Institute of Geology and Mineralogy, Novosibirsk, Russia
	Stability criteria for processes of nanostructures deformation

10:05	Glickman, E.E.
		Tel Aviv University, Israel
	Capillary force driven , surface diffusion controlled degradation of metal nano-electrodes: Upfront reliability assessment

10.25 – 10.45 Coffee break

Monday, Sept. 3, 9:00 - 10:25, Early Morning Session,
Solder reliability modelling Room F

Chairmen: L. Turbini (RIM Research In Motion, Waterloo, Canada )

S. Wiese ( Dresden University of Technology, Germany )


09:00	Dudek, R., Faust, W., Döring, R., Michel, B.
Key-note		Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany
	In-situ microscopic studies on microstructural degradation and FE analyses for miniaturized SAC solder joints under thermal test- and field cycling

09:25	Wiese, S., Röllig, M., Müller, M., Wolter, K.-J.
		Dresden University of Technology, Germany
	The effect of size and composition on the creep of lead-free solders

09:45	Cugnoni, J.¹, Botsis, J.¹, Janczak-Rusch, J.²
		¹ LMAF/EPFL, Lausanne ² EMPA, Corrosion and Materials Integrity, Dübendorf, Switzerland
	Constraining & size effects on the tensile and shear elasto-plastic behavior of lead free solder joints

10:05	Bennemann, S.¹, Altmann, F.¹, Graff, A.¹, Schischka, J.¹, Petzold, M.¹, Theuss, H.², Dangelmaier, J.², Pressel, K.²
		¹ Fraunhofer IWMH, Halle/S. ² Infineon Technologies AG, Regensburg, Germany
	High resolution investigation of intermetallic formation and nano-reliability of SnAg2.5Cu0.7 solder comparing a flip chip- and flip chip in package application

10.25 – 10.45 Coffee break

Monday, Sept. 3, 10:45 - 11:50, Late Morning Session,
Micro- and Nanomaterials II Room A

Chairmen: J.E. Morris ( Portland State University, USA )

W. Müller (Technical University of Berlin, Germany )


10:45	Müller, W.
Key-note, invited		Technical University of Berlin, Germany
	Changes in the microstructure of materials and its impact on reliability - experiments and modelling

11:10	Tan, C. M.
Key-note		Nanyang Technological University of Singapore
	Physics and madelling of electromigration for Cu interconnects

11:35	Geißler, U.¹, Schneider-Ramelow, M.², Reichl, H.¹
		¹ Technical University of Berlin ² Fraunhofer IZM, Berlin, Germany
	Micro-nanostructural investigations of AlSi1 bondcontacts

11:55	Pugno, N.
		Politecnico di Torino, Italy
	Macroscopic invisible cables

12.15 – 13.00 Lunch break

Monday, Sept. 3, 10:45 - 11:50, Late Morning Session,
Reliability analysis and modelling II Room B

Chairmen: G.Q. Zhang (NXP Semiconductors, Nijmegen, The Netherlands )

J. Felba, ( Wroclaw University of Technology, Poland )


10:45	Auersperg, J.^1,2, Shirangi, M.H.^3,1, Michel, B.¹
Key-note		¹ Fraunhofer IZM, Micro Materials Center, Berlin ² AMIC Angewandte Micro-Messtechnik GmbH, Berlin ³ Robert Bosch GmbH, Reutlingen, Germany
	DOE and robust design of electronics devices in terms of fracture, delamination and thermo-mechanical fatigue

11:10	Dowhan, L.¹, Wymyslowski, A.¹, Dudek, R.²
		¹ Wroclaw University of Technology, Poland ² Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany
	Multi-objective decision support system in numerical reliability optimization of modern electronic packaging

11:30	Ebert, M., Bagdahn, J.
		Fraunhofer IWMH, Halle/S., Germany
	Numerical reliability assessment of brittle MEMS structures based on experiments, size effect theory and probabilistic sampling

11.50 – 13.00 Lunch break

Monday, Sept. 3, 10:45 - 11:50, Late Morning Session,
Nanointendation Room C

Chairmen: O. Wittler (Fraunhofer IZM, MMCB, Berlin, Germany)

Y.-Q. Wang (Beijing Institute of Technology, Beijing, China )


10:45	Kozuki, K.¹, Omiya, M.², Kishimoto, K.¹
Key-note		¹ Tokyo Institute of Technology ² Keio University, Yokohama, Japan
	Delamination behavior of hard film on soft substrate during nano- and micro-indentation

11:10	Nelle, P.¹, Schneegans, M.¹, Stecher, M.², Lilleodden, E.²
		¹ Infineon Technologies AG, Neubiberg ² The GKSS Research Center, Geesthacht, Germany
	Needle imprints and nanoindentation on pads over active area

11:30	Vecchione, N., Balint, D.S., Wasmer, K.*, Nikbin, K.M.
		Imperial College, London, U.K. *EMPA, Thun, Switzerland
	Characterisation of EB-PVD Zirconia by nanoindentation

11.50 – 13.00 Lunch break

Monday, Sept. 3, 10:45 - 11:50, Late Morning Session,
Reliability of microcomponents and MEMS Room D

Chairmen: W. Mertin ( University of Duisburg-Essen, Germany )

P. Zimprich ( University of Vienna, Austria )


10:45	Jacob, P.
Key-note, invited		EMPA, Materials Science & Technology, Dübendorf, Switzerland
	Polysilicon extensions and etching residues as a reliability risk

11:10	Ferraris, E.¹, Pagano, C.², Zerbini, S.³, Fassi, I.², Reynaerts, D.¹
		¹ Katholieke Universiteit Leuven, Belgium ² National Research Council (CNR-ITIA), Milano ³ STMicroelectronics, Cornaredo, Italy
	Development of a multi body based 1 DoF rotary MEMS

11:30	Wiemer, M.¹, Frömel, J.¹, Bagdahn, J.², Knechtel, R.³
		¹ Fraunhofer IZM, Chemnitz ² Fraunhofer IWMH, Halle/S. ³ X-Fab Semiconductor Foundries AG, Erfurt, Germany
	Waferbond technology and quality assessment

11.50 – 13.00 Lunch break

Monday, Sept. 3, 10:45 - 11:50, Late Morning Session,
Reliability concepts II Room E

Chairmen: E.C. Aifantis ( Aristotle University of Thessaloniki, Greece )

E. Mazza (ETH Zürich, Switzerland)


10:45	Kanert, W., Pufall, R.
Key-note		Infineon Technologies AG, Neubiberg, Germany
	Physics of failure and qualification methods for semiconductor components in harsh environments

11:10	Doireau, L.¹, Foucher, B.²
		¹ EDF - R&D, Moret sur Loing, ² EADS Innovation Works, Suresnes, France
	Future and emerging technologies: how to fulfill the requirements of industrials who aim at using robust and long-term reliable electronic equipments

11:30	Scherzer, M.
		TU Bergakademie Freiberg, Germany
	About strength criteria of piezoelectric interface corner configurations

11.50 – 13.00 Lunch break

Monday, Sept. 3, 10:45 - 11:50, Late Morning Session,
Reliability applications I Room F

Chairmen: E. Zschech (AMD Saxony, Dresden, Germany )

W.H. Lou (Beijing Institute of Technology, China )


10:45	Ito, H., Suzuki, K., Miura, H.
Key-note		Tohoku University, Sendai, Japan
	Stress-induced anisotropic diffusion of component atoms in Ni-base superalloy during creep damage

11:10	Wang, Y.-Q., Lou, W.-Z., Fan, N.-J., Hao, J.-W.
		Beijing Institute of Technology, Beijing, China
	Study on fault diagnostic strategy of intelligence magnetic detection microsystem

11:30	Mohtaram, N.K.¹, Goharpey, F.²
		¹ Iran Polymer and Petrochemical Institute, Tehran ² Amirkabir University of Technology ( Tehran Polytechnic), Tehran, Iran
	Study the effect of Montmorillonite on the crystallization of Nylon-6/Clay nanocomposites synthesized by in-situ polymerization

11.50 – 13.00 Lunch break

Special Workshop on Aging and Shelf Life of NANO/MEMS Technology

A Special Workshop on Aging and Shelf Life of NANO/MEMS Technology will be held on 4 September 2007, parallel to the Early and Late Morning sessions of the MicroNanoReliability Congress (08:30-12:15).

Applications for NANO/MEMS technology and devices continue to expand as the materials and fabrication technology advances. But device requirements for system integration require a careful look at the technology issues that limit reliability or lifetime in general. But in addition to the operational changes in material or device performance many applications require stability over extended periods in a non-operational state during storage for up to years at a time. As a result the effects of material aging, stress, environmental influences, mechanical distortions, contamination and other changes possibly enhanced by small scale at the nanometer level and molecular or quantum effects poise issues the need to be addressed. Both modeling and experimental tools may provide insights into the predicted changes in structures or their performance. Likewise it may be possible to design materials and devices to be more robust to long term aging and shelf life requirements. Further advancements in NANO and MEMS materials or devices for applications in coatings, structural materials, energetics, inertial or environmental sensors, actuators, controllers, micro fluidics, RF components, and energy conversion will depend upon resolving the associated technical barriers.

OBJECTIVES

The workshop will focus on the identification of these application requirements, issues, or technical barriers and then explore the possible approaches for advancement. The program is arranged to provide adequate time for technical discussion stimulated by invited presentations directed toward a better understanding of the technical applications and issues of NANO and MEMS aging and shelf life. A broad range of technical expertise is expected to be represented by the workshop participants with opportunities for future technical collaborations.

TOPICS

The topics of special interest include:

Ø Applications requirements for aging and shelf life where NANO/MEMS is incorporated

Ø Materials issues regarding aging and shelf life that are unique to NANO/MEMS.

Ø Impact of scaling down in size to NANO/MEMS dimensions on aging and shelf life.

Ø Packaging concerns relating to aging and shelf life with NANO/MEMS devices.

Ø Interfaces of materials and device structures involving NANO/MEMS that impact aging and shelf life.

Ø Aging and degradation models for NANO-devices.

Ø Accelerated aging studies to identify the mechanisms for aging of NANO-scale systems.

Ø Exploitation of physical and chemical properties that affect the aging of NANO/MEMS-materials.

Tuesday, Sept. 4, 08:30 – 12:15, Early & Late Morning Session, Room A

The workshop is organised and moderated by

- Paul Ashley, AMRDEC, Redstone Arsenal, USA

- Thomas Winkler, Fraunhofer IZM, MMCB, Berlin and Chemnitz, Germany

- John Johnson, AMRDEC - European Research Office, London, U.K.

- Mohan Sanghadasa, AEgis Technologies Group, USA

08:30	Dr. Paul Ashley
		AMRDEC, Redstone Arsenal, USA
	Introduction

08:40	Dr. Reiner Mönig¹, Prof. Carl V. Thompson²
		¹Forschungszentrum Karlsruhe, Germany ²MIT, Cambridge, USA
	Residual stress in MEMS/NEMS materials, and the effects, mechanisms, and solutions for long term stress relaxation via creep

09:10	Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology
		Center for Nanotechnology, NASA Ames Research Center, Moffett Field, USA
	Radiation effects on nanosystems

09:40	Dr. Michael T. Dugger, Distinguished Member of Technical Staff
		Sandia National Laboratories, Albuquerque, USA
	Aging effects on the surface chemistry and resulting performance of microsystems

10:10 – 10:45	Discussion and coffee break

10:45	Dr. Jud Ready, Ph.D., Sr. Research Engineer & Adj. Professor
		Georgia Tech Research Institute, Atlanta, USA
	An extrapolation of accelerated aging and degradation models from micro to nano -- linear, exponential or erroneous

11:15	Dr. Philippe Perdu
		CNES Toulouse, France
	Long term reliability issues in the deep-submicron range for aerospace applications

11:45	Dr. Zhiyu Hu^1,2, Arnab Choudhury², Peter j. Hesketh², Thomas Thundat¹
		¹Biosciences Division, Oak Ridge National Laboratory, Oak Ridge ²G. W. School of Mediacal Engineering, Georgia Institute of Technology, Atlanta, USA
	Analysis of environmentally-induced surface stress and its use in understanding non-operational aging of MEMES devices

12.15 – 13.30 Lunch break

Tuesday, Sept. 4, 8:30 - 10:15, Early Morning Session,
Reliability analysis and modelling III Room B

Chairmen: T. Rang ( Technical University Tallinn, Estonia )

T. Brunschwiler (IBM Research, Rüschlikon, Switzerland )


08:30	Hauck, T., Schmadlak, I.
Key-note		Freescale Halbleiter Deutschland GmbH, Munich, Germany
	Procedure to asses interface cracks in CMOS BEOL stack up designs with Finite Element simulation and energy based fracture mechanics approach

08:55	Schacht, R.^1,3, Meli, E.², May, D.¹, Wittler, O.¹, Wunderle, B.¹, Michel, B.¹, Reichl, H.²
		¹ Fraunhofer Institute for Reliability and Microintegration (IZM), Micro Materials Center, Berlin ² Technical University of Berlin ³ Fachhochschule-Lausitz, Senftenberg, Germany
	Effective thermal material models for multi layer PCBs with thermal vias

09:15	Kaulfersch, E.¹, Rzepka, S.², Ganeshan, V.², Müller, A.² , Michel, B.¹
		¹ Fraunhofer IZM, Micro Materials Center Berlin and Chemnitz ² Qimonda Dresden GmbH & Co OHG, Dresden, Germany
	Fast shear testing and FEM simulations for determination of dynamic mechanical behavior of SnAgCu BGA solder joints

09:35	Chen, J., Lai, Y.-S.
		Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung, Taiwan
	First-principles calculations of elastic properties of Cu-Sn crystalline phases

09:55	Zacharopoulos, D.A., Pategakis, S., Plistakas, N.
		Democritus University of Thrace , Xanthi, Greece
	Approach on the problem of crack path stability at different test specimens

10.15 – 10.45 Coffee break

Tuesday, Sept. 4, 8:30 - 10:15, Early Morning Session,
Optical metrology & derformation analysis Room C

Chairmen: R.J. Pryputniewicz (Worcester Polytechnic Institute, USA )

W. Osten ( University of Stuttgart, Germany )


08:30	Osten, W.
Key-note, invited		University of Stuttgart, Germany
	Resolution enhanced approaches in optical metrology

08:55	Keller, J.¹, Gollhardt, A.², Vogel, D.², Michel, B.²
		¹ AMIC Angewandte Micro-Messtechnik GmbH, Berlin ² Fraunhofer IZM, Micro Materials Center, Berlin, Germany
	Nanodeformation measurements for reliability studies of nanosystems

09:15	Walter, H.^1,4, Seiler, B.², Bombach, C.³, Michel, B.⁴
		¹ AMIC Angewandte Messtechnik GmbH, Berlin ² Chemnitzer Werkstoffmechanik GmbH, Chemnitz ³ Berliner Nanotest und Design GmbH ⁴ Fraunhofer IZM, Micro Materials Center, Berlin, Chemnitz
	Determination of Poisson’s ratio of electronic packaging materials dependent on temperature by means of UNIDAC-method

09:35	Barabanenkov, M.Yu., Barabanenkov, Yu.N.
		Russian Academy of Science, Chernogolovka, Russia
	Distant- and interference-spatial spectroscopy of evanescent waves

09:55	Schneider, D., Schultrich, B.
		Fraunhofer IWS, Dresden, Germany
	Testing thin films and surfaces by the laser-acoustic test method Lawave

10.15 – 10.45 Coffee break

Tuesday, Sept. 4, 8:30 - 10:15, Early Morning Session,
Micro- and Nanomaterials III Room D

Chairmen: N. Pugno ( Politecnico di Torino, Italy )

M. Scherzer (TU Bergakademie Freiberg, Germany)


08:30	Carpinteri, A., Pugno, N.
Key-note		Politecnico di Torino, Italy
	Strength of hierarchical materials

08:55	Khromov, A., Bukhanko, A., Kocherov, E., Fedorchenko, D.
		Samara State Aerospace University named after S.P. Korolyov, Russia
	Deformation states and fracture characteristics of plastic materials

09:15	Böffel, C., Müller, J., Müller, R., Bauer, M.
		Fraunhofer IZM, Teltow, Germany
	The Calcium test: A versatile tool for the investigation of barrier properties of polymers and reliability tests of encapsulation processes

09:35	Gesang, T., Rodewald, R.
		Fraunhofer IFAM, Bremen, Germany
	Optimisation of micro stress in adhesive bonds in electro optics and micro optics

09:55	Benfdila, A.
		The University M. Mammeri, Tizi-Ouzou, Algeria
	Recent advances in nanoMOSFET technology

10.15 – 10.45 Coffee break

Tuesday, Sept. 4, 8:30 - 10:15, Early Morning Session,
ESD and failure of electronic components Room E

Chairman: M. Saka ( Tohoku University, Sendai, Japan )

H. A. Gieser (Fraunhofer IZM, München, Germany


08:30	Gieser, H.A.
Key-note, invited		Fraunhofer IZM, München, Germany
	Electrostatic challenges and countermeasures for devices with MicroNanoDimensions

08:55	Ndip, I., Guttowski, S., Reichl, H.
		Fraunhofer IZM, Berlin, Germany
	M3-approach for reliable electrical design of advanced packages and boards

09:15	Kusnezoff, M.¹, Trofimenko, N.¹, Mosch, S.¹, Beckert, W.¹, Graff, A.², Altmann, F.²
		¹ Fraunhofer IKTS, Dresden ² Fraunhofer IWMH, Halle/S., Germany
	Stability of uLSM/8YSZ-interface in the composite cathode at high current densities

09:35	Schimpf, C.¹, Feldmann, K.¹, Matzner, C.¹, Steinke, A.²
		¹ University of Erlangen-Nuremberg, Erlangen ² CiS Institut für Mikrosensorik GmbH, Erfurt, Germany
	Failure of electronic devices due to condensation

09:55	Suñé, J.¹, Wu, E.², Tous, S.¹
		¹ Autonomous University of Barcelona ² IBM Microelectronics Division, Essex Junction, Spain
	Physics-based percolation model for the breakdown of ultra-thin (down to 1 nm) gate oxides for advanced CMOS

10.15 – 10.45 Coffee break

Tuesday, Sept. 4, 8:30 - 10:15, Early Morning Session,
Reliability applications II Room F

Chairmen: W. Wondrak, W. (DaimlerChrysler, Böblingen, Germany )

M. Vormoor (BMW, Munich, Germany)


08:30	Kohl, R., Trageser, H., Schuch, B.
Key-note		Conti Temic microelectronic GmbH, Nuremberg, Germany
	Reliability aspects of automotive electronic control units viewed from a TIER1 supplier perspective

08:55	Vormoor, M.
Key-note		BMW Bayerische Motoren Werke AG, Munich, Germany
	Increase of safety – better visibility by self-cleaning glasses

09:15	Böhme, B., Wolter, K.-J.
		Dresden University of Technology, Germany
	Characterization of organic substrate materials for high temperature automotive applications

09:35	Shaporin, A., Doetzel, W., Mehner, J.
		Chemnitz University of Technology, Germany
	Test-structures for MEMS reliability analysis

09:55	Middendorf, A.¹, Keller, J.², Walter, H.², Reichl, H.¹
		¹ Technical University of Berlin ² AMIC GmbH, Berlin, Germany
	Reliability aspect integration in the early stages of design processes for mechatronic systems

10.15 – 10.45 Coffee break

Tuesday, 10:45 – 12:10, Late Morning Session,
Reliability analysis and modelling IV Room B

Chairmen: T. Hauck (Freescale Halbleiter Deutschland, Munich, Germany)

E. Kaulfersch (Chemnitzer Werkstoffmechanik, Germany)


10:45	van der Sluis, O.^1,2, van Silfhout, R.B.R.¹, Engelen, R.A.B.¹, van Driel, W.D.^2,3, Zhang, G.Q.^2,3
Key-note		¹ Philips Applied Technologies, Eindhoven ² Delft University of Technology ³ NXP Semiconductors, Nijmegen, The Netherlands
	Energy based damage sensitivity analysis of complex 3D structures with an application to IC bond pads

11:10	Brocke, H.
		Fraunhofer Institut für Holzforschung, Wilhelm-Klauditz-Institut,Braunschweig, Germany
	A finite element based comparison of the reliability of Cu interconnects with CF polymer and SiLK^TM as low k dielectrics

11:30	Schindler, S.¹, Dresbach, C.², Wolter, K.-J.¹, Petzold, M.²
		¹ Dresden University of Technology ² Fraunhofer IWMH, Halle/S., Germany
	The influence of bond process parameters on the microstructure of bonding wires

11:50	Ranatowski, E.
		University of Technology and Life Science, Bydgoszcz, Poland
	Thermal modelling of laser welding

12.10 – 13.30 Lunch break

Tuesday, 10:45 – 12:10, Late Morning Session,
Characterization and testing I Room C

Chairmen: N. Barbosa (NIST Nat’l Inst. of Standards & Technol., Boulder, USA )

D. Schneider (Fraunhofer IWS, Dresden, Germany)


10:45	Ikehara, T.¹, Tsuchiya, T.²
Key-note		¹ National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba ² Kyoto University, Japan
	Parallel fatigue test of micromachined single crystal silicon using lateral resonating device

11:10	Striegler, A., Bendjus, B., Köhler, B.
		Fraunhofer IZFP, Dresden, Germany
	The potential of the Atomic Force Acoustic Microscopy for visualisation of subsurface voids

11:30	Tabanyukhova, M.V.
		The Novosibirsk State University of Architecture and Civil Engineering (NGASU), Novosibirsk, Russia
	Photoelastic analysis of fracture mechanic problems in elements with angular notches

11:50	Li, Q.^1,2,3, Goosen, H.², van Keulen, F.², van Beek, J.³, Zhang, G.Q.^2,3
		¹ Netherlands Institute of Metals Research NIMR, Delft ² Delft University of Technology ³ NXP Semiconductor, Eindhoven, The Netherlands
	Assessment of testing methodologies for thin-film vacuum MEMS packages

12.10 – 13.30 Lunch break

Tuesday, Sept. 4, 10:45 – 12:10, Late Morning Session,
Micro- and Nanomaterials IV Room D

Chairmen: M. Bauer (Fraunhofer IZM, Teltow, Germany)

D.H. Alsem (Lawrence Berkeley National Lab, USA)


09:00	Morris, J.E.
Key-note, invited		Portland State University, Portland, USA
	Nanopackaging: nanotechnologies and electronics packaging

09:25	Yang, P.-F.^1,2, Jian, S.-R.³, Lai, Y.-S.¹, Chen, R.-S.²
		¹ Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung ² National Cheng Kung University, Tainan ³ National Chiao Tung University, Hsinchu, Taiwan
	Characterizations of ZnO thin films deposited onto langasite substrates by r.f. magnetron sputtering

09:45	Lang, U., Dual, J.
		ETH Swiss Federal Institute of Technology Zürich, Switzerland
	Method for observing crack propagation in thin polymer films

10:05	Bertholet, Y.^1,2, Olbrechts, B.^1,3, Raskin, J.-P.^1,3, Pardoen, T.^1,2
		¹ Université catholique de Louvain, CeRMiN ² Université catholique de Louvain, IMAP ³ Université catholique de Louvain, EMIC, Belgium
	Molecular bonding aided by dissipative interlayers

12.10 – 13.30 Lunch break

Tuesday, Sept. 4, 10:45 – 12:10, Late Morning Session,
Reliability concepts III Room E

Chairmen: R. Dudek (Fraunhofer IZM, MMCB, Chemnitz, Germany )

J. Wilde ( University of Freiburg, IMTEK, Germany )


10:45	Tilgner, R.
Key-note, invited		Infineon Technologies AG, Munich, Germany
	Physics of Failure (PoF) for interconnect structures - an essay

11:10	Ghisi, A.¹, Fachin, F.¹, Mariani, S.¹, Corigliano, A.¹, Zerbini, S.²
Key-note		¹ Politecnico di Milano ² STMicroelecrtonics, Cornardo, Ilaly
	Multi-scale analysis of polysilicon MEMS subject to drop impacts

11:30	Müller, W.
		Technical University of Berlin, Germany
	How to extract continuum materials properties for lead-free solders from tensile tests and nanoindentation experiments

11:50	Biesheuvel, M.¹, van Soestbergen, M.¹, Rongen, R.², Ernst, L.J.³, Zhang, G.Q.^2,3
		¹ Netherlands Institute of Metals Research NIMR, Delft ² NXP Semiconductors, Nijmegen ³ Delft University of Technology, The Netherlands
	A numerical failure model for ion-transport related gate leakage

12.10 – 13.30 Lunch break

Tuesday, Sept. 4, 10:45 – 12:10, Late Morning Session,
Reliability applications III Room F

Chairmen: G. Georgakos (Infineon Technologies, Neubiberg, Germany)

R. Schwaiger (Forschungszentrum Karlsruhe, Germany


10:45	Farley, D.¹, Zhou, Y.¹, Dasgupta, A.¹, Caers, J.F.J.M.², de Vries, J.W.C.²
Key-note		¹ The University of Maryland, CALCE, College Park, USA ² Philips Applied Technologies, Eindhoven, The Netherlands
	Reliability of RF SiP assemblies under mechanical loads
11:10
	Coulombier, M.^1,3, Gravier, S.^1,3, Pardoen, T.^1,3, Fabregue, D.⁴ Andre, N.^2,3, Houri, S.^2,3, Raskin, J.-P.^2,3
		¹ Université catholique de Louvain, Dept. Materials Science and Processes, ² Université catholique de Louvain, Dept. Electr. Engng., ³ Université catholique de Louvain, CeRMiN, Belgium ⁴ INSA-Institute National of Applied Sciences of Lyon, France
	New concept of multipurpose on-chip nanomechanical laboratory

11:30	Shamshirsaz, M.¹, Gheisarieha, M.², Maroufi, M.¹
		¹ Amirkabir University of Technology ( Tehran Polytechnic), Tehran ² Sharif University of Technology, Tehran, Iran
	Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performance

11:50	Drumea, A., Vasile, A.., Vulpe, V.
		Politehnica University Bucharest, Romania
	Safety and reliability aspects in design and construction of an infusion pump medical system

12.10 – 13.30 Lunch break

Tuesday, Sept. 4, 13:30 - 15:15, Early Afternoon Session,
Reliability of MEMS I Room A

Chairmen: D.F. Bahr ( Washington State University, Pullman, USA )

T. Otto (Fraunhofer IZM, MDE Chemnitz, Germany)


13:30	Lavu, S.^1,3, Muratet, S.², Fourniols, J.Y.², Abraham, E.¹, Desmulliez, M.¹, De Wolf, I.³
Key-note		¹ Heriot- Watt University, Edinburgh, UK ² LAAS-CNRS 7, Toulouse, France ³ IMEC, Leuven, Belgium
	Failure modes and mechanisms in MEMS thermal actuators

13:55	Souchon, F., Charvet, P.L.
		CEA-LETI-MINATEC, Grenoble, France
	Identification of dielectric charging on MEMS switches

14:15	Gaspar, J.C., Paul, O.
		University of Freiburg, IMTEK, Germany
	Reliability of LPCVD Silicon Nitride as a structural material for MEMS applications

14:35	Hocheng, H., Hung, J.-N.
		National Tsing Hua University, Hsinchu, Taiwan
	Bending fatigue test of Polysilicon microcantilever beams

14:55	Meiß, K.-M., Eisenberg, W., Biesecke, C., Nerlich, V.
		Arnold-Sommerfeld-Gesellschaft, Leipzig, Germany
	Virtual microorganism (VMO) – System of engineering and reliability

15.15 – 15.45 Coffee break

15:45 – 16:15 Poster discussion

Tuesday, Sept. 4, 13:30 – 15:15, Early Afternoon Session,
Solder Joint & Interconnect Reliability I Room B

Chairmen: P.M. Svasta ( Politehnica University Bucharest, Romania )

H. Walter (Fraunhofer IZM, MMCB, Berlin, Germany)


13:30	Zimprich, P., Saeed, U., Betzwar-Kotas, A., Khatibi, G., Weiss, B., Ipser, H.
Key-note		University of Vienna, Austria
	Miniaturized lead-free solder joints and their response to dimensional constraints

13:55	Nieland, S., Bähr, M., Böttger, A.
		SolarZentrum Erfurt, CiS Institut für Mikrosensorik GmbH, Erfurt, Germany
	Advantages of microelectronic packaging for reliable lead free soldering of thin solar cells

14:15	Röllig, M., Wiese, S., Meier, K., Müller, M., Wolter, K.-J.
		Dresden University of Technology, Germany
	Experimental method for creep measurements on real package solder joints on the example of SnAg3.5 alloy

14:35	Khatibi, G.¹, Zimprich, P.¹, Wroczewski, W.¹, Groeger, V.¹, Weiss, B.¹, Licht, T.²
		¹ University of Vienna, Austria ² Infineon Technologies AG, Warstein, Germany
	Quality assessment of interconnects by an accelerated shear fatigue testing method

14:55	Dresbach, C.¹, Schischka, J.¹, Knoll, H.¹, Seifert, T.², Müller, T.³, Petzold, M.¹
		¹ Fraunhofer IWMH, Halle/S. ² Fraunhofer IWM, Freiburg ³ W.C. Heraeus GmbH, Hanau, Germany
	Local mechanical deformation properties of Gold wire bonding wires and free air balls

15.15 – 15.45 Coffee break

15:45 – 16:15 Poster discussion

Tuesday, Sept. 4, 13:30 – 15:15, Early Afternoon Session,
Characterization and testing II Room C

Chairmen: Y. Katz (Negba Institute, Beer Sheva, Israel)

L. Getsov ( St.-Petersburg State Polytechnical University, Russia )


13:30	Mazza, E.¹, Schifferle, A.²
Key-note		¹ ETH Swiss Federal Institute of Technology Zürich ² CSEM SA, Neuchatel, Switzerland
	A novel device for the mechanical characterization of micro-beams

13:55	Zschenderlein, U.¹, Kämpfe, B.², Schultrich, B.³, Fritsche, G.¹
		¹ Chemnitz University of Technology ² Fraunhofer IZM, Micro Materials Center, Berlin ³ Fraunhofer IWS, Dresden, Germany
	Application of energy dispersive X-ray diffraction for the efficient investigation of internal stresses in thin films

14:15	Vogel, D.¹, Gollhardt, A.¹, Sabate, N.², Michel, B.¹
		¹Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany ² Centre Nacional de Microelectrònica (CNM-CSIC), Bellaterra, Spain
	Data evaluation issues for stress release measurements on MEMS layers

14:35	Wolf, J.¹, Raudzis, C.¹, Mueller-Fiedler, R.¹, Seidel, H.²
		¹ Robert Bosch GmbH, Stuttgart ² Saarland University, Saarbrücken, Germany
	Novel resonant sensors for measuring the influence of package-induced stress on inertial sensors

14:55	Hanke, R.¹, Krüger, P.²
		1 Fraunhofer IIS, EZRT, Fürth, 2 Fraunhofer IZFP-D, EZRT, Dresden, Germany
	Methods of micro and nano CT for the characterization of microcomponents

15.15 – 15.45 Coffee break

15:45 – 16:15 Poster discussion

Tuesday, Sept. 4, 13:30 – 15:15, Early Afternoon Session,
Micro- and Nanomaterials V Room D

Chairmen: M. Werner (NMTC Berlin, Germany)

M. Töpper (Fraunhofer IZM / TU-Berlin, Berlin, Germany , and University of Utah, Salt Lake City, USA )


13:30	Schwaiger, R.
Key-note, invited		Forschungszentrum Karlsruhe, Karlsruhe, Germany
	Mechanical properties in small dimensions

13:55	Kahle, O.^1,2, Uhlig, C.², Bauer, M.^1,2
		¹ Brandenburg Technical University Cottbus ² Fraunhofer IZM, Teltow, Germany
	Thermophysical characterisation of sub-µm polymer layers by Nano-TMA/TGA/DVS

14:15	Yasuoka, M., Doi, B.S., Ando, I.
		Nachi-Fujokoshi Corporation, Toyama, Japan
	Ultralong fatigue estimation of cemented carbide WC-Co

14:35	Auerswald, E., Walter, H., Wittler, O., Gollhardt, A., Michel, B.
		Fraunhofer IZM, Micro Materials Center, Berlin, Germany
	Experimental characterization of thin Copper foils

14:55	Kämpfe, B.¹, Luczak, F.², Zimny, F.³, Petrick, H.³, Böhme, H.⁴
		¹ Fraunhofer IZM, Micro Materials Center, Berlin ² Technical University of Berlin ³ Petrick GmbH, Bad Blankenburg ⁴ FPM Holding GmbH, Freiberg, Germany
	Possibilities and application fields of energy-dispersive X-ray diffraction for the investigation of microsystems

15.15 – 15.45 Coffee break

15:45 – 16:15 Poster discussion

Tuesday, Sept. 4, 13:30 – 15:15, Early Afternoon Session,
Nanoscale strength and reliability I Room E

Chairmen: J. Keller (AMIC, Berlin, Germany )

N. Morozov (RAS, St. Petersburg, Russia )


13:30	Gerberich, W.W., Mook, W.M., Beaber, A.R.
Key-note, invited		University of Minnesota, Minneapolis, USA
	Nanoscale strength and reliability probes

13:55	Deromelaere, G., Felten, F., Hiller, P., Knoblauch, V.
Key-note		Robert Bosch GmbH, Stuttgart, Germany
	Reliability assessment of brittle materials – a new approach to improve prediction quality

14:15	Eremeev, V., Indeitsev, D., Ivanova, E., Morozov, N., Semenov, B.
		RAS, St. Petersburg, Russia
	Mechanics and nanomechanics

14:35	Kozhushko, V., Hess, P.
		University of Heidelberg, Germany
	Nanoscopic mechanism of mode I and mode II fracture of Silicon

14:55	Petzold, M.¹, Klengel, R.¹, Knoll, H.¹, Schischka, J.¹, Altmann, F.¹, Müller, T.², Chung, E.K³.
		¹ Fraunhofer IWMH, Halle/S. ² W.C. Heraeus GmbH, Hanau, Germany ³ Heraeus Oriental HiTec Co., Korea
	Nanoreliability of Au wire bonding interconnects

15.15 – 15.45 Coffee break

15:45 – 16:15 Poster discussion

Tuesday, Sept. 4, 13:30 – 15:15, Early Afternoon Session,
Reliability applications IV Room F

Chairmen: B. Foucher (EADS Innovation Works, Suresnes, France )

A. Ghisi ( Politecnico di Milano, Italy )


13:30	Obreja, V.V.V.N.¹, Svasta, P.M.²
Key-note, invited		¹ National R&D Institute for Microtechnology (IMT – Bucuresti) ² Politehnica University Bucharest, Romania
	The semiconductor – dielectric interface from PN junction periphery and its influence on reliability of power devices at high temperature

13:55	Goroll, M., Pufall, R., Aresu, S., Kanert, W.
		Infineon Technologies AG, Neubiberg, Germany
	Reliability of bipolar transistors – new aspects for lifetime determination in automotive applications

14:15	Rangu, M.¹, Svasta, P.M.²
		¹ Politehnica University of Timisoara ² Politehnica University of Bucharest, Romania
	Computer aided design techniques for fine tuning the printed circuit traces impedances

14:35	Zhuravliov, V.I., Alexeev, V.F.
		Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
	Critical temperature estimation of heating of semiconductor devices at HEMP actions

14:55	Aresu, S., Kanert, W., Pufall, R., Goroll, M.
		Infineon Technologies AG, Neubiberg, Germany
	Latent effect of Backend Of Line (BEOL) plasma cleaning process on silicon gate oxide reliability

15.15 – 15.45 Coffee break

15:45 – 16:15 Poster discussion

Tuesday, Sept. 4, 16:15 – 17:40, Late Afternoon Session,
Reliability of MEMS II Room A

Chairmen: N. Meyendorf (Fraunhofer IZFP, Dresden, Germany

M. Wiemer (Fraunhofer IZM, Chemnitz, Germany)


16:15	van Driel, W.D.^1,2, Yang, D.G.¹, Theunis, F.¹, Zhang, G.Q.²
Key-note		¹ NXP Semiconductors, Nijmegen, ² Delft University of Technology, The Netherlands
	Challenges for MEMS packaging: Capping

16:40	Hirsch, S., Majcherek, S., Leneke, T., Schmidt, B.
		Otto-von-Guericke-Universität Magdeburg, Germany
	A Silicon test chip for thermomechanical analysis of MEMS packagings

17:00	Uruska, D., Friedel, K
		Wroclaw University of Technology, Poland
	Stress induced on the MEMS active surface and deformation of MEMS due to moulding of MEMS/ASIC system

17:20	Koglin, J.
		FRT Fries Research & Technology GmbH, Bergisch Gladbach, Germany
	Quality assurance and production control of MEMS and wafers with multi-sensor metrology systems

17.40 Closure

19:00 – 23:00 Banquet cruise

Tuesday, Sept. 4, 16:15 – 17:40, Late Afternoon Session,
Solder Joint & Interconnect Reliability II Room B

Chairmen: W. Kanert (Infineon Technologies, Neubiberg, Germany )

J. Auersperg (Fraunhofer IZM, MMCB Berlin/Chemnitz)


16:15	Huang, Z., Conway, P.
Key-note		Loughborough University, UK
	Modelling of interfacial intermetallic compounds in the applications of very fine lead-free solder interconnections

16:40	Meier, K.¹, Wiese, S.¹, Scholz, D.², Rzepka, S.², Nocke, K.², Luhmann, C.², Röllig, M.¹, Wolter, K.-J.¹
		¹ Dresden University of Technology ² Qimonda Dresden GmbH & Co. OHG, Dresden, Germany
	Investigations on the dynamic elastic-plastic behaviour of solder joints using a novel high strain rate experimental setup

17:00	Smorodin, T.¹, Wilde, J.², Stecher, M.¹
		¹ Infineon Technologies AG, Munich ² University of Freiburg, IMTEK, Germany
	Crack propagation in the interlayer dielectric of a power technology metallization under fast temperature-cycle stress

17:20	Dreßler, M.¹, Liebing, G.¹, Becker, K.-F.², Wunderle, B.², Reichl, H.³
		¹ Robert Bosch GmbH, Waiblingen ² Fraunhofer IZM, Berlin ³ Technical University of Berlin, Germany
	Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections

17.40 Closure

19:00 – 23:00 Banquet cruise

Tuesday, Sept. 4, 16:15 – 17:40, Late Afternoon Session,
Characterization and testing III Room C

Chairmen: J. Villain (University of Applied Sciences Augsburg, Germany )

V. Girault (ST Microelectronics, Crolles, France )


16:15	Barbosa, N., Read, D., Keller, R., Geiss, R.
Key-note		National Institute of Standards and Technology NIST, Boulder, USA
	An electrical approach to measuring reliability and mechanical properties of interconnects

16:40	Simonov, I. V., Sirotin, A.A.
		Institute for Problems in Mechanics of the RAS, Moscow, Russia
	Microfibers testing by electromagnetic radiation method

17:00	Matkowski, P.¹, Urbanski, K.¹, Falat, T.¹, Felba, J.¹, Zaluk, Z.¹, Dasgupta, A.², Pecht, M.²
		¹ Wroclaw University of Technology, Poland ² The University of Maryland, CALCE, College Park, USA
	Combined temperature cycle and vibration reliability test of lead-free interconnections – event detection

17:20	Niklas, J.R.¹, Dornich, K.²
		¹ TU Bergakademie Freiberg ² Freiberg Instruments GmbH, Freiberg, Germany
	Contact-less topography and testing of electrical wafer parameters

17.40 Closure

19:00 – 23:00 Banquet cruise

Tuesday, Sept. 4, 16:15 – 17:40, Late Afternoon Session,
Micro- and Nanomaterials VI Room D

Chairmen: M. Desmulliez ( Heriot-Watt University, Edinburgh, UK )

G.N.Albaut ( Novosibirsk State University, Russia )


16:15	Töpper, M.^1,2, Hoferling, K.², Defo Kamga, F.¹, Reichl, H.¹
Key-note, invited		¹Fraunhofer IZM / TU- Berlin, Berlin, Germany ² University of Utah, Salt Lake City, USA
	Copper migration in thin film polymers

16:40	Gitis, N., Hermann, I., Khosla, V.
		CETR, Campbell, USA
	Non-destructive nano-mechanical reliability and defectivity characterization of thin films

17:00	Kübel, C.¹, Lee, T.-C.², Su, D.², Luo, J.-S.³, Russell, J.³
		¹ Fraunhofer IFAM, Bremen, Germany ² Taiwan Semiconductor Manufacturing Company, Ltd., ³ Inotera Memories, Physical Failure Analysis Department, Taiwan
	Application of electron tomography for semiconductor device analysis

17:20	Roth, H., Röder, M.
		Phoenix X-ray Systems, Stuttgart, Germany
	Visualising of internal 3D-structures with submicrometer resolution

17.40 Closure

19:00 – 23:00 Banquet cruise

Tuesday, Sept. 4, 16:15 – 17:40, Late Afternoon Session,
Nanoscale strength and reliability II Room E

Chairmen: S. Lavu (Heriot-Watt University, Edinburgh, UK)

J. Grimm (University of Applied Sciences Zwickau, Germany )


16:15	Turbini, L.¹, Caputo, A.²
Key-note, invited		¹ RIM Research In Motion, Waterloo, Ontario ² University of Toronto, Ontario, Canada
	Design limitations related to Conductive Anodic Filament (CAF) formation in a micro-world

16:40	Flaemig, J., Hammacher, J., Fuelle, A., Saupe, J., Zahn, W., Grimm, J.
Key-note		University of Applied Sciences Zwickau, Germany
	Reliability, tribology and mechanical properties of SU-8-layers for mechanical applications

17:00	Getsov, L.¹, Semenov, A.¹, Staroselsky, A.²
		¹ St.-Petersburg State Polytechnical University, Russia ² Pratt and Whitney, East Hartford, USA
	A new TMF failure criterion for single crystal superalloys

17:22	Perelmuter, M.
		Institute of Problems in Mechanics, Moscow, Russia
	Physical-mechanical icrosyst of nanocomposites strength and fracture

17.40 Closure

19:00 – 23:00 Banquet cruise

Tuesday, Sept. 4, 16:15 – 17:40, Late Afternoon Session,
Reliability applications V Room F

Chairmen: L. Berka ( Czech Technical University in Prague, Czech Republic )

A. Middendorf (Technical University of Berlin, Germany )


16:15	Georgakos, G., Huber, P., Ruckerbauer, F.
Key-note		Infineon Technologies AG, Neubiberg, Germany
	Cosmic ray induced single-, multi-bit and latch-up failure mechanisms at sub 90nm embedded SRAMs for system-in-chip applications

16:40	Kornev, V. M.
		Lavrentyev Institute of Hydrodynamics, Novosibirsk, Russia
	Two-scale model of crack propagation in high stress fatigue

17:00	Omiya, M.¹, Kishimoto, K.²
		¹ Keio University, Yokohama ² Tokyo Institute of Technology, Japan
	UV-ray irradiation effects on microsystem crack formation of ceramic thin film on polymer substrate

17:20	Berka, L.
		Czech Technical University in Prague, Czech Republic
	On a model and a theory of granulation processes

17.40 Closure

19:00 – 23:00 Banquet cruise

Wednesday, Sept. 5, 8:30 – 9:55, Early Morning Session,
Reliability and lifetime estimation Room A

Chairmen: M. Pecht ( University of Maryland, CALCE, College Park, USA )

B. Schuch (Conti Temic microelectronic, Nuremberg, Germany )


08:30	Pufall, R., Kanert, W., Goroll, M., Aresu, S.
Key-note		Infineon Technologies AG, Neubiberg, Germany
	Lifetime prediction – The need for a new qualification approach for automotive due to the lack of acceleration factors

08:55	Wittler, O.¹, Schindler-Saefkow, F.¹, Schreier-Alt, T.², Michel, B.¹
		¹ Fraunhofer IZM, Micro Materials Center, Berlin ² Fraunhofer IZM, Munich, Germany
	Assessment of package induced stresses for sensor applications

09:15	Sommer, J.-P.¹, Michel, B.¹, Petzold, M.², Schönecker, A.³, Kusnezoff, M.³, Wunderle, B.¹
		¹ Fraunhofer IZM, Micro Materials Center, Berlin ² Fraunhofer IWMH, Halle/S. ³ Fraunhofer IKTS, Dresden, Germany
	Nano-reliability within the framework of Fraunhofer market-oriented nano-scale activities

09:35	Nowack, M.¹, Reuter, D.¹, Rennau, M.¹, Bertz, A.¹, Geßner, T.^1,2
		¹ Chemnitz University of Technology ² Fraunhofer IZM, Berlin, Germany
	Wafer-level active testing of capacitive inertial sensors

09:55 – 10.30 Coffee break

Wednesday, Sept. 5, 8:30 – 9:55, Early Morning Session,
Molecular modelling Room B

Chairmen: B. Wunderle (Fraunhofer IZM, MMCB, Berlin, Germany)

P. Heino ( Tampere University of Technology, Finland )


08:30	Yuan, C.¹, Dawotola, A.W.¹, van der Sluis, O.¹, Zhang, G.Q.¹, Ernst, L.J.¹, van Driel, W.D.², van Silfhout, R.B.R.³, Thijsse, B.J.¹
Key-note		¹ Delft University of Technology ² NXP Semiconductors, Nijmegen ³ Philips Applied Technologies, Eindhoven, The Netherlands
	Molecular dynamics simulation on Silicon based materials and their interface

08:55	Dermitzaki, E.¹, Bauer, J.¹, Walter, H.², Wunderle, B.¹, Michel, B.¹, Reichl, H.³
		¹ Fraunhofer IZM, Micro Materials Center, Berlin ² AMIC Angewandte Micro-Messtechnik GmbH, Berlin ³ Technical University of Berlin, Germany
	Molecular dynamics simulation and mechanical characterisation of epoxy resins examinated at different temperatures

09:15	Capková, P.
		Technical University of Ostrava, Czech Republic
	Molecular modelling combined with experiment in analysis and characterization of organo-inorganic hybrid nanostructures

09:35	Eisenberg, W., Renner, U., Boran, R.
		Arnold-Sommerfeld-Gesellschaft, Leipzig, Germany
	Simulation of bio-complex systems with nano-cellular automata swarms and their reliability

09:55 – 10.30 Coffee break

Wednesday, Sept. 5, 8:30 – 9:55, Early Morning Session,
Local stress analysis Room C

Chairmen: R.E. Geer (Nanotech Albany, USA )

D. Vogel (Fraunhofer IZM, MMCB, Berlin, Germany)


08:30	Sabaté, N.¹, Vogel, D.², Gollhardt, A.², Keller, J.², Marcos, J.¹, Gràcia, I.¹, Cané, C.¹, Michel, B.²
Key-note		¹ Autonomous University of Barcelona, Spain ² Fraunhofer IZM, Micro Materials Center, Berlin, Germany
	Confined residual stress measurements on thin films deposited onto thick substrates with a FIB equipment

08:55	Lempidaki, D.E., Kubler, R.F., Busso, E.P., O’Dowd, N.P., Nikbin, K.
		Imperial College, London, UK
	Development of a photogrammetric technique to determine crack tip strain fields at elevated temperatures

09:15	Vermeulen, A.C., Fransen, M.
		PANalytical, Almelo, The Netherlands
	A new method for determining the residual stresses in coatings

09:35	Altmann, F., Graff, A., Simon, M.
		Fraunhofer IWMH, Halle/S., Germany
	Advanced focused ion beam techniques for process control of sub 100nm technologies

09:55 – 10.30 Coffee break

Wednesday, Sept. 5, 8:30 – 9:55, Early Morning Session,
Crack and fracture Room D

Chairmen: M. Petzold (Fraunhofer IWMH, Halle/S., Germany )

M. Perelmuter ( Institute of Problems in Mechanics, Moscow, Russia )


08:30	Cambruzzi, A., Dual, J.
Key-note		ETH Swiss Federal Institute of Technology Zürich, Switzerland
	Near threshold fatigue crack growth investigation on notched micro-resonator

08:55	Alush, H., Katz, Y.
		Negba Institute, Beer Sheva, Israel
	Fatigue crack initiation stage: Reflection on small volume segment applications

09:15	Bagdahn, J.¹, Allen, R.², Marshall, J.², Read, D.³, Baylies, W.A.⁴, Turner, K.⁵
		¹ Fraunhofer IWMH, Halle/S., Germany ² National Institute of Standards and Technology NIST, Gaithersburg ³ National Institute of Standards and Technology NIST, Boulder ⁴ BayTech Group, Weston ⁵ University of Wisconsin-Madison, Madison, USA
	Measurement of fracture toughness of wafer-bonded silicon using the new SEMI standard for micro-Chevron-samples

09:35	Badri Ghavifekr, H.
		Sahand University of Technology, Iran
	Estimation of crack propagation through mismatched interfaces due to thermally induced stress

09:55 – 10.30 Coffee break

Wednesday, Sept. 5, 8:30 – 9:55, Early Morning Session,
Reliability monitoring & diagnostics Room E

Chairmen: E. Suhir ( University of California, Santa Cruz, USA )

J. Nuffer (Fraunhofer LBF, Darmstadt, Germany)


08:30	Rouet, V.¹, Delye, A.¹, Vichare, N.², Pecht, M.G.², Foucher, B.¹
Key-note		¹ EADS Innovation Works, Suresnes, France ² The University of Maryland, CALCE EPSC, College Park, USA
	Embedded remaining life prognostics and diagnostics of electronics

08:55	Bochow-Ness, O., Fujino, M., Middendorf, A., Reichl, H.
		Technical University of Berlin, Germany
	Condition indicators for microsystem monitoring of microsystems

09:15	Yu, X.-L., Lou, W.H., Ma, B.Z., Wang, Y.-Q.
		Beijing Institute of Technology, China
	Based on microsystems distributed BIT diagnostic network for robot

09:35	Urbanski, K., Wymyslowski, A., Matkowski, P., Falat, T.
		Wroclaw University of Technology, Poland
	Application of an Ethernet microcontroller in a fast data acquisition system for long-term reliability tests of microelectronic interconnections

09:55 – 10.30 Coffee break

Wednesday, Sept. 5, 8:30 – 9:55, Early Morning Session,
Reliability applications VI Room F

Chairmen: S. Sedmak ( University of Belgrade, Serbia )

H. Walter (Fraunhofer IZM, MMCB Berlin, Germany


08:30	Sedmak, S., Kiric, M., Sedmak, A.
Key-note, invited		University of Belgrade, Serbia
	The reliability criteria and failure modes in fracture mechanics

08:55	Hertl, M., Weidmann, D., Lecomte, J.-C.
		INSIDIX, Seyssins, France
	Reliability improvement by advanced failure assessment strategy

09:15	Middendorf, A.¹, Griese, H.², Nissen, N.F.², Reichl, H.¹
		¹ Technical University of Berlin ² Fraunhofer IZM, Berlin, Germany
	The sustainability perspective of reliability for microelectronics

09:35	Zacharopoulos, D.A., Kalaitzidis, P.A., Gdoutos, E.E.
		Democritus University of Thrace , Xanthi, Greece
	Theoretical and experimental study of failure of foam-core sandwich beam under three-point bending

09:55 – 10.30 Coffee break

Wednesday, Sept. 5, 10:30 – 11:55, Late Morning Session,
Interdisciplinary reliability aspects Room A

Chairmen: S. Fiedler (Fraunhofer IZM, Berlin, Germany)

N. Gitis (CETR, Campbell, USA )


10:30	Wolf, M.J.¹, Michel, B.², Ramm, P.³, Reichl, H.⁴
Key-note invited		¹Fraunhofer IZM, Berlin, Germany ²Fraunhofer IZM, Micro Materials Center, Berlin and Chemnitz ³Fraunhofer IZM, Munich
	System integration on wafer level – Requirements and technical solutions

10:55	Bajpai, R.
Invited		Rani Durgavati University, Jabalpur, India
	Mechanical characterization of biocompatible materials

11:15	Bechmann, F.
		BMW Bayerische Motoren Werke AG, Munich, Germany
	Microstructural materials modelling of particle reinforced light metals

11:35	Fiedler, S., Zwanzig, M., Schmidt, R., Scheel, W.
		Fraunhofer IZM, Berlin, Germany
	Development and evaluation of microelectronic packaging concepts based on submicron wires

11:55 – 13.00 Lunch break

Wednesday, Sept. 5, 10:30 – 11:55, Late Morning Session,
Thermal modelling & characterization Room B

Chairmen: R. Schacht (University of Applied Sciences Lausitz, Senftenberg)

J.-P. Sommer (Fraunhofer IZM, MMCC, Chemnitz, Germany)


10:30	Brunschwiler, T., Rothuizen, H., Kloter, U., Linderman, R., Wälchli, R., Michel, B.
Key-note		IBM Research GmbH, Zurich Research Laboratory, Rüschlikon, Switzerland
	Interlayer heat transfer for vertically integrated packages

10:55	Heino, P.
Invited		Tampere University of Technology, Finland
	Simulations of nanoscale thermal conduction

11:15	May, D.¹, Schacht, R.^2,1, Wunderle, B.¹, Kreyssig, K.³, Michel, B.¹, Reichl, H.^4,1
		¹ Fraunhofer IZM, Berlin ² University of Applied Sciences Lausitz, Senftenberg, ³ AMIC Angewandte Micro-Messtechnik GmbH, Berlin ⁴ Technical University Berlin, Germany
	Advanced IR-thermography techniques for non-destructive testing of microelectronic components

11:35	Wang, T.H., Lee, C.-C., Lai, Y.-S.
		Advanced Semiconductor Engineering, Inc., Central Labs, Kaohsiung, Taiwan
	Evaluation of thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test conditions

11:55 – 13.00 Lunch break

Wednesday, Sept. 5, 10:30 – 11:55, Late Morning Session,
Reliability and microstructure Room C

Chairmen: S.-W. Yu ( Tsinghua University, Beijing, China )

N. Sabate (CNM-CSIC, Bellaterra, Spain)


10:30	Banks-Sills, L., Eliaz, N., Krylov, S., Bruck, H.*, Fourman, V., Fjodorov, J., Ashkenazi, D., Inberg, A., Eliasi, R.,
Key-note		Tel Aviv University, Israel * University of Maryland, College Park, USA
	Determination of mechanical properties of micro-sized specimens

10:55	Müller, M., Wiese, S., Röllig, M., Wolter, K.-J.
		Dresden University of Technology, Germany
	Influence of size, cooling rate and composition on the grain orientation of lead-free solder joints

11:15	Okolo, B., Rögner, J., Kerscher, E., Beck, T., Schulze, V., Wanner, A., Löhe, D.
		University of Karlsruhe, Germany
	Size effects in Aluminium bronze cast specimens

11:35	Corradi, U., Weippert, C., Villain, J.
		University of Applied Sciences Augsburg, Germany
	EBSD measurements in small lead-free solder joints

11:55 – 13.00 Lunch break

Wednesday, Sept. 5, 10:30 – 11:55, Late Morning Session,
Adhesion Room D

Chairmen: H. Ito ( Tohoku University, Sendai, Japan )

E.E. Glickman ( Tel Aviv University, Israel )


10:30	Caers, J.F.J.M.¹, Zhao, X.J.¹, de Vries, J.W.C.¹, Wong, E.H.²
Key-note		¹ Philips Applied Technologies, Eindhoven, The Netherlands ²Institute of Microelectronics (IME), Singapore , Singapore
	Highly accelerated reliability tests for conductive adhesive interconnects

10:55	Bahr, D.F., Kennedy, M. S., Yeager, J. D.
		Washington State University, Pullman, USA
	Adhesion of noble metals for electrodes in MEMS

11:15	Jansen, K.M.B., Patel, M., Ernst, L.J., Bohm, C.
		Delft University of Technology, The Netherlands
	Transient bulk modulus of a novolac epoxy resin

11:35	Ocana, I.¹, Molina-Aldareguia, J.M.¹, Gonzalez, D.¹, Elizalde, M.R.¹, Sanchez, J.M.¹, Martinez-Esnaola, J.M.¹, Gil-Sevillano, J.¹, Pantuso, D.², Sun, B.², Xu, G.², He, J.², Maiz, J.²
		¹CEIT, San Sebastian, Spain ²Intel Corporation, Hillsboro, USA
	Adhesion studies in integrated circuit interconnect structures

11:55 – 13.00 Lunch break

Wednesday, Sept. 5, 10:30 – 11:55, Late Morning Session,
Reliability dynamic problems Room E

Chairmen: H.-J. Albrecht (Siemens, Berlin, Germany)

N. Rümmler (Amitronics, Seefeld, Germany)


10:30	Suhir, E.
Key-note, invited		University of California, Santa Cruz, USA
	Dynamic response of micro- and opto-electronic systems to shocks and vibrations

10:55	Mitić, S.
		University of Niš, Serbia
	Reliability of vibro-impact systems

11:15	Rümmler, N.¹, Schnitzer, R.¹, Michel, B.²
		¹ Amitronics GmbH, Seefeld ² Fraunhofer IZM, Micro Materials Center, Berlin, Germany
	Experimental vibration and deformation analyses for increase micro-structure reliability

11:35	Nuffer, J., Platz, R., Friedmann, A., Atzrodt, H., Mayer, D.
		Fraunhofer LBF, Darmstadt, Germany
	Reliability investigation of a mechatronic interface for active vibration reduction

11:55 – 13.00 Lunch break

Wednesday, Sept. 5, 10:30 – 11:55, Late Morning Session,
Reliability applications VII Room F

Chairmen: R. Kohl (Conti Temic microelectronic, Nuremberg, Germany )

K. Kozuki (Tokyo Institute of Technology, Japan )


10:30	Maire, O.¹, Chaillot, A.¹, Munier, C.¹, Lombaert-Valot, I.¹, Bousquet, S.², Chastanet, C.², Plouseau, D.³, Munier, E.³, Maron, D.⁴, Raynal, P.⁴, Villard, S.^5,Dumonteil, R.⁵
Key-note		¹EADS CRC, Suresnes, ²AIRBUS France, Toulouse, ³EADS DCS, Elancourt, ⁴ACTIA, Toulouse, ⁵TECHCI, Saint-Génix sur Guiers, France
	Reliability of components with Pb soldered in a lead-free process (Green electronics for aeronautical and military communication systems – GEAMCOS project)

10:55	Drumea, A., Vasile, A.
		Politehnica University Bucharest, Romania
	Efficient and reliable communications in industrial control and mechatronic systems

11:15	Kämpfe, A.
		Witzenmann GmbH, Pforzheim, Germany
	Micro-size metal bellows as an example for miniaturisation and reliability of mechanical components

11:35	Klein, M.¹, Oppermann, H.¹, Hutter, M.¹, Fritzsch, T.¹, Engelmann, G.¹, Dietrich, L.¹, Wolf, J.¹, Brämer, B.², Dudek, R.², Reichl, H.¹
		¹ Fraunhofer IZM, Berlin ² Fraunhofer IZM, Chemnitz, Germany
	Reliability investigation of large GaAs pixel detectors flip chip bonded on Si readout chips

11:55 – 13.00 Lunch break

POSTERS

Posters are on display from Monday, Sept.2, 10:00, till Wednesday, 14:30.

Apart from the conference breaks, special time for discussion with the authors at the poster stands is on Tuesday, 15:45 – 16:15.


	Bauer, M.^1,2, Vieth, S.^1,2, Uhlmann, M.², Landeck, S.¹
Poster 01		¹ Fraunhofer IZM, Teltow ² BTU Cottbus, Cottbus, Germany
	Promising filler for electric-packaging materials: β-eucryptite

	Bombach, C.^1,2, Michel, B.¹, Winkler, T.², Keller, J.³, Kaulfersch, E.⁴, Seiler, B.⁴
Poster 02		¹Fraunhofer IZM Berlin ² Berliner Nanotest und Design GmbH ³ AMIC GmbH Berlin ⁴ Chemnitzer Werkstoffmechanik GmbH
	Analysis of potential failure mechanisms in SOP microsystems

	Brämer, B.¹, Dudek, R.¹, Michel, B.¹, Brückner, J.², Krautheim, G.²
Poster 03		¹ Fraunhofer IZM, Micro Materials Center, Chemnitz, ² Zwickau University of Applied Science, Zwickau, Germany
	Wafer bow caused by intrinsic stress in ALD films

	Faust, W., Dudek, R., Poller, T., Michel, B.
Poster 04		Fraunhofer IZM, Micro Materials Center, Chemnitz, Germany
	Microstructure of damaged solder

	Geissler, U.
Poster 05		CWE - Chemnitzer Wirtschaftsförderungs- und Entwicklungsgesellschaft mbH, Chemnitz, Germany
	Smart Systems Campus - A new Technology Park in Chemnitz


	Gerdes, H., Gatzen, H.H.
Poster 06		Leibniz University Hanover, Germany
	Focused ion beam core hole drilling for stress detection in thin films

	Gollhardt, A., Michel, B.
Poster 07		Fraunhofer IZM, Micro Materials Center, Berlin, Germany
	Focused Ion Beam (FIB) as an analytical tool in micro- and nanotechnology

	Hecht, S., Hoffmann, M.
Poster 08		Ilmenau University of Technology, Germany
	Reliability of “Black Silicon” for MEMS packaging

	Heimann, M.¹, Meißner, F.², Endler, I.², Schönecker, A.², Wolter, K.-J.¹
Poster 09		Dresden University of Technology ² Fraunhofer IKTS, Dresden, Germany
	Nano-scaled functional layer for current and heat transportation in electronics packaging

	Heuer, H.¹, Meyendorf, N.¹, Oppermann, M.², Wolter, K.-J.²
Poster 10		¹ Fraunhofer IZFP, Dresden ² Dresden University of Technology, Dresden, Germany
	The Center for Non-destructive Nano Evaluation (nanoEVA), a new research facility in Dresden

	Kim, J.Y., Choi, H.J., Lee, S.J., Kim, K.S., Lee, H.J.
Poster 11		Korea Institute of Machinery & Materials, Yuseong-gu Daejeon, Korea
	Vertical bellows shape micro contact probe with variable stiffness

	Knoll, H.¹, Berthold, L.¹, Klengel, R.¹, Petzold, M.¹, Rudolf, F.², Müller, T.³
Poster 12		¹ Fraunhofer IWMH, Halle/S. ² Dresden University of Technology ³ W.C. Heraeus GmbH, Hanau, Germany
	Quality and reliability investigations of Au bonding wires coated with Al nanofilms

	Kosobutskyy, P.S.¹, Kosobutskyy, Ya.P.¹, Kushnir, O.P².
Poster 13		¹ Lviv Polytechnic National University, Lviv ² Lviv State Agrarian University, Dubljany, Ukraine
	About a principle of the interferometric sensor creation

	Köhler, B., Bendjus, B.
Poster 14		Fraunhofer IZFP, Dresden, Germany
	Test samples for micro- and nano- non-destructive evaluation

	Krause, M., Graff, A. , Altmann, F.
Poster 15		Fraunhofer IWMH, Halle/S., Germany
	Determination of residual stress in Silicon using electron backscatter diffraction

	Kreyßig, K.⁴, Krahn, L.¹, Auersperg, J.², Zerna, T.³, Oppermann, M.³, Seiler, B.⁴, Keller, J.⁵, Ritzendorf, S.⁶, Scholz, G.⁶ , Mathiak, G.⁷, Schmidt, T.⁷, Magh, M.⁸
Poster 16		¹Fraunhofer IZM Paderborn ²Fraunhofer IZM Berlin/Chemnitz, Micro Materials Center ³TU Dresden, Zentrum für mikrotechnische Produktion ⁴Chemnitzer Werkstoffmechanik GmbH ⁵AMIC Berlin ⁶Creos Lernideen Bielefeld ⁷ZAVT GmbH Lippstadt ⁸Magh & Boppert Objektorientierte Softwareentwicklung Paderborn
	BIZAM – Next generation consulting system for thermo-mechanical analyses in microelectronics and MEMS technologies

	Lee, J., Cho, C.S., Morris, J.E.
Poster 17		Portland State University, USA
	Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed circuit boards


	Loboda, O.S., Krivtsov, A.M.
Poster 18		Institute of Problems of Mechanical Engineering of RAS, St. Petersburg, Russia
	Determination of elastic and strength properties of nanostructures with complex crystal lattice using moment interaction at microscale. Scale effects in elastic properties

	Luczak, F.¹; Kämpfe, B. ², Urban, M.³
Poster 19		¹Technical University Berlin ² Chemnitzer Werkstoffmechanik GmbH ³University of Applied Sciences (FHTW) Berlin, Germany
	Evaluation of diffraction patterns in high energy X-ray analysis

	May, D.¹_,Schacht, R.^1,3, Wunderle, B.¹, Michel, B.¹, Reichl, H.²
Poster 20		¹Fraunhofer IZM, Micro Materials Center, Berlin, ²Technische Universität Berlin, Forschungsschwerpunkt Technologien der Mikroperipherik, Berlin, ³ Fachhochschule Lausitz, Senftenberg, Germany
	Pulse and Lock-In Infrared Thermography - Possibilities for non-destructive reliability analysis of micro-electronic assemblies

	Michel, B.¹, Winkler, T.²
Poster 21		¹Fraunhofer IZM, Micro Materials Center Chemnitz ²Berliner Nanotest und Design GmbH, Berlin, Germany
	EUCEMAN – The European center for micro- and nanoreliability

	Noack, E.¹, Seiler, B.¹, Sommer, J.-P.^1,2, Dost, M.¹, Michel, B.²
Poster 22		¹ Chemnitzer Werkstoffmechanik GmbH, Chemnitz, ² Fraunhofer IZM, Micro Materials Center, Micro Materials Center Berlin and Chemnitz, Germany
	Deformation measurement for reliability assessment of components with hidden dies


	Olszewski, O.Z.¹, O’Mahony, C.¹, Duane, R.¹, Hill, M.²
Poster 23		¹Tyndall National Institute, Lee Maltings, Cork, ² Cork Institute of Technology, Bishopstown, Cork, Ireland
	The role of surface roughness in RF MEMS capacitive switches

	Ortner, H., Osenberg, F.
Poster 24		Hamamatsu Photonics Deutschland GmbH, Herrsching, Germany
	Failure localisation by optoelectronic techniques

	Radojevic, V.1, Lamovec, J.2, Jovic, V.2, Trifunović, D.1, Aleksic, R.1
Poster 25		¹ University of Belgrade ² IChTM-Department of Microelectronic Technologies and Single Crystals, Belgrade, Serbia
	Analysis of the micromechanical properties of electrodeposited Ni coatings on different substrates

	Ranatowski, E.
Poster 26		University of Technology and Life Science, Bydgoszcz, Poland
	Some remarks on the constraint effect at interface of the thin layer in mismatched welded joints

	Randman, D., Wilkinson, A. J.
Poster 27		University of Oxford, U.K.
	A nanoindentation study of slip transmission at grain boundaries in alpha-Fe

	Rögner, J.¹, Okolo, B.¹, Müller, M.², Kerscher, E.¹, Schulze, V.¹, Beck, T.³, Löhe, D.¹
Poster 28		¹ Institute of Materials Science and Engineering I, University of Karlsruhe, ²Institute for Materials Research III, Forschungszentrum Karlsruhe, Germany ³ Institute of Energy Research II, Forschungszentrum Jülich, Germany
	Relationships between process, microstructure and property of molded Zirconia micro specimens

	Rudraraju, N.P., Morris, J.E.
Poster 29		Portland State University, USA
	Reliability testing of nano-particle system packaging


	Schischka, J., Altmann, F., Krause, M., Knoll, H., Petzold, M.
Poster 30		Fraunhofer IWMH, Halle/S., Germany
	EBSD grain microstructure investigation of electronic materials down to the nanoscale

	Schindler-Saefkow, F.¹, Jagle, M.², Wunderle, B.³, Böttner, H.², Nurnus, J.⁴
Poster 31		^1</

							Status: July 24
Sept. 2, 2007

12:00-14:00		Check-in
14:00		T1	T2	...
						...	T10
15:30-16:00		Coffee break
16:00		T1	T2	...
17:30		Closure				...	T10

Sept. 3, 2007

08:00-09:00		Check-in
Early Morning Session		Micro- and nanomaterials I	Reliability analysis and modelling I	Modelling I	Nanoanalysis	Reliability concepts I	Solder reliability modelling
Chairmen		Gerberich / Fecht	Dommann / Ernst	Wolter / Goldstein	Weiss / Ishikawa	Suhir / Jacob	Turbini / Wiese
09:00	K1	Fecht	Rzepka	Goldstein	Villain	Aifantis	Dudek
09:25	1	Murafa	de Vreugd	Song	Stojanovic	Wilde	Wiese
09:45	2	Miura	Feng	Shodja	Ranganathan	Korobeynikov	Cugnoni
10:05	3	Schulze	Falat	Albaut	Mertin	Glickman	Bennemann
10:25 - 10:45		Coffee break
Late Morning Session		Micro- and nanomaterials II	Reliability analysis and modelling II	Nano-indentation	Reliability of micro-components and MEMS	Reliability concepts II	Reliability applications I
Chairmen		Morris / Müller	Zhang / Felba	Wittler / Wang	Mertin / Zimprich	Aifantis / Mazza	Zschech / Lou
10:45	K2	Müller, W.	Auersperg	Kozuki	Jacob	Kahnert	Ito
11:10	4	Tan	Dowhan	Nelle	Ferraris	Doireau	Wang/Lou
11:35	5	Geißler	Ebert	Vecchione	Wiemer	Scherzer	Mohtaram
11:55	6	Pugno
12:15 - 13:00		Lunch break

Plenum I			Michel / Zhang / Kishimoto / Pecht
13:00	P		Michel
13:10	P		Buller				Plenary lecture
13:30			EUCEMAN Award presentation				25'
			Michel / Heinze
13:35	P1		Geßner				Session key-note
14:05	P2		Zhang				25'
14:30	P3		Dauskardt
14.55 - 15:20		Coffee break					Session paper
Plenum II			Kishimoto / Meyyappan				20'
15:20	P4		Pecht
15:45	P5		Foucher				Special workshop
16:10	P6		Bailey				30'
16:35	P7		Pryputniewicz
17:00 - 17:25		Coffee break					Poster
Plenum III			Pufall / Aschenbrenner
17:25	P8		McDonough/Geer
17:50	P9		Yu				Chairmen
18:15	P10		Wunderle/Michel
18:40		Closure


Sept. 4, 2007

Early Morning Session		Special Workshop on aging and shelf life of MEMS I	Reliability analysis and modelling III	Optical metrology & deformation analysis	Micro- and nanomaterials III	ESD and failure of electronic components	Reliability applications II
Chairmen		Ashley / Winkler	Rang / Brunschwiler	Prypytniewicz / Osten	Pugno / Scherzer	Saka / Gieser	Wondrak / Vormoor
08:30	K3	Attention: times differ from the general scheme	Hauck	Osten	Carpinteri	Gieser	Kohl
08:55	6	Attention: times differ from the general scheme	Schacht	Keller	Khromov	Ndip	Vormoor (KN)
09:15	7	Thompson (8:40)	Kaulfersch	Walter	Böffel	Kusnezoff	Böhme
09:35	8	Meyyappan (9:10)	Chen	Barabanenkow	Gesang	Schimpf	Shaporin
09:55	9	Dugger (9:40)	Zacharopoulos/Pa.	Schneider, D.	Benfdila	Sune	Middend./Keller
10:15 - 10:45		Coffee break
Late Morning Session		Special Workshop on aging and shelf life of MEMS II	Reliability analysis and modelling IV	Characterization and testing I	Micro- and nanomaterials IV	Reliability concepts III	Reliability applications III
Chairmen		Johnson / Sanghadasa	Hauck / Kaulfersch	Barbosa / Schneider,D.	Bauer / Alsem	Dudek / Wilde	Georgakos / Schwaiger
10:45	K4	times differ:	van der Sluis	Ikehara	Morris	Tilgner	Farley
11:10	10	Ready (10:45)	Brocke	Striegler	Yang	Ghisi	Coulombier
11:30	11	Perdu (11:15)	Schindler	Tabanyukhova	Lang	Müller, W.	Shamshirsaz
11:50	12	Wolf (11:45)	Ranatowski	Li	Bertholet	Biesheuvel	Drumea
12:10 - 13:30		Lunch break

Early Afternoon Session		Reliability of MEMS I	Solder Joint & Interconnect Reliability I	Characterization and testing II	Micro- and nanomaterials V	Nanoscale strength and reliability I	Reliability applications IV
Chairmen		Bahr / Otto	Svasta / Walter	Katz / Getsov	Werner / Töpper	Keller / Morozov	Foucher / Ghisi
13:30	K5	Lavu	Zimprich	Mazza	Schwaiger	Gerberich	Obreja
13:55	13	Souchon	Nieland	Zschenderlein	Kahle	Deromelaere	Goroll
14:15	14	Gaspar	Röllig	Vogel, D.	Yasuoka	Eremeev	Rangu
14:35	15	Hocheng	Khatibi	Wolf, J.	Auerswald	Kozhushko	Zhuravliov
14:55	16	Meiss	Dresbach	Hanke	Kämpfe, B.	Petzold	Aresu
15:15 - 15:45		Coffee break
15:45-16:15			Poster Discussion (about 35 posters)
Late Afternoon Session		Reliability of MEMS II	Solder Joint & Interconnect Reliability II	Characterization and testing III	Micro- and nanomaterials VI	Nanoscale strength and reliability II	Reliability applications V
Chairmen		Meyendorf / Wiemer	Kanert / Auersperg	Villain / Girault	Desmulliez / Albaut	Lavu / Grimm	Berka / Middendorf
16:15	K6	van Driel	Huang	Barbosa	Töpper	Turbini	Georgakos
16:40	17	Hirsch	Meier	Simonov	Gitis	Flämig	Kornev
17:00	18	Uruska	Smorodin	Matkowski	Kübel	Getsov	Omiya
17:20	19	Koglin	Dressler	Niklas	Roth	Perelmuter	Berka
17:40/18:00		Closure
			Congress banquet cruise (incl. award presentations)


Sept. 5, 2007

Early Morning Session		Reliability and lifetime estimation	Molecular modelling	Local stress analysis	Crack and fracture	Reliability monitoring & diagnostics	Reliability applications VI
Chairmen		Pecht / Schuch	Wunderle / Heino	Geer / Vogel	Petzold / Perelmuter	Suhir / Nuffer	Sedmak / Walter
08:30	K7	Pufall	Yuan	Sabate	Cambruzzi	Rouet	Sedmak
08:55	20	Wittler	Dermitzaki	Lempidaki	Alush	Bochow-Ness	Hertl
09:15	21	Sommer	Capkova	Vermeulen	Bagdahn	Yu, X.-L.	Middendorf/Grie.
09:35	22	Nowack	Eisenberg	Altmann	Badri	Urbanski	Kalaitzidis/Zach.
09:55 - 10:30		Coffee break
Late Morning Session		Interdisciplinary reliability aspects	Thermal modelling & characterizat.	Reliability and micro-structure	Adhesion	Reliabiliy - dynamic problems	Reliability applications VII
Chairmen		Fiedler / Gitis	Schacht / Sommer	Yu / Sabate	Ito / Glickman	Albrecht / Rümmler	Kohl / Kozuki
10:30	K8	Wolf	Brunschwiler	Banks-Sills	Caers	Suhir	Maire
10:55	23	Bajpai	Heino	Müller, M.	Bahr	Mitic	Drumea
11:15	24	Bechmann	May	Okolo	Jansen	Rümmler	Kämpfe, A.
11:35	25	Fiedler	Wang / Lee	Corradi	Ocana	Nuffer	Klein
11:55 - 13:00		Lunch break

Plenum IV			Liu / Bachmann
13:00	P11		Moody
13:25	P12		Zschech
13:50	P13		Saka
14:15 - 14:20
Plenum V			Rzepka / Lang
14:20	P14		Albrecht
14:45	P15		Liu
15:10	P16		Wondrak
15:35	P17		Alsem
16:00		Closure

Overview Programme

13:00

13:10

Vice President, Fraunhofer Society, Munich

CALCE, University of Maryland, College Park, USA

New methods to predict reliability of electronics

1 Lawrence Berkeley National Laboratory, Berkeley

Key-note

EMPA, Materials Science & Technology, Dübendorf, Switzerland

AMRDEC, Redstone Arsenal, USA

1 Philips Applied Technologies, Eindhoven

2 Delft University of Technology

3 NXP Semiconductors, Nijmegen, The Netherlands

1 Politecnico di Milano

System integration on wafer level – Requirements and technical solutions

¹ Lawrence Berkeley National Laboratory, Berkeley

¹ Philips Applied Technologies, Eindhoven

² Delft University of Technology

³ NXP Semiconductors, Nijmegen, The Netherlands

¹ Politecnico di Milano